TRF7960/61 www.ti.com SLOS504B – AUGUST 2006 – REVISED APRIL 2007 Multi-Standard Fully Integrated 13.56-MHz Radio Frequency Identification (RFID) Analog Front End and Data Framing Reader System • FEATURES • • • • • • • • Completely Integrated Protocol Handling (OSI Model Layer 3 and Below) Separate Internal High-PSRR Power Supplies for Analog, Digital, and PA Sections Provides Noise Isolation for Superior Read Range and Reliability Dual Receiver Input With AM and PM Demodulation to Minimize Communication Holes (Patent Pending). Receiver AM and PM RSSI Reader-to-Reader Anti-Collision High Integration Reduces Total BOM and Board Area – Single External 13.56-MHz Cystal Oscillator – MCU-Selectable Clock-Fequency Output of RF, RF/2, or RF/4 – Adjustable 20-mA, High-PSRR LDO for Powering External MCU Easy to Use With High Flexibility – Auto-Configured Default Modes for Each Spported ISO Protocol – 11 User-Programmable Registers – Selectable Receiver Gain and AGC – Programmable Output Power (100 mW or 200 mW) – Adjustable ASK Modulation Range (8% to 30%) – Built-In Receiver Band-Pass Filter With User-Selectable Corner Frequencies Wide Operating Voltage Range of 2.7 V to 5.5 V • • • Ultralow-Power Modes – Power Down < 1 µA – Standby 120 µA – Active (Rx only) 10 mA Parallel 8-Bit or Serial 4-Pin SPI Interface With MCU Using 12-Byte FIFO Ultrasmall 32-Pin QFN Package (5 mm × 5 mm) Available tools – Reference Design/EVM With Development Software – Source Code Available for MSP430 APPLICATIONS • • • Secure Access Control Product Authentication – Printer Ink Cartridges – Blood Gucose Monitors Contactless Payment Systems DESCRIPTION The TRF7960/61 is an integrated analog front end and data framing system for a 13.56-MHz RFID reader system. Built-in programming options make it suitable for a wide range of applications both in proximity and vicinity RFID systems. The reader is configured by selecting the desired protocol in the control registers. Direct access to all control registers allows fine tuning of various reader parameters as needed. Table 1. PRODUCT SELECTION TABLE PROTOCOLS DEVICE TRF7960 ISO14443A/B 106 kbps 212 kbps 424 kbps 848 kbps ISO15693 ISO18000-3 Tag-it™ X X X X X X X X TRF7961 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Tag-it is a trademark of Texas Instruments Incorporated. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2007, Texas Instruments Incorporated TRF7960/61 www.ti.com SLOS504B – AUGUST 2006 – REVISED APRIL 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) SYS_CLK VDD_X Z-Matching Circuit VDD DATA_CLK Tx_Out IRQ TRF7960 Rx1_AM Rx2_PM MSP430 3 (SPI) VDD_I/O 8 (Parallel) Xtal 13.56 MHz Figure 1. Typical Application 2 EN2 25 DATA_CLK 26 SYS_CLK 27 EN 28 VSS_D 29 OSC_IN 31 OSC_OUT 30 1 VDD_A I/O_7 24 2 VIN I/O_6 23 3 VDD_RF I/O_5 22 4 VDD_PA TRF796x I/O_4 21 5 TX_OUT RHB-32 I/O_3 20 6 VSS_PA 7 VSS_RX I/O_2 19 I/O_1 18 Thermal Pad I/O_0 17 16 VDD_I/O 15 VSS_A 14 MOD 13 IRQ 12 ASK/OOK RX_IN1 11 BAND_GAP 8 10 VSS The receiver system enables AM and PM demodulation using a dual-input architecture. The receiver also includes an automatic gain control option and selectable gain. Also included is a selectable bandwidth to cover a broad range of input subcarrier signal options. The received signal strength for AM and PM modulation is accessible via the RSSI register. The receiver output is selectable between a digitized subcarrier signal and any of eleven integrated subcarrier decoders (two for ISO15693 low bit rate, two for ISO15693 high bit rate, two for ISO14443, three for ISO14443 high bit rates, one for Tag-it, and one for HF-EPC system). Selected decoders also deliver bit stream and a data clock as outputs. The TRF7960/61 supports data communication levels between 1.8 V–5.5 V for the MCU I/O interface while also providing a data synchronization clock. An auxiliary 20-mA regulator (pin 32) is available for additional system circuits. VDD_X 32 Data transmission comprises low-level encoding for ISO15693, modified Miller for ISO14443-A, high-bit-rate systems, Tag-it, and HF-EPC system coding. Included with the data encoding is automatic generation of SOF, EOF, CRC, and/or parity bits. The receiver system also includes a framing system. This system performs the CRC and/or parity check, removes the EOF and SOF settings, and organizes the data in bytes. Framed data is then accessible to the MCU via a 12-byte FIFO register and MCU interface. The framing supports ISO14443 and ISO15693 protocols. 9 RX_IN2 A parallel or serial interface can be used for communication between the MCU and reader. When hardware encoders and decoders are used (accelerators for different standards), transmission and receive functions use a 12-byte FIFO register. For direct transmit or receive functions, the encoders/decoders can be bypassed in order for the MCU to process the data in real time. The transmitter has selectable output-power levels of 100 mW (20 dBm) or 200 mW (23 dBm) into a 50-Ω load (at 5 -V supply) and is capable of ASK or OOK modulation. Integrated voltage regulators ensure power-supply noise rejection for the complete reader system. Figure 2. TRF796x Pin Assignments (Top View) Submit Documentation Feedback TRF7960/61 www.ti.com SLOS504B – AUGUST 2006 – REVISED APRIL 2007 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VIN Supply voltage 6 V IO Output current 150 mA Continuous power dissipation TJ Tstg See Dissipation Rating Table Maximum junction temperature, any condition (2) 140 °C Maximum junction temperature, continuous operation, long-term reliability (2) 125 °C –55 to 150 °C Storage temperature range Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300 °C 2 kV HBM (human body model) ESDS rating (1) (2) CDM (charged device model) 500 MM (machine model) 200 V The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only and functional operation of the device at these or any other conditions beyond those specified are not implied. The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature may result in reduced reliability and/or lifetime of the device. TABLE 5. PACKAGING/ORDERING INFORMATION (1) PACKAGED DEVICES PACKAGE TYPE TRF7960RHBT RHB-32 TRF7960RHBR TRF7961RHBT RHB-32 TRF7961RHBR (1) TRANSPORT MEDIA QUANTITY Tape and reel 250 Tape and reel 3000 Tape and reel 250 Tape and reel 3000 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. DISSIPATION RATINGS TABLE PER PACKAGE (1) (2) POWER RATING (2) PACKAGE θJC (°C/W) θJA (1) (°C/W) TA≤ 25°C TA = 85°C RHB (32) 31 36.4 2.7 W 1.1 W This data was taken using the JEDEC standard high-K test PCB. Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to increase substantially. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) MIN TYP MAX VIN Supply voltage 2.7 5 5.5 V TJ Operating virtual junction temperature range –40 125 °C TA Operating ambient temperature range –40 110 °C Load impedance at TX OUT (pin 5) Submit Documentation Feedback 25 10 UNIT Ω 3 PACKAGE OPTION ADDENDUM www.ti.com 4-Apr-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TRF7960RHBR ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TRF7960RHBT ACTIVE QFN RHB 32 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TRF7961RHBR ACTIVE QFN RHB 32 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR TRF7961RHBT ACTIVE QFN RHB 32 250 CU NIPDAU Level-2-260C-1 YEAR Green (RoHS & no Sb/Br) Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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