Data Sheet AS5215 Programmable 360º Magnetic Angle Encoder with Buffered SINE & COSINE Output Signals 1 General Description The AS5215 is a redundant, contactless rotary encoder sensor for accurate angular measurement over a full turn of 360º and over an extended ambient temperature range of -40ºC to +150ºC. Based on an integrated Hall element array, the angular position of a simple two-pole magnet is translated into analog output voltages. The angle information is provided by means of buffered sine and cosine voltages. This approach gives maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various applications in terms of speed and accuracy. 2 Key Features Contactless angular position encoding High precision analog output Buffered Sine and Cosine signals SSI Interface Low power mode Two programmable output modes: Differential or Single ended Wide magnetic field input range: 20 – 80 mT With two independent dies in one package, the device offers true redundancy. Usually the bottom die, which is exposed to slightly less magnetic field is employed for plausibility check. Wide temperature range: -40ºC to +150ºC An SSI Interface is implemented for signal path configuration as well as a one time programmable register block (OTP), which allows the customer to adjust the signal path gain to adjust for different mechanical constraints and magnetic field. Thin punched 32-pin QFN (7x7mm) package Fully automotive qualified to AEC-Q100, grade 0 3 Applications The AS5215 is ideal for Electronic Power Steering systems and general purpose for automotive or industrial applications in microcontroller-based systems. Figure 1. AS5215 Block Diagram PROG AS5215 OTP Register Digital Part CS DCLK DIO SSI Interface POWER MANAGEMENT BUFFER Stage VDD VSS SINP/SINN SINN/SINP/CM_SIN BUFFER Stage Hall Array & Frontend Amplifier COSP/COSN COSN/COSP/CM_COS Note: This Block Diagram presents only one die. www.austriamicrosystems.com/AS5215 Revision 1.8 1 - 24 AS5215 Data Sheet - C o n t e n t s Contents 1 General Description .................................................................................................................................................................. 1 2 Key Features............................................................................................................................................................................. 1 3 Applications............................................................................................................................................................................... 1 4 Pin Assignments ....................................................................................................................................................................... 3 4.1 Pin Descriptions.................................................................................................................................................................................... 3 5 Absolute Maximum Ratings ...................................................................................................................................................... 5 6 Electrical Characteristics........................................................................................................................................................... 6 6.1 Timing Characteristics .......................................................................................................................................................................... 7 7 Detailed Description.................................................................................................................................................................. 8 7.1 Magnet Diameter and Vertical Distance ............................................................................................................................................... 8 7.1.1 7.1.2 7.1.3 7.1.4 7.1.5 7.1.6 The Linear Range ........................................................................................................................................................................ 8 Magnet Thickness...................................................................................................................................................................... 11 Axial Distance (Airgap) .............................................................................................................................................................. 12 Angle Error vs. Radial and Axial Misalignment.......................................................................................................................... 