LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 LM78LXX Series 3-Terminal Positive Regulators Check for Samples: LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 FEATURES DESCRIPTION • • The LM78LXX series of three terminal positive regulators is available with several fixed output voltages making them useful in a wide range of applications. When used as a zener diode/resistor combination replacement, the LM78LXX usually results in an effective output impedance improvement of two orders of magnitude, and lower quiescent current. These regulators can provide local on card regulation, eliminating the distribution problems associated with single point regulation. The voltages available allow the LM78LXX to be used in logic systems, instrumentation, HiFi, and other solid state electronic equipment. 1 2 • • • • • • • • LM78L05 in DSBGA Package Output Voltage Tolerances of ±5% Over the Temperature Range Output Current of 100mA Internal Thermal Overload Protection Output Transistor Safe Area Protection Internal Short Circuit Current Limit Available in TO-92 and SOIC-8 Low Profile Packages No External Components Output Voltages of 5.0V, 6.2V, 8.2V, 9.0V, 12V, 15V See AN-1112 (SNVA009) for DSBGA Considerations Connection Diagram Figure 1. SOIC-8 (D) (Top View, Narrow Body) . Figure 2. 8-Bump DSBGA (Top View, Bump Side Down) . XT = Data Code XTP 1 Pin A1 Corner Pin A1 is identified by lower left corner with respect to the text. Figure 3. TO-92 Package (LP) (Bottom View) Figure 4. DSBGA Marking Orientation (Top View) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2000–2013, Texas Instruments Incorporated LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 SNVS754I – JANUARY 2000 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. DESCRIPTION (CONTINUED) The LM78LXX is available in the plastic TO-92 (LP) package, the SOIC-8 (D) package and a chip sized package (8-Bump DSBGA) using TI's DSBGA package technology. With adequate heat sinking the regulator can deliver 100mA output current. Current limiting is included to limit the peak output current to a safe value. Safe area protection for the output transistors is provided to limit internal power dissipation. If internal power dissipation becomes too high for the heat sinking provided, the thermal shutdown circuit takes over preventing the IC from overheating. Absolute Maximum Ratings (1) (2) (3) Internally Limited Storage Temperature −65°C to +150°C (4) 1kV Power Dissipation Input Voltage ESD Susceptibility 35V Operating Junction Temperature LM78LxxACZ, TO-92 0°C to 125°C LM78LxxACM, SOIC-8 0°C to 125°C LM78LxxAIM, SOIC-8 -40°C to 125°C LM78LxxIBPX, DSBGA −40°C to 85°C LM78LxxITP, Thin DSBGA −40°C to 85°C Soldering Information Infrared or Convection (20 sec.) 235°C Wave Soldering (10 sec.) (1) (2) (3) (4) 260°C (lead time) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device outside of its stated operating conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Typical thermal resistance values for the packages are: LP Package: θJC = 60 °C/W, = θJA = 230 °C/W D Package: θJA = 180 °C/W DSBGA Package: θJA = 230.9°C/W Human body model, 1.5 kΩ in series with 100pF. LM78LXX Electrical Characteristics LM78L05AC / LM78L05I Limits in standard typeface are for TJ = 25°C, Bold typeface applies over the entire operating temperature range of the indicated package. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise specified: IO = 40mA, CI = 0.33μF, CO = 0.1μF. Unless otherwise specified, VIN = 10V Symbol VO Parameter Conditions Output Voltage ΔVO (1) 2 Load Regulation Max 4.8 5 5.2 4.75 5.25 1mA ≤ IO ≤ 70mA 4.75 5.25 (1) Line Regulation Typ 7V ≤ VIN ≤ 20V 1mA ≤ IO ≤ 40mA (1) ΔVO Min 7V ≤ VIN ≤ 20V 18 75 8V ≤ VIN ≤ 20V 10 54 1mA ≤ IO ≤ 100mA 20 60 1mA ≤ IO ≤ 40mA 5 30 Units V mV Power dissipation ≤ 0.75W. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 LM78LXX Electrical Characteristics LM78L05AC / LM78L05I (continued) Limits in standard typeface are for TJ = 25°C, Bold typeface applies over the entire operating temperature range of the indicated package. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Unless otherwise specified: IO = 40mA, CI = 0.33μF, CO = 0.1μF. Unless otherwise specified, VIN = 10V Symbol Parameter IQ Quiescent Current ΔIQ Quiescent Current Change Conditions Typ 3 Max 1.0 1mA ≤ IO ≤ 40mA 0.1 Output Noise Voltage f = 10 Hz to 100 kHz ΔVIN/ΔVOUT Ripple Rejection f = 120 Hz 8V ≤ VIN ≤ 16V IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation θJA Thermal Resistance (8-Bump micro SMD) (2) 47 IO = 5mA Units 5 8V ≤ VIN ≤ 20V Vn (2) Min mA 40 μV 62 dB 140 mA −0.65 mV/°C 6.7 7 V 230.9 °C/W Recommended minimum load capacitance of 0.01μF to limit high frequency noise. LM78LXX Electrical Characteristics LM78L62AC Unless otherwise specified, VIN = 12V Symbol VO Parameter Conditions Output Voltage 6.45 6.5 1mA ≤ IO ≤ 70mA 5.9 6.5 8.5V ≤ VIN ≤ 20V 65 175 9V ≤ VIN ≤ 20V 55 125 1mA ≤ IO ≤ 100mA 13 80 1mA ≤ IO ≤ 40mA 6 40 2 5.5 ΔVO Load Regulation IQ Quiescent Current ΔIQ Quiescent Current Change Vn Output Noise Voltage f = 10 Hz to 100 kHz ΔVIN/ΔVOUT Ripple Rejection f = 120 Hz 10V ≤ VIN ≤ 20V IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation (1) (2) Max 6.2 5.9 (1) Line Regulation Typ 8.5V ≤ VIN ≤ 20V 1mA ≤ IO ≤ 40mA (1) ΔVO Min 5.95 8V ≤ VIN ≤ 20V 1.5 1mA ≤ IO ≤ 40mA 0.1 (2) IO = 5mA 40 Units V mV mA 50 μV 46 dB 140 mA −0.75 mV/°C 7.9 V Power dissipation ≤ 0.75W. Recommended minimum load capacitance of 0.01μF to limit high frequency noise. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 3 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 SNVS754I – JANUARY 2000 – REVISED APRIL 2013 www.ti.com LM78LXX Electrical Characteristics LM78L82AC Unless otherwise specified, VIN = 14V Symbol VO Parameter Conditions Output Voltage ΔVO Load Regulation IQ Quiescent Current ΔIQ Quiescent Current Change 7.87 8.2 8.53 8.6 1mA ≤ IO ≤ 70mA 7.8 8.6 11V ≤ VIN ≤ 23V 80 175 12V ≤ VIN ≤ 23V 70 125 1mA ≤ IO ≤ 100mA 15 80 1mA ≤ IO ≤ 40mA 8 40 2 5.5 12V ≤ VIN ≤ 23V 1.5 1mA ≤ IO ≤ 40mA 0.1 Vn Output Noise Voltage f = 10 Hz to 100 kHz ΔVIN/ΔVOUT Ripple Rejection f = 120 Hz 12V ≤ VIN ≤ 22V IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation (1) (2) Max 7.8 (1) Line Regulation Typ 11V ≤ VIN ≤ 23V 1mA ≤ IO ≤ 40mA (1) ΔVO Min V mV mA 60 μV 45 dB 140 mA −0.8 mV/°C 9.9 V (2) 39 IO = 5mA Units Power dissipation ≤ 0.75W. Recommended minimum load capacitance of 0.01μF to limit high frequency noise. LM78LXX Electrical Characteristics LM78L09AC / LM78L09I Unless otherwise specified, VIN = 15V Symbol VO Parameter Conditions Output Voltage ΔVO Load Regulation IQ Quiescent Current ΔIQ Quiescent Current Change Vn Ripple Rejection IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation 4 8.64 9.0 9.36 9.45 1mA ≤ IO ≤ 70mA 8.55 9.45 11.5V ≤ VIN ≤ 24V 100 200 13V ≤ VIN ≤ 24V 90 150 1mA ≤ IO ≤ 100mA 20 90 1mA ≤ IO ≤ 40mA 10 45 2 5.5 11.5V ≤ VIN ≤ 24V 1.5 1mA ≤ IO ≤ 40mA 0.1 f = 120 Hz 15V ≤ VIN ≤ 25V IO = 5mA Units V mV mA 70 μV 44 dB 140 mA −0.9 mV/°C 10.7 V Output Noise Voltage ΔVIN/ΔVOUT (1) Max 8.55 (1) Line Regulation Typ 11.5V ≤ VIN ≤ 24V 1mA ≤ IO ≤ 40mA (1) ΔVO Min 38 Power dissipation ≤ 0.75W. