BEREX BT301_1

BT301 500‐4000 MHz High Power Amplifier Device Features 
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OIP3 = 49.0 dBm @ 1900 MHz Gain = 12.5 dB @ 1900 MHz Output P1 dB = 30.3 dBm @ 1900 MHz 50 Ω Cascadable Patented Over Voltage Protec on Circuit Lead‐free/RoHS‐compliant SOIC 8 SMT package YY = Year, WW = Work week, XX = Wafer Number Product Descrip on Typical Performance1 BeRex’s BT301 is a high power and a high dynamic range amplifier in a low cost sur‐
face mount package(SOIC‐8) with a RoHS‐
compliant, that incorporates reliable hetero‐
junc on‐bipolar‐transistor (HBT) devices fabricated with InGaP GaAs technology. This device is designed for use where high linearity is required and features high OIP3 and Power with low consump on current
(350mA) and requires a few external match‐
ing components such as a DC blocking ca‐
pacitors on the In/Output pin, a bypass ca‐
pacitor and a RF choke for the out port. All devices are 100% RF/DC tested. Parameter Frequency Unit 900 1900 2140 2450 MHz Gain 18.5 12.5 11.5 10.5 dB S11 S22 ‐15.0 ‐7.0 ‐18.0 ‐12.0 ‐18.0 ‐12.0 ‐12.0 ‐11.0 dB dB OIP32 P1dB 49.0 29.5 22.5 ‐ 8.5 49.0 30.3 22.5 ‐ 8.6 47.0 30.3 ‐ 21.0 7.5 49.0 30.3 ‐ 21.0 7.5 dBm dBm dBm dBm dB IS‐95C ACPR WCDMA ACLR Noise Figure Device performance _ measured on a BeRex evalua
1 on board at 25°C, 50 Ω system. 2
OIP3 _ measured with two tones at an output of 16 dBm per tone separated by 1 MHz. *ACPR&ACLR CH Power _ measured at 50dBc. *ACPR Test set‐up: IS‐95 CDMA, 9Ch. FWD, +885KHz offset. *ACLR Test set‐up: 3GPP WCDMA, TM1+64DPCH, +5MHz offset. Applica ons  Base sta on Infrastructure/RFID Bandwidth  Commercial/Industrial/Military wireless system IC @ (Vc = 5V) VC Applica on Circuits RTH Min. 500 310 Typical Max. 4000 350 390 5.0 19.6 Unit MHz mA V °C/W Absolute Maximum Ra ngs *external matching circuit: refer to the page 4 to 11. Parameter Opera ng Case Temperature Storage Temperature Junc on Temperature Opera ng Voltage Supply Current Input RF Power Ra ng ‐40 to +85 ‐55 to +155 +220 +6.0 600 28 Unit °C °C °C V mA dBm *Opera on of this device above any of these parameters may result in permanent damage. 1 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier V‐I Characteris cs BeRex SOT89 Evalua on Board *Dielectric constant _ 4.2 *RF pa
ern width 52mil *31mil thick FR4 PCB
Typical Device Data S‐parameters (Vc=5V, Ic=340mA, T=25°C) 2 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier S‐Parameter (Vdevice = 5.0V, Icc = 340mA, T = 25 °C, calibrated to device leads) Freq [MHz] 100 500 1000 1500 2000 2500 3000 3500 4000 S11 [Mag] S11 [Ang] 0.842 0.895 0.893 0.870 0.852 0.840 0.841 0.850 0.879 ‐178.0 157.3 130.8 106.2 82.2 58.8 35.6 12.5 ‐6.4 S21 [Mag] 11.489 4.894 2.766 1.658 1.512 1.047 0.888 0.840 0.542 S21 [Ang] 131.4 104.8 83.9 75.1 64.0 47.2 50.8 36.8 24.0 S12 [Mag] S12 [Ang] 0.019 0.023 0.022 0.025 0.027 0.026 0.029 0.031 0.031 18.2 10.6 9.8 21.7 21.5 21.6 16.4 23.4 16.3 S22 [Mag] 0.534 0.659 0.754 0.773 0.761 0.773 0.792 0.659 0.634 S22 [Ang] ‐134.7 ‐176.7 160.4 139.8 120.1 101.7 83.2 62.6 41.3 3 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Applica on Circuit: 900 MHz Schema c Diagram BOM C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 PCB Diagram 10uF 1.0nF 100pF 3pF 100pF 4.7pF 5.0pF 2.7pF 12ohm 56nH 4.7nH Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% No ce 1. PCB: 31mil thick FR4 2. Distance between the center of the shunt Induc‐
tor(C6) and the input pin of BT301 _ 5.6 mm. 3. Distance between the center of the shunt cap.