12 Mounting the Magnet ................................................................................................................................................................. 12 Summary ................................................................................................................................................................................... 14 8 Application Information ........................................................................................................................................................... 15 8.1 Sleep Mode ........................................................................................................................................................................................ 15 8.2 SSI Interface....................................................................................................................................................................................... 15 8.3 Device Communication / Programming .............................................................................................................................................. 16 8.4 Waveform – Digital Interface at Normal Operation Mode................................................................................................................... 18 8.5 Waveform – Digital Interface at Extended Mode ................................................................................................................................ 18 8.6 Waveform – Digital Interface at Analog Readback of the Zener Diodes ............................................................................................ 19 8.7 EasyZapp OTP Content ..................................................................................................................................................................... 19 8.8 Analog Sin/Cos Outputs with External Interpolator ............................................................................................................................ 20 8.9 OTP Programming.............................................................................................................................................................................. 21 9 Package Drawings and Markings ........................................................................................................................................... 22 10 Ordering Information............................................................................................................................................................. 24 www.austriamicrosystems.com/AS5215 Revision 1.8 2 - 24 AS5215 Data Sheet - P i n A s s i g n m e n t s 4 Pin Assignments NC NC VDD_1 VDD_2 DCLK_1 DCLK_2 CS_1 CS_2 Figure 2. Pin Assignments (Top View) 32 31 30 29 28 27 26 25 DIO_1 1 24 NC DIO_2 2 23 NC TC_1 3 22 NC TC_2 4 21 NC A_TST_1 5 20 NC A_TST_2 6 19 NC PROG_1 7 18 COSN_2 / COSP_2 / CM_COS_2 PROG_2 8 17 COSP_2 / COSN_2 COSN_1 / COSP_1 / CM_COS_1 COSP_1 / COSN_1 SINN_2 / SINP_2 / CM_SIN_2 SINP_2 / SINN_2 VSS_2 SINN_1 / SINP_1 / CM_SIN_1 10 11 12 13 14 15 16 SINP_1 / SINN_1 9 VSS_1 AS5215 4.1 Pin Descriptions Table 1. Pin Descriptions Pin Name Pin Number DIO_1 1 DIO_2 2 TC_1 3 TC_2 4 A_TST_1 5 A_TST_2 6 PROG_1 7 PROG_2 8 www.austriamicrosystems.com/AS5215 Description Data I/O for digital interface Test coil Analog test pin OTP Programming Pad Revision 1.8 3 - 24 AS5215 Data Sheet - P i n A s s i g n m e n t s Table 1. Pin Descriptions Pin Name Pin Number VSS_1 9 VSS_2 10 SINP_1 / SINN_1 11 Switchable buffered analog output SINN_1 / SINP_1 / CM_SIN_1 12 Switchable buffered analog or common mode output SINP_2 / SINN_2 13 Switchable buffered analog output SINN_2 / SINP_2 / CM_SIN_2 14 Switchable buffered analog or common mode output COSP_1 / COSN_1 15 Switchable buffered analog output COSN_1 / COSP_1 / CM_COS_1 16 Switchable buffered analog or common mode output COSP_2 / COSN_2 17 Switchable buffered analog output COSN_2 / COSP_2 / CM_COS_2 18 Switchable buffered analog or common mode output NC 19 NC 20 NC 21 NC 22 NC 23 NC 24 NC 25 NC 26 VDD_1 27 VDD_2 28 DCLK_1 29 DCLK_2 30 CS_1 31 CS_2 32 www.austriamicrosystems.com/AS5215 Description Supply ground ------ Digital + analog supply Clock input for digital interface Clock input for digital interface Revision 1.8 4 - 24 AS5215 Data Sheet - A b s o l u t e M a x i m u m R a t i n g s 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings Parameter Min Max Units Supply voltage (VDD) -0.3 7 V Input pin voltage (V_in) VSS - 0.5 7 V Input current (latchup immunity), I_scr -100 Comments 100 mA Norm: EIA/JESD78 Class II Level A Electrostatic discharge (ESD) ±2 kV Norm: JESD22-A114E Total power dissipation (Ptot) 275 mW Package thermal resistance (Θ_JA) 27 ºC/W 150 ºC Storage temperature (T_strg) -65 Package body temperature (T_body) Humidity non-condensing www.austriamicrosystems.com/AS5215 5 Velocity =0; Multi Layer PCB; Jedec Standard Testboard 260 ºC Norm: IPC/JEDEC J-STD-020C. The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for NonHermetic Solid State Surface Mount Devices”. The lead finish for Pb-free leaded packages is matte tin (100% Sn). 