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 LM78LXX Electrical Characteristics LM78L12AC Unless otherwise specified, VIN = 19V Symbol VO Parameter Conditions Output Voltage ΔVO Load Regulation IQ Quiescent Current ΔIQ Quiescent Current Change Vn Output Noise Voltage ΔVIN/ΔVOUT Ripple Rejection IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation (1) Max 11.5 12 12.5 11.4 12.6 1mA ≤ IO ≤ 70mA 11.4 12.6 (1) Line Regulation Typ 14.5V ≤ VIN ≤ 27V 1mA ≤ IO ≤ 40mA (1) ΔVO Min 14.5V ≤ VIN ≤ 27V 30 180 16V ≤ VIN ≤ 27V 20 110 1mA ≤ IO ≤ 100mA 30 100 1mA ≤ IO ≤ 40mA 10 50 3 5 16V ≤ VIN ≤ 27V 1 1mA ≤ IO ≤ 40mA 0.1 f = 120 Hz 15V ≤ VIN ≤ 25 40 IO = 5mA Units V mV mA 80 μV 54 dB 140 mA −1.0 mV/°C 13.7 14.5 V Units Power dissipation ≤ 0.75W. LM78LXX Electrical Characteristics LM78L15AC Unless otherwise specified, VIN = 23V Symbol VO Parameter Conditions Output Voltage ΔVO Load Regulation IQ Quiescent Current ΔIQ Quiescent Current Change Max 15.6 14.25 15.75 1mA ≤ IO ≤ 70mA 14.25 15.75 (1) Line Regulation Typ 15.0 17.5V ≤ VIN ≤ 30V 1mA ≤ IO ≤ 40mA (1) ΔVO Min 14.4 17.5V ≤ VIN ≤ 30V 37 250 20V ≤ VIN ≤ 30V 25 140 1mA ≤ IO ≤ 100mA 35 150 1mA ≤ IO ≤ 40mA 12 75 3 5 20V ≤ VIN ≤ 30V Output Noise Voltage ΔVIN/ΔVOUT Ripple Rejection IPK Peak Output Current ΔVO/ΔT Average Output Voltage Tempco VIN (Min) Minimum Value of Input Voltage Required to Maintain Line Regulation (1) f = 120 Hz 18.5V ≤ VIN ≤ 28.5V IO = 5mA mV 1 1mA ≤ IO ≤ 40mA Vn V mA 0.1 37 90 μV 51 dB 140 mA −1.3 mV/°C 16.7 17.5 V Power dissipation ≤ 0.75W. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 5 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 SNVS754I – JANUARY 2000 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 6 Maximum Average Power Dissipation (LP Package) Peak Output Current Figure 5. Figure 6. Dropout Voltage Ripple Rejection Figure 7. Figure 8. Output Impedance Quiescent Current Figure 9. Figure 10. Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Quiescent Current Figure 11. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 7 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 SNVS754I – JANUARY 2000 – REVISED APRIL 2013 www.ti.com EQUIVALENT CIRCUIT Figure 12. LM78LXX 8 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 Typical Applications *Required if the regulator is located more than 3″ from the power supply filter. **See (1) in the electrical characteristics table. Figure 13. Fixed Output Regulator VOUT = 5V + (5V/R1 + IQ) R2 5V/R1 > 3 IQ, load regulation (Lr) ≈ [(R1 + R2)/R1] (Lr of LM78L05) Figure 14. Adjustable Output Regulator IOUT = (VOUT/R1) + IQ >IQ = 1.5mA over line and load changes Figure 15. Current Regulator (1) Recommended minimum load capacitance of 0.01μF to limit high frequency noise. Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 9 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 SNVS754I – JANUARY 2000 – REVISED APRIL 2013 www.ti.com *Solid tantalum. **Heat sink Q1. ***Optional: Improves ripple rejection and transient response. Load Regulation: 0.6% 0 ≤ IL ≤ 250mA pulsed with tON = 50ms. Figure 16. 