TI LM3291TMXNOPB

LM3291
www.ti.com
SNVSA12 – SEPTEMBER 2013
LM3291 Product Brief
FEATURES
DESCRIPTION
•
The LM3291 is a high-speed linear amplifier that, with
its companion IC LM3290, constitutes an RF
Envelope Modulator (EM) for supplying 3G/4G Power
Amplifiers (PA) in envelope tracking systems. The
amplifier provides extremely low output impedance
and low output noise over a wide bandwidth.
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23
•
•
•
•
•
•
•
Highly Programmable High-Current Linear
Amplifier
> 75 MHz Typical Small Signal Bandwidth
Extremely Low Output Impedance
High Linearity
Differential Analog Input Compatible with
eTrak 1.0 Standard
Low Output Noise
When paired with the LM3290 provides a
complete Envelope Modulator solution for
3G/4G Envelope Tracking Power Amplifiers.
Automatically controlled through LM3290 in an
envelope modulation solution using MIPI®
RFFE 1.1-compatible interface.
APPLICATIONS
•
•
•
3G/LTE Handsets
3G//LTE Tablets
3G/LTE Data Cards and Wireless Modems
MIPI eTrak
2.5V - 5V
BATTERY
MIPI RFFE
RFIC
or
BBIC
LM3291
LM3290
L
C
In conjunction with an Envelope Tracking (ET)
capable RFIC and PA, the LM3291 and LM3290
greatly improve PA efficiency for 3G and LTE
operation.
In ET mode, the LM3291 and LM3290 provide
envelope tracking supply voltage for the PA
maximizing total EM + PA efficiency. The envelope
modulator follows the differential envelope reference
input signal delivered by the RFIC to the LM3291.
The output is a single-ended dynamic power supply
voltage to the PA.
The LM3291 supports 3G and LTE operation up to 20
MHz signal bandwidth.
The LM3291’s programmable parameters are
controlled by LM3290 via a direct serial interface
between the two devices. No additional controls are
needed in the system. This interface provides flexible
control and adjustment options to optimize LM3291
efficiency and noise performance for various
frequency bands and power levels.
3G/4G
3G/4G
SB PA
3G/4G
MBMM PA
At high TX output power, the EM can be operated in
ET mode where LM3290 and LM3291 together
modulate the supply of the PA with the envelope
signal to improve overall system efficiency. At low TX
output power, the EM can be transitioned to Average
Power Tracking (APT) mode where LM3291 is placed
into shutdown mode to improve system efficiency.
The LM3291 is available in a 12-pin lead-free DSBGA
package.
For the full datasheet, samples, or the EVM
hardware and software please contact a TI
representative at [email protected]
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MIPI is a registered trademark of Mobile Industry Processor Interface Alliance.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
6-Sep-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
LM3291TME/NOPB
ACTIVE
DSBGA
YFQ
12
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-30 to 85
AE
LM3291TMX/NOPB
ACTIVE
DSBGA
YFQ
12
3000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-30 to 85
AE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
Samples
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