85 % MSL = 3 Revision 1.8 5 - 24 AS5215 Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s 6 Electrical Characteristics Unless otherwise noted all in this specification defined tolerances of parameters are assured over the whole operation conditions range and also over lifetime. Table 3. Operating Conditions Symbol Parameter VDD Positive Supply Voltage VSS T_amb Condition Min Typ Max Unit 4.5 5.5 V Negative Supply Voltage 0.0 0.0 V Ambient temperature -40 150 ºC Max Unit Table 4. DC/AC Characteristics for Digital Inputs and Outputs Symbol Parameter Condition Min Typ CMOS Input V_IH High level Input voltage 0.7 * VDD VDD + 0.5 V V_IL Low level Input Voltage VDD 0.5 VDD + 0.5 V I_LEAK Input Leakage Current 1 µA CMOS Output V_OH High level Output voltage 4 mA V_OL Low level Output Voltage 4 mA C_L VDD 0.5 V VSS + 0.4 V Capacitive Load 35 pF t_slew Slew Rate 30 ns t_delay Time Rise Fall 15 ns Tristate Leakage Current 1 µA Max Unit CMOS Output Tristate I_OZ Table 5. Magnetic Input Specification Symbol Parameter Condition Min Typ 4 6 50 Two pole cylindrical magnet, diametrically magnetized: dMAG Diameter Bpp Magnetic input field amplitude 200 – 800 Gauss 20 frot Rotational speed Max 30000 RPM 0 Condition Min mm 80 mt 500 Hz Typ Max Unit 200 500 700 µs 22 30 µs Table 6. Electrical System Specifications Symbol Parameter tpower_on Power up time tprop Propagation delay -40 to 150ºC 18 M Magnetic Sensitivity 1G = 0.1 mT 1 6 mV/G Vout Analog output range Vss+ 0.25 Vdd0.5 V SF=SF25C - (AP1_1/ AP2_1) Amplitude ratio tracking accuracy over temperature -1 +1 % www.austriamicrosystems.com/AS5215 -40 to 150ºC Revision 1.8 6 - 24 AS5215 Data Sheet - E l e c t r i c a l C h a r a c t e r i s t i c s Table 6. Electrical System Specifications Symbol Parameter SF=AP1_ 1/AP2_1 Amplitude ratio mismatch at room temperature Voffset1 Condition Typ -2 DC Offset Ratiometric to VDD DCoffdrift DC Offset Drift -40 to 150ºC THD Total Harmonic Distortion SR Slew Rate CLOAD Capacitive Load Voffset2 Min Max Unit 2 % 0.294 0.3 0.306 V / VDD 0.49 0.5 0.51 V / VDD +50 µV/ºC 0.2 % -50 1 V/µs 1000 pF Max Unit 6.1 Timing Characteristics Table 7. Timing Characteristics Symbol Parameter Condition Min Typ t1_3 Chip select to positive edge of DCLK 30 - ns t2_3 Chip select to drive bus externally 0 - ns t3 Setup time command bit Data valid to positive edge of DCLK 30 - ns t4 Hold time command bit Data valid after positive edge of DCLK 15 - ns t5 Float time Positive edge of DCLK for last command bit to bus float - DCLK/ 2+0 ns t6 Bus driving time Positive edge of DCLK for last command bit to bus drive DCLK/ 2+0 - ns t7 Data valid time Positive edge of DCLK to bus valid DCLK/ 2+0 DCLK/ 2+30 ns t8 Hold time data bit Data valid after positive edge of DCLK DCLK/ 2+0 - ns t9_3 Hold time chip select Positive edge DCLK to negative edge of chip select DCLK/ 2+0 - ns t10_3 Bus floating time Negative edge of chip select to float bus - 30 ns t11 Setup time data bit at write access Data valid to positive edge of DCLK 30 - ns t12 Hold time data bit at write access Data valid after positive edge of DCLK 15 - ns - 30 ns t13_3 Bus floating time Negative edge of chip select to float bus Remark: The digital interface will be reset during the low phase of the CS signal. www.austriamicrosystems.com/AS5215 Revision 1.8 7 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n 7 Detailed Description The AS5215 is a redundant rotary encoder sensor front end. Based on an integrated Hall element array, the angular position of a simple two-pole magnet is translated into analog output voltages. The angle information is provided by means of sine and cosine voltages. This approach gives maximum flexibility in system design, as it can be directly integrated into existing architectures and optimized for various applications in terms of speed and accuracy. With two independent dies in one package, the device offers true redundancy. Usually the bottom die, which is exposed to slightly less magnetic field is employed for plausibility check. An SSI (SPI standard) protocol is implemented for internal test access to the different circuit blocks and for signal path configuration. A One Time