5V, 500mA Regulator with Short Circuit Protection *Solid tantalum. Figure 17. ±15V, 100mA Dual Power Supply *Solid tantalum. VOUT = VG + 5V, R1 = (−VIN/IQ LM78L05) VOUT = 5V (R2/R4) for (R2 + R3) = (R4 + R5) A 0.5V output will correspond to (R2/R4) = 0.1 (R3/R4) = 0.9 Figure 18. Variable Output Regulator 0.5V-18V 10 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 LM78L05, LM78L09, LM78L12, LM78L15, LM78L62, LM78L82 www.ti.com SNVS754I – JANUARY 2000 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision H (April 2013) to Revision I • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L82 11 PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM78L05ACM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM78L 05ACM LM78L05ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 05ACM LM78L05ACMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM78L 05ACM LM78L05ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 05ACM LM78L05ACZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 05ACZ LM78L05ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 05ACZ LM78L05ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 05ACZ LM78L05ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 05ACZ LM78L05ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L05AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM78L 05AM LM78L05AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM LM78L 05AM LM78L05ITP/NOPB ACTIVE DSBGA YPB 8 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM P 03 LM78L05ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM P 03 LM78L09ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM P 02 LM78L12ACM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM78L 12ACM LM78L12ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 12ACM LM78L12ACMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM78L 12ACM Addendum-Page 1 -40 to 85 LM78L 05ACZ Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 18-May-2013 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) LM78L12ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 12ACM LM78L12ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 12ACZ LM78L12ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 12ACZ LM78L12ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L 12ACZ LM78L12ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM78L 12ACZ LM78L15ACM ACTIVE SOIC D 8 95 TBD Call TI Call TI -40 to 85 LM78L 15ACM LM78L15ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 15ACM LM78L15ACMX ACTIVE SOIC D 8 2500 TBD Call TI Call TI -40 to 85 LM78L 15ACM LM78L15ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM78L 15ACM LM78L15ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM LM78L15ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM78L 15ACZ LM78L62ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SNCU Level-1-NA-UNLIM -40 to 85 LM78L 62ACZ LM78L 15ACZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 18-May-2013 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM78L05ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ITP/NOPB DSBGA YPB 8 250 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L05ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L09ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L12ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L12ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM78L05ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05ITP/NOPB DSBGA YPB 8 250 210.0 185.0 35.0 LM78L05ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L09ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L12ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA YPB0008 D 0.5±0.045 E TPA08XXX (Rev A) D: Max = 1.337 mm, Min =1.276 mm E: Max = 1.337 mm, Min =1.276 mm 4215100/A NOTES: A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994. B. This drawing is subject to change without notice. www.ti.com 12/12 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. 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