(C7) and the output pin of BT301 _ 12 mm. ※ BT301 with both input and output ports opened simultaneously may cause instability. Please See an applica on note or contact company for applica on support. 4 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Typical Performance 5 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Typical Performance 6 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Applica on Circuit: 1900 MHz Schema c Diagram BOM C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 PCB Diagram 10uF 1nF 100pF 100pF 100pF 3pF 2.5pF 2.5pF 12 ohm 56nH 6.8nH Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% No ce 1. PCB: 31mil thick FR4 2. Distance between the center of the series cap.
(C8) and the input pin of BT301 _ 1.6 mm. 3. Distance between the center of the shunt cap.
(C6) and the input pin of BT301 _ 4.0 mm. 4. Distance between the center of the shunt cap.
(C7) and the output pin of BT301 _ 2.5 mm. 7 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Typical Performance 8 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier 9 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Applica on Circuit: 2140MHz Schema c Diagram BOM C1 C2 C3 C4 C5 C6 C7 C8 C9 R1 L1 L2 PCB Diagram 10uF 1nF 100pF 100pF 100pF 2.5pF 1.8pF 1.8pF 5.0pF 12 ohm 56nH 4.7nH Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% No ce 1. PCB: 31mil thick FR4 2. Distance between the center of the shunt cap.
(C8) and the input pin of BT301 _ 1.6 mm. 3. Distance between the center of the shunt cap.
(C6) and the input pin of BT301 _ 3.0 mm. 4. Distance between the center of the shunt cap.
(C7) and the output pin of BT301 _ 2.5 mm. 10 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Typical Performance 11 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier 12 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Applica on Circuit: 2450MHz Schema c Diagram BOM C1 C2 C3 C4 C5 C6 C7 C8 R1 L1 L2 PCB Diagram 10uF 1nF 100pF 100pF 100pF 1.5pF 1.5pF 1.8pF 12 ohm 56nH 3.9nH Tolerance ±20% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% ±5% No ce 1. PCB: 31mil thick FR4 2. Distance between the center of the series cap.
(C8) and the input pin of BT301 _ 1.6 mm. 3. Distance between the center of the shunt cap.
(C6) and the input pin of BT301 _ 3.4 mm. 4. Distance between the center of the shunt cap.
(C7) and the output pin of BT301 _ 2.0 mm. 13 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Typical Performance 14 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier 15 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Package Outline Dimension 16 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C BT301 500‐4000 MHz High Power Amplifier Suggested PCB Land Pa ern and PAD Layout PCB Land Pa ern PCB Moun ng Note : All dimension are in millimeters
PCB lay out _ on BeRex website
Lead pla ng finish 100% Tin Ma e finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Ra ng ESD Ra ng: Class 1B Value: Passes <1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22‐A114B MSL Ra ng: Level 1 at +265°C convec on reflow Standard: JEDEC Standard J‐STD‐020 NATO CAGE code: 2 N 9 6 F 17 BeRex ●website: www.berex.com ● email: [email protected] Specifica ons and informa on are subject to change and products may be discon nued without no ce. BeRex is a trademark of BeRex. All other trademarks are the property of their respec ve owners. © 2010 BeRex Rev. C