Programmable register block (OTP) allows the customer to adjust the signal path gain to adjust for different mechanical constraints and magnetic field strengths. Furthermore, for internal use, the test mode can be enabled and the system oscillator is trimmable, DC offset of the output signal can be set to either 1.5V or 2.5V. A unique chip ID is stored to ensure traceability. For operating point control, a band gap circuit is implemented together with a central bias block to distribute all reference bias currents for the analog signal conditioning. The digital signal part is based on a 2MHz system, CLK derived via. divider from a 4MHz system oscillator. Figure 3. Typical Arrangement of AS5215 and Magnet 7.1 Magnet Diameter and Vertical Distance Note: Following is just an abstract taken from the elaborate application note on the Magnet. For more detailed information, please visit our homepage www.austriamicrosystems.com → Magnetic Rotary Encoders → Magnet Application Notes 7.1.1 The Linear Range The Hall elements used in the AS5000-series sensor ICs are sensitive to the magnetic field component Bz, which is the magnetic field vertical to the chip surface. Figure 4 shows a 3-dimensional graph of the Bz field across the surface of a 6mm diameter, cylindrical NdFeB N35H magnet at an axial distance of 1mm between magnet and IC. The highest magnetic field occurs at the north and south poles, which are located close to the edge of the magnet, at ~2.8mm radius (see Figure 5). Following the poles towards the center of the magnet, the Bz field decreases very linearly within a radius of ~1.6mm. This linear range is the operating range of the magnet with respect to the Hall sensor array on the chip. For best performance, the Hall elements should always be within this linear range. www.austriamicrosystems.com/AS5215 Revision 1.8 8 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n Figure 4. 3D-Graph of Vertical Magnetic Field of a 6mm Cylindrical Magnet BZ; 6mm magnet @ Z=1mm area of X- Y-misalignment from center: ±0.5mm circle of Hall elements on chip Bz [mT] Y -displacement [mm] X -displacement [mm] As shown in Figure 5 (grey zone), the Hall elements are located on the chip at a circle with a radius of 1mm. Since the difference between two opposite Hall sensors is measured, there will be no difference in signal amplitude when the magnet is perfectly centered or if the magnet is misaligned in any direction as long as all Hall elements stay within the linear range. www.austriamicrosystems.com/AS5215 Revision 1.8 9 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n For the 6mm magnet (shown in Figure 5), the linear range has a radius of 1.6mm, hence this magnet allows a radial misalignment of 0.5mm (1.6mm linear range radius; 1mm Hall array radius). Consequently, the larger the linear range, the more radial misalignment can be tolerated. By contrast, the slope of the linear range decreases with increasing magnet diameter, as the poles are further apart. A smaller slope results in a smaller differential signal, which means that the magnet must be moved closer to the IC (smaller airgap) or the amplification gain must be increased, which leads to a poorer signal-to-noise ratio. More noise results in more jitter at the angle output. A good compromise is a magnet diameter in the range of 5…8mm. Small Diameter Magnet (<6mm) Large Diameter Magnet (>6mm) + stronger differential signal = good signal / noise ratio, larger airgaps + wider linear range = larger horizontal misalignment area - shorter linear range = smaller horizontal misalignment area - weaker differential signal = poorer signal / noise ratio, smaller airgaps Figure 5. Vertical Magnetic Field Across the Center of a Cylindrical Magnet Bz [mT] Bz; 6mm magnet @ y=0; z=1mm Hall elements (side view) X -displacement [mm] www.austriamicrosystems.com/AS5215 Revision 1.8 10 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n 7.1.2 Magnet Thickness Figure 6 shows the relationship of the peak amplitude in a rotating system (essentially the magnetic field strength of the Bz field component) in relation to the thickness of the magnet. The X-axis shows the ratio of magnet thickness (or height) [h] to magnet diameter [d] and the Y-axis shows the relative peak amplitude with reference to the recommended magnet (d=6mm, h=2.5mm). This results in an h/d ratio of 0.42. Figure 6. Relationship of Peak Amplitude vs. Magnet Thickness Bz amplitude vs. magnet thickness of a cylindrical diametric magnet with 6mm diameter 160% Relative peak amplitude [%] 140% 120% 100% 80% 60% d= 6mm x h= 2.5mm ref. magnet: h/d = 0.42 Rel. amplitude = 100% 40% 20% 0% 0,0 0,2 0,4 0,6 0,8 1,0 1,2 1,4 1,6 