TM TAS5162 www.ti.com SLES194 – OCTOBER 2006 2 x 210 Watt STEREO DIGITAL AMPLIFIER POWER STAGE • • • • • • • • 2×165 W at 10% THD+N Into 8-Ω BTL 2×210 W at 10% THD+N Into 6-Ω BTL 1×300 W at 10% THD+N Into 4-Ω PBTL (1) >110 dB SNR (A-Weighted, TAS5518 Modulator) <0.09% THD+N at 1 W Two Thermally Enhanced Package Options: – DKD (36-pin PSOP3) – DDV (44-pin HTSSOP) High-Efficiency Power Stage (>90%) With 80-mΩ Output MOSFETs Power-On Reset for Protection on Power Up Without Any Power-Supply Sequencing Integrated Self-Protection Circuits Including Undervoltage, Overtemperature, Overload, Short Circuit Error Reporting EMI Compliant When Used With Recommended System Design Intelligent Gate Drive APPLICATIONS • • • Mini/Micro Audio System DVD Receiver Home Theater DESCRIPTION The TAS5162 is a high performance, integrated stereo digital amplifier power stage with an improved protection system. The TAS5162 is capable of driving a 6-Ω bridge-tied load (BTL) at up to 210 W per channel at THD = 10%, low integrated noise at the output, low THD+N performance without clipping, and low idle power dissipation. A low-cost, high-fidelity audio system can be built using a TI chipset, comprising a modulator (e.g., TAS5508) and the TAS5162. This system only requires a simple passive LC demodulation filter to deliver high-quality, high-efficiency audio amplification with proven EMI compliance. This device requires two power supplies, at 12 V for GVDD and VDD, and at 50V for PVDD. The TAS5162 does not require power-up sequencing due to internal power-on reset. The efficiency of this digital amplifier is greater than 90% into 6 Ω, which enables the use of smaller power supplies and heatsinks. The TAS5162 has an innovative protection system integrated on-chip, safeguarding the device against a wide range of fault conditions that could damage the system. These safeguards are short-circuit protection, overcurrent protection, undervoltage protection, and overtemperature protection. The TAS5162 has a new proprietary current-limiting circuit that reduces the possibility of device shutdown during high-level music transients. A new programmable overcurrent detector allows the use of lower-cost inductors in the demodulation output filter. BTL OUTPUT POWER vs SUPPLY VOLTAGE 10 TC = 75°C PVDD = 32 V One Channel 1 4Ω 6Ω 0.1 8Ω 0.01 1 10 100 PO − Output Power − W (1) G001 The DDV package will deliver 300 W peak; however, this is dependant on system configuration. The smaller pad area also makes the thermal interface to the heatsink more important. For multichannel systems that require two channels to be driven at full power with the DDV package option, it is recommended to design the system so that the two channels are in two separate devices. PurePath Digital™ Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PurePath Digital, PowerPad are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCT PREVIEW information concerns products in the formative or design phase of development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or discontinue these products without notice. Copyright © 2006, Texas Instruments Incorporated PRODUCT PREVIEW • • • • THD+N − Total Harmonic Distortion + Noise − % FEATURES TAS5162 www.ti.com SLES194 – OCTOBER 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. GENERAL INFORMATION Terminal Assignment The TAS5162 is available in two thermally enhanced packages: • 36-pin PSOP3 package (DKD) • 44-pin HTSSOP PowerPad™ package (DDV) Both package types contain a heat slug that is located on the top side of the device for convenient thermal coupling to the heatsink. DDV PACKAGE (TOP VIEW) DKD PACKAGE (TOP VIEW) PRODUCT PREVIEW GVDD_B OTW SD PWM_A RESET_AB PWM_B OC_ADJ GND AGND VREG M3 M2 M1 PWM_C RESET_CD PWM_D VDD GVDD_C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 GVDD_A BST_A PVDD_A OUT_A GND_A GND_B OUT_B PVDD_B BST_B BST_C PVDD_C OUT_C GND_C GND_D OUT_D PVDD_D BST_D GVDD_D P0018-01 GVDD_B OTW NC NC SD PWM_A RESET_AB PWM_B OC_ADJ GND AGND VREG M3 M2 M1 PWM_C RESET_CD PWM_D NC NC VDD GVDD_C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 GVDD_A BST_A NC PVDD_A PVDD_A OUT_A GND_A GND_B OUT_B PVDD_B BST_B BST_C PVDD_C OUT_C GND_C GND_D OUT_D PVDD_D PVDD_D NC BST_D GVDD_D P0016-02 2 Submit Documentation Feedback PACKAGE OPTION ADDENDUM www.ti.com 28-Sep-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TAS5162DDV PREVIEW HTSSOP DDV 44 35 TBD Call TI Call TI TAS5162DKD PREVIEW SSOP DKD 36 29 TBD Call TI Call TI Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Mailing Address: Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Texas Instruments Post Office Box 655303 Dallas, Texas 75265 Copyright 2006, Texas Instruments Incorporated