1,8 thickness to diameter [h/d] ratio As the graph in Figure 6 shows, the amplitude drops significantly at h/d ratios below this value and remains relatively flat at ratios above 1.3. Therefore, the recommended thickness of 2.5mm (at 6mm diameter) should be considered as the low limit with regards to magnet thickness. It is possible to get 40% or more signal amplitude by using thicker magnets. However, the gain in signal amplitude becomes less significant for h/ d ratios >~1.3. Therefore, the recommended magnet thickness for a 6mm diameter magnet is between 2.5 and ~8 mm. www.austriamicrosystems.com/AS5215 Revision 1.8 11 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n 7.1.3 Axial Distance (Airgap) Figure 7. Sinusoidal Magnetic Field Generated by the Rotating Magnet B vertical field 0 360º The recommended magnetic field, measured at the chip surface on a radius equal to the Hall sensor array radius (typ 1mm) should be within a certain range. This range lies between 45 and 75mT or between 20 and 80mT, depending on the encoder product. Linear position sensors are more sensitive as they use weaker magnets. The allowed magnetic range lies typically between 5 and 60mT. 7.1.4 Angle Error vs. Radial and Axial Misalignment The angle error is the deviation of the actual angle vs. the angle measured by the encoder. There are several factors in the chip itself that contribute to this error, mainly offset and gain matching of the amplifiers in the analog signal path. On the other hand, there is the nonlinearity of the signals coming from the Hall sensors, caused by misalignment of the magnet and imperfections in the magnetic material. Ideally, the Hall sensor signals should be sinusoidal, with equal peak amplitude of each signal. This can be maintained, as long as all Hall elements are within the linear range of the magnetic field Bz (see Figure 5). 7.1.5 Mounting the Magnet Generally, for on-axis rotation angle measurement, the magnet must be mounted centered over the IC package. However, the material of the shaft into which the magnet is mounted, is also of big importance. Magnetic materials in the vicinity of the magnet will distort or weaken the magnetic field being picked up by the Hall elements and cause additional errors in the angular output of the sensor. Figure 8. Magnetic Field Lines in Air Figure 8 shows the ideal case with the magnet in air. No magnetic materials are anywhere nearby. www.austriamicrosystems.com/AS5215 Revision 1.8 12 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n Figure 9. Magnetic Field Lines in Plastic or Copper Shaft If the magnet is mounted in non-magnetic material, such as plastic or diamagnetic material, such as copper, the magnetic field distribution is not disturbed. Even paramagnetic material, such as aluminium may be used. The magnet may be mounted directly in the shaft (see Figure 9). Note: Stainless steel may also be used, but some grades are magnetic. Therefore, steel with magnetic grades should be avoided. Figure 10. Magnetic Field Lines in Iron Shaft If the magnet is mounted in a ferromagnetic material, such as iron, most of the field lines are attracted by the iron and flow inside the metal shaft (see Figure 10). The magnet is weakened substantially. This configuration should be avoided! www.austriamicrosystems.com/AS5215 Revision 1.8 13 - 24 AS5215 Data Sheet - D e t a i l e d D e s c r i p t i o n Figure 11. Magnetic Field Lines with Spacer Between Magnet and Iron Shaft If the magnet has to be mounted inside a magnetic shaft, a possible solution is to place a non-magnetic spacer between shaft and magnet, as shown in Figure 11. While the magnetic field is rather distorted towards the shaft, there are still adequate field lines available towards the sensor IC. The distortion remains reasonably low. 7.1.6 Summary Small diameter magnets (<6mm Ø) have a shorter linear range and allow less lateral misalignment. The steeper slope allows larger axial distances. Large diameter magnets (>6 mm Ø) have a wider linear range and allow a wider lateral misalignment. The flatter slope requires shorter axial distances. The linear range decreases with airgap; Best performance is achieved at shorter airgaps. The ideal vertical distance range can be determined by using magnetic range indicators provided by the encoder ICs. These indicators are named MagInc, MagDec, MagRngn, or similar, depending on product. www.austriamicrosystems.com/AS5215 Revision 1.8 14 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8 Application Information 8.1 Sleep Mode The target is to provide the possibility to reduce the total current consumption. No output signal will be provided when the IC is in sleep mode. Enabling or disabling sleep mode is done by sending the SLEEP or WAKEUP commands via. the SSI interface. Analog blocks are powered down with respect to fast wake up time. 8.2 SSI Interface The setup for the device is handled by the digital interface. Each communication starts with the rising edge of the chip select signal. The synchronization between the internal free running analog clock oscillator and the external used digital clock source for the digital interface is done in a way that the digital clock frequency can vary in a wide range. Table 8. SSI Interface Pin Description Port Symbol Chip select CS DCLK DCLK Bidirectional data input output DIO Function Indicates the start of a new access cycle to the device CS = LO → reset of the digital interface Clock source for the communication over the digital interface Command and data information over one single line The first bit of the command defines a read or write access Table 9. SSI Interface Parameter Description Symbol Parameter f_DCLK Clock frequency at normal operation f_EZ_RW Clock frequency at easy zap read write access Notes The nominal value for the clock frequency can be derived from a 10MHz oscillator source. f_EZ_PR OG Correct access to the programmable zener diode block needs a strict timing – the zap pulse is exact one period. Clock frequency at easy zap access program OTP The nominal value for the clock frequency can be derived from a 10MHz oscillator source. f_EZ_AR B Clock frequency at easy zap analog readback Min Typ Max Unit no limit 5 6 MHz no limit 5 6 kHz 200 - 650 kHz no limit 156.3 162.5 kHz 20pF external load allowed. The nominal value for the clock frequency can be derived from a 10MHz oscillator source. Interface General at normal mode Protocol: 5 command bit + 16 data input output Command 5 bit command: cmd<4:0> ← bit<21:16> Data 16 bit data: data<15:0> ← bit<15:0> Interface General at extended mode Protocol: 5 command bit + 33 data input output Command 5 bit command: cmd<4:0> ← bit<38:34> Data 34 bit data: data<33:0> ← bit<33:0> Interface Modes Normal read operation mode cmd<4:0> = <00xxx> → 1 DCLK per data bit Extended read operation mode cmd<4:0> = <01xxx> → 4 DCLK per data bit Normal write operation mode cmd<4:0> = <10xxx> → 1 DCLK per data bit Extended write operation mode cmd<4:0> = <11xxx> → 4 DCLK per data bit www.austriamicrosystems.com/AS5215 Revision 1.8 15 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8.3 Device Communication / Programming Table 10. Digital Interface at Normal Mode # command bin mode 15 14 23 WRITE CONFIG 1 13 10111 write go2sleep gen_rst 16 EN_PROG 10000 write 1 0 12 11 10 9 8 analog_sig 0 0 1 1 Name 7 6 5 4 3 2 1 0 1 0 1 0 1 1 1 0 OB_bypassed 0 0 Functionality go2sleep Enter/leave low power mode (no output signals) gen_rst Generates global reset analog_sig Switches the channels to the test bus after the PGA OB_bypassed Disable and bypass output buffer for testing purpose Table 11. Digital Interface at Extended Mode Factory Settings # bin mode 31 WRITE OTP 11111 25 PROG_OTP 15 RD_OTP 9 command RD_OTP_ANA <45:44> <43: 26> <25:23> xt write otp test ID 11001 xt write otp test 01111 xt read otp test 01001 xt read <22:2 0> User Settings <19:1 8> <17:1 4> <13> <12> <11> <10> <9> <8:7> <6> <5:0> 10µbiastrim vref osc lock_O TP n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias ID 10µbiastrim vref osc lock_O TP n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias ID 10µbiastrim vref osc lock_O TP n.c. invert_ channel cm_sin cm_cos gain dc_ offset hall_ bias Remark: 1. Send EN PROG (command 16) in normal mode before accessing the OTP in extended mode. 2. OTP assignment will be defined/updated. Name Otp_test Functionality Dummy fuse bit used in production test ID Part identification n.c. Not connected 10µbiastrim 10µ bias current trim bits vref Bias Block reference voltage trim bits osc Oscillator trimming bits lock_OTP invert_channel To disable the programming of the factory bits <45…14> Inverts SIN and COS channel before the PGA for inverted output function (0...SIN/COS, 1...SINN/ COSN) cm_sin Common mode voltage output enabled at SINN / CM pin (0...differential, 1...common) cm_cos Common mode voltage output enabled at COSN / CM pin (0...differential, 1...common) gain dc_offset Hall_b www.austriamicrosystems.com/AS5215 PGA gain setting (influences overall magnetic sensitivity), 2bit Output DC offset (0…1.5V, 1…2.5V) Hall bias setting (influences overall magnetic sensitivity), 6bit Revision 1.8 16 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n Figure 12. Sensitivity Gain Settings - Relative Sensitivity in % Magnetic Sensitivity vs. OTP Hall Current & PGA Gain Setting 600 550 Relative Sensitivity in % 500 450 400 M_PGA_00 350 M_PGA_01 M_PGA_10 300 M_PGA_11 250 200 150 100 0 10 20 30 40 50 60 Hall Current OTP setting (6 bits) The amplitude of the output signal is programmable via sensitivity (6bit) and/or gain (2bit) settings (see Figure 12). Figure 13. Sensitivity Gain Settings - Sensitivity [mV/mT] Magnetic Sensitivity vs. OTP Hall Current & PGA Gain Setting 70 60 Sensitivity [mV/mT] 50 M_PGA_00 40 M_PGA_01 M_PGA_10 30 M_PGA_11 20 10 0 0 10 20 30 40 50 60 Hall Current OTP setting (6 bits) www.austriamicrosystems.com/AS5215 Revision 1.8 17 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8.4 Waveform – Digital Interface at Normal Operation Mode Figure 14. Digital Interface at Normal Operation Mode CMD_PHASE DATA_PHASE DCLK t9_3 t1_3 CS t5 t2_3 DIO CMD4 t3 t4 DIO CMD3 CMD2 CMD1 CMD0 t7 t6 t8 D14 D15 D13 t13_3 t12 D15 D14 READ D0 t11 DIO CMD t10_3 D13 WRITE D0 8.5 Waveform – Digital Interface at Extended Mode In the extended mode, the digital interface needs four clocks for one data bit. During this time, the device is able to handle internal signals for special access (e.g. the easy zap interface). Figure 15. Digital Interface at Extended Mode CMD_PHASE DATA_PHASE DCLK t1_3 t9_3 CS DIO CMD4 t3 DIO t7 t5 t2_3 CMD3 CMD2 CMD1 CMD0 t4 D45 t11 DIO www.austriamicrosystems.com/AS5215 t10_3 t8 t6 D44 Revision 1.8 READ D0 t13_3 t12 D45 CMD D44 D0 WRITE 18 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8.6 Waveform – Digital Interface at Analog Readback of the Zener Diodes To be sure that all Zener-Diodes are correctly burned, an analog readback mechanism is defined. Perform the ‘READ OTP ANA’ sequence according to the command table and measure the value of the diode at the end of each phase. Figure 16. Digital Interface at Analog Readback of Zener Diodes CMD_PHASE DATA_PHASE_EXTENDED EXT D45 EXT D44 EXT D1 OTP D44 OTP D43 OTP D0 EXT D0 DCLK CS DIO CMD4 CMD3 CMD2 CMD1 CMD0 OTP D45 PROG perform analog measurements at PROG Table 12. Serial Bit Sequence (16-bit read / write) Write Command C4 C3 C2 C1 Read / Write Data C0 D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 8.7 EasyZapp OTP Content Each AS5215 die has an integrated 32-bit OTP ROM (Easyzapp) for trimming and configuration purposes. The PROM can be programmed via. the serial interface. For irreversible programming, an external programming voltage at PROG pin is needed. For security reasons, the factory trim bits can be locked by a lock bit. Name Bit Count OTP Start OTP End Access Comments Hall Bias 6 0 5 user Sets overall sensitivity DC offset 1 6 6 user Output DC offset setting gain 2 7 8 user Programmable gain amplifier setting Lock 1 13 13 austriamicrosystems invert_channel 1 11 11 user Inverts SIN and COS channel before the PGA for inverted output function cm_sin 1 10 10 user Common mode voltage output enabled at SINN / CM pin cm_cos 1 9 9 user Common mode voltage output enabled at COSN / CM pin Set in production test Remark: OTP assignment will be defined/updated. Note: For more information, refer to the document “IP Easyzapp Application Note Rev C”. http://intranet.office.amsiag.com/engineering/ipr/Datasheets/easyzapp_application_note_revc.pdf www.austriamicrosystems.com/AS5215 Revision 1.8 19 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8.8 Analog Sin/Cos Outputs with External Interpolator Figure 17. Sine and Cosine Outputs for External Angle Calculation +5V VDD 100k VDD D A D A D A VSS SINN_1/SINP_1/CM_SIN_1 SINP_2 / SINN_2 SINN_2/SINP_2/CM_SIN_2 AS5130 COSP_1/COSN_1 AS5215 D A Micro Controller VDD PROG SINP_1/SINN_1 100n COSN_1/COSP_1/CM_COS_1 COSP_2/COSN_2 COSN_2/COSP_2/CM_COS_2 VSS VSS Notes: 1. We recommend to use a 100k pull-up resistance. 2. Default conditions for unused pins are: DCLK_1/2, CS_1/2, DIO_1/2, TC_1/2, A_TST_1/2, TBO_1/2, TB1_1/2, TB2_1/2, TB3_1/2 connect to VSS The AS5215 provides analog Sine and Cosine outputs (SINP, COSP) of the Hall array front-end for test purposes. These outputs allow the user to perform the angle calculation by an external ADC + µC, e.g. to compute the angle with a high resolution. The output driver capability is 1mA. The signal lines should be kept as short as possible, longer lines should be shielded in order to achieve best noise performance. Through the programming of one bit, you have the possibility to choose between the analog Sine and Cosine outputs (SINP, COSP) and their inverted signals (SINN, COSN). Furthermore, by programming the bits <9:10> you can enable the common mode output signals of SIN and COS. The DC bias voltage is 1.5 or 2.5 V. www.austriamicrosystems.com/AS5215 Revision 1.8 20 - 24 AS5215 Data Sheet - A p p l i c a t i o n I n f o r m a t i o n 8.9 OTP Programming Figure 18. OTP Programming Connection +5V VDD VDD Output CS_1 Output DCLK_1 VDD CS_2 Output DCLK_2 I/O Micro Controller AS5130 DIO_2 8.0 - 8.5V + VSS AS5215 DIO_1 I/O Output 100n PROG 10µF 100n VSS - VSS maximum parasitic cable inductance VSUPPLY L<50nH Vzapp VDD Vprog C1 C2 100nF 10µF PROG GND PROM Cell For programming of the OTP, an additional voltage has to be applied to the pin PROG. It has to be buffered by a fast 100nF capacitor (ceramic) and a 10µF capacitor. The information to be programmed is set by command 25. The OTP bits 16 until 45 are used for AMS factory trimming and cannot be overwritten. Symbol Parameter Min Max Unit VDD Supply Voltage 5 5.5 V GND Ground level 0 0 V V_zapp Programming Voltage 8 8.5 V T_zapp Temperature 0 85 ºC f_clk CLK Frequency 100 kHz Note At pin PROG At pin DCLK Remark: For normal operation, after programming, apply 100k pull up resistor at PROG pin! www.austriamicrosystems.com/AS5215 Revision 1.8 21 - 24 AS5215 Data Sheet - P a c k a g e D r a w i n g s a n d M a r k i n g s 9 Package Drawings and Markings The devices are available in a 32-pin QFN (7x7mm) package. Figure 19. 32-pin QFN (7x7mm) Package AS5215 17919-001 AYWWIZZ 25 32 24 1 8 17 16 9 Note: The distance between both dies is 150µm. Table 13. Package Dimensions Symbol D E D1 E1 L b e A A1 Min 4.18 4.18 0.45 0.25 0.80 www.austriamicrosystems.com/AS5215 mm Typ 7 BSC 7 BSC 4.28 4.28 0.55 0.30 0.65 BSC 0.90 0.203 REF Max Min 4.38 4.38 0.65 0.35 0.165 0.165 0.018 0.010 1.00 0.031 Revision 1.8 inch Typ 0.28 BSC 0.28 BSC 0.169 0.169 0.022 0.012 0.026 BSC 0.035 0.008 REF Max 0.172 0.172 0.026 0.014 0.039 22 - 24 AS5215 Data Sheet - R e v i s i o n H i s t o r y Revision History Revision 1.0 Date Owner Description April 29, 2008 Initial revision July 03, 2008 Redundancy Coding topic deleted. 1.1 July 15, 2008 Updated Key Features, Table 1 - Pin Descriptions, Figure 1 and Figure 17. 1.2 July 14, 2009 Updated min, typ, max values for ‘Power up time’ parameter in Table 6. July 31, 2009 Updated the following parameters in Table 6: - Values and conditions updated for 1. Propagation delay 2. Amplitude ratio tracking accuracy over temperature 3. DC Offset Drift - Deleted the ‘Output Offset’ parameter from the table. 1.3 apg Aug 24, 2009 Updated following bits related information on page 16 - invert_channel, cm_sin, cm_cos, gain, dc_offset, Hall_b 1.4 Aug 26, 2009 Inserted Figure 12 and updated Applications and Figure 17. 1.5 Sept 01, 2009 Inserted Figure 13, Added a note in Package Drawings and Markings. 1.6 Sept 02, 2009 Deleted ‘Displacement’ parameter from Table 5. 1.7 Nov 26, 2009 Hall Array Radius value updated from 1.1mm to 1mm Updated Figure 13 1.8 Dec 11, 2009 Updated values for ‘Magnetic Sensitivity’ parameter in Table 6. Note: Typos may not be explicitly mentioned under revision history. www.austriamicrosystems.com/AS5215 Revision 1.8 23 - 24 AS5215 Data Sheet - O r d e r i n g I n f o r m a t i o n 10 Ordering Information The devices are available as the standard products shown in Table 14. Table 14. Ordering Information Ordering Code Description Delivery Form Package AS5215-HQFT Sine and cosine analog output magnetic rotary encoder Tape & Reel 32-pin QFN (7x7mm) Note: All products are RoHS compliant and Pb-free. Buy our products or get free samples online at ICdirect: http://www.austriamicrosystems.com/ICdirect For further information and requests, please contact us mailto:[email protected] or find your local distributor at http://www.austriamicrosystems.com/distributor Copyrights Copyright © 1997-2009, austriamicrosystems AG, Tobelbaderstrasse 30, 8141 Unterpremstaetten, Austria-Europe. Trademarks Registered ®. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Disclaimer Devices sold by austriamicrosystems AG are covered by the warranty and patent indemnification provisions appearing in its Term of Sale. austriamicrosystems AG makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. austriamicrosystems AG reserves the right to change specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with austriamicrosystems AG for current information. This product is intended for use in normal commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by austriamicrosystems AG for each application. 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Contact Information Headquarters austriamicrosystems AG Tobelbaderstrasse 30 A-8141 Unterpremstaetten, Austria Tel: +43 (0) 3136 500 0 Fax: +43 (0) 3136 525 01 For Sales Offices, Distributors and Representatives, please visit: http://www.austriamicrosystems.com/contact www.austriamicrosystems.com/AS5215 Revision 1.8 24 - 24