SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 Micropower Voltage Regulator Check for Samples: SM72238 FEATURES DESCRIPTION • • • • • • • • • • • The SM72238 is a micropower voltage regulator with very low quiescent current (75µA typ.) and very low dropout voltage (typ. 40mV at light loads and 380mV at 100mA). It is ideally suited for use in batterypowered systems. Furthermore, the quiescent current of the SM72238 increases only slightly in dropout, prolonging battery life. 1 2 Renewable Energy Grade High-Accuracy Output Voltage Ensured 100mA Output Current Extremely Low Quiescent Current Low Dropout Voltage Extremely Tight Load and Line Regulation Very Low Temperature Coefficient Use as Regulator or Reference Needs Minimum Capacitance for Stability Current and Thermal Limiting Stable With Low-ESR Output Capacitors (10mΩ to 6Ω) The SM72238 is available in the surface-mount DPak package. Careful design of the SM72238 has minimized all contributions to the error budget. This includes a tight initial tolerance (.5% typ.), extremely good load and line regulation (.05% typ.) and a very low output voltage temperature coefficient, making the part useful as a low-power voltage reference. Block Diagram and Typical Applications Figure 1. SM72238 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Connection Diagrams Front View Figure 2. PFM Package See Package Number NDP0003B These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) −0.3 to +30V Input Supply Voltage Power Dissipation Internally Limited Junction Temperature (TJ) +150°C −65° to +150°C Ambient Storage Temperature Soldering Dwell Time, Temperature Wave 4 seconds, 260°C Infrared 10 seconds, 240°C Vapor Phase ESD Rating (1) (2) (3) Human Body Model 75 seconds, 219°C (3) 2500V Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics tables. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. Human Body Model 1.5kΩ in series with 100pF. Operating Ratings (1) Maximum Input Supply Voltage 30V Junction Temperature Range, (TJ) (2) (1) (2) 2 −40° to +125°C Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test conditions, see the Electrical Characteristics tables. Junction-to-case thermal resistance for the PFM package is 5.4°C/W. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 Electrical Characteristics (1) Conditions (1) Parameter Typ Tested Limit (2) Design Limit (3) 3.0 3.030 V max 2.970 V min Units 3V Versions Output Voltage TJ = 25°C −25°C ≤ TJ ≤ 85°C Output Voltage 3.0 Full Operating Temperature Range 3.0 100µA ≤ IL ≤ 100mA, TJ ≤ TJMAX 3.0 TJ = 25°C 3.3 3.045 V max 2.955 V min 3.060 V max 2.940 V min 3.072 V max 2.928 V min 3.3V Versions Output Voltage 3.333 V max 3.267 Output Voltage −25°C ≤ TJ ≤ 85°C 3.3 Full Operating Temperature Range 3.3 100µA ≤ IL ≤ 100mA TJ ≤ TJMAX 3.3 TJ = 25°C 5.0 V min 3.350 V max 3.251 V min 3.366 V max 3.234 V min 3.379 V max 3.221 V min 5.0V Versions Output Voltage 5.05 V max 4.95 −25°C ≤ TJ ≤ 85°C 5.0 Full Operating Temperature Range 5.0 100µA ≤ IL ≤ 100mA TJ ≤ TJMAX 5.0 Output Voltage Temperature Coefficient See (4) 50 Line Regulation (5) (VONOM + 1)V ≤ Vin ≤ 30V (6) Output Voltage V min 5.075 V max 4.925 V min 5.1 V max 4.9 V min 5.12 V max 4.88 V min 150 ppm/°C All Voltage Options 0.04 0.2 % max 0.4 Load Regulation (5) 100µA ≤ IL ≤ 100mA Dropout Voltage (7) IL = 100µA 0.1 0.2 % max 0.3 80 50 IL = 100mA (1) (2) (3) (4) (5) (6) (7) % max mV max 150 450 380 % max mV max mV max 600 mV max Unless otherwise specified all limits ensured for VIN = (VONOM + 1)V, IL = 100µA and CL = 1µF. Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. Ensured and 100% production tested. Ensured but not 100% production tested. These limits are not used to calculate outgoing AQL levels. Output or reference voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specification for thermal regulation. For IL = 100µA and TJ = 125°C, line regulation is ensured by design to 0.2%. See Typical Performance Characteristics for line regulation versus temperature and load current. Dropout Voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential. At very low values of programmed output voltage, the minimum input supply voltage of 2V (2.3V over temperature) must be taken into account. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 3 SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Electrical Characteristics(1) (continued) Conditions (1) Typ Tested Limit (2) IL = 100µA 75 120 IL = 100mA 8 12 Vin = (VONOM − 0.5)V, IL = 100µA 110 170 Vout = 0 160 Parameter Ground Current Design Limit (3) 140 Current Limit µA max mA max 14 Dropout Ground Current Units µA max mA max µA max 200 200 µA max mA max 220 mA max Thermal Regulation See (8) 0.05 Output Noise, 10 Hz to 100 kHz CL = 1µF (5V Only) 430 µV rms CL = 200µF 160 µV rms CL = 3.3µF (Bypass = 0.01µF) 100 µV rms (8) 4 0.2 %/W max Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 50mA load pulse at VIN = 30V (1.25W pulse) for T = 10ms. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 Typical Performance Characteristics Quiescent Current Dropout Characteristics Figure 3. Figure 4. Input Current Input Current Figure 5. Figure 6. Output Voltage vs. Temperature of 3 Representative Units Quiescent Current Figure 7. Figure 8. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 5 SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Quiescent Current Quiescent Current Figure 9. Figure 10. Quiescent Current Short Circuit Current Figure 11. Figure 12. Dropout Voltage Line Transient Response Figure 13. Figure 14. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Load Transient Response Load Transient Response Figure 15. Figure 16. Output Impedance Ripple Rejection Figure 17. Figure 18. Ripple Rejection Ripple Rejection Figure 19. Figure 20. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 7 SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) Shutdown Threshold Voltage Line Regulation Figure 21. Figure 22. Maximum Rated Output Current Thermal Response Figure 23. Figure 24. Output Capacitor ESR Range Figure 25. 8 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 APPLICATION HINTS EXTERNAL CAPACITORS A 1.0µF (or greater) capacitor is required between the output and ground for stability. Without this capacitor the part will oscillate. Most types of tantalum or aluminum electrolytics work fine here; even film types work but are not recommended for reasons of cost. Many aluminum electrolytics have electrolytes that freeze at about −30°C, so solid tantalums are recommended for operation below −25°C. The important parameters of the capacitor are an ESR of about 5Ω or less and a resonant frequency above 500kHz. The value of this capacitor may be increased without limit. Ceramic capacitors whose value is greater than 1000pF should not be connected directly from the SM72238 output to ground. Ceramic capacitors typically have ESR values in the range of 5 to 10mΩ, a value below the lower limit for stable operation (see Figure 25). The reason for the lower ESR limit is that the loop compensation of the part relies on the ESR of the output capacitor to provide the zero that gives added phase lead. The ESR of ceramic capacitors is so low that this phase lead does not occur, significantly reducing phase margin. A ceramic output capacitor can be used if a series resistance is added (recommended value of resistance about 0.1Ω to 2Ω). At lower values of output current, less output capacitance is required for stability. The capacitor can be reduced to 0.33µF for currents below 10mA or 0.1µF for currents below 1mA. Unlike many other regulators, the SM72238 will remain stable and in regulation with no load in addition to the internal voltage divider. This is especially important in CMOS RAM keep-alive applications. A 1µF tantalum, ceramic or aluminum electrolytic capacitor should be placed from the SM72238 input to ground if there is more than 10 inches of wire between the input and the AC filter capacitor or if a battery is used as the input. REDUCING OUTPUT NOISE In reference applications it may be advantageous to reduce the AC noise present at the output. One method is to reduce the regulator bandwidth by increasing the size of the output capacitor. This is the only way noise can be reduced but is relatively inefficient, as increasing the capacitor from 1µF to 220µF only decreases the noise from 430µV to 160µV rms for a 100kHz bandwidth at 5V output. Typical Applications SM72238 *Minimum input-output voltage ranges from 40mV to 400mV, depending on load current. Current limit is typically 160mA. Figure 26. 5 Volt Current Limiter Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 9 SM72238 SNVS694C – JANUARY 2011 – REVISED APRIL 2013 www.ti.com Schematic Diagram 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 SM72238 www.ti.com SNVS694C – JANUARY 2011 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format .......................................................................................................... 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links: SM72238 11 PACKAGE OPTION ADDENDUM www.ti.com 21-May-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) SM72238TD-3.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TD-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TD-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDE-3.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TDE-3.3/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDE-5.0/NOPB ACTIVE TO-252 NDP 3 250 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 SM72238TDX-3.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.0 SM72238TDX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 -3.3 SM72238TDX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 S72238 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-May-2013 (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SM72238TDE-3.0/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 SM72238TDE-3.3/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 SM72238TDE-5.0/NOPB TO-252 NDP 3 250 178.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 SM72238TDX-3.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SM72238TDE-3.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDE-3.3/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDE-5.0/NOPB TO-252 NDP 3 250 213.0 191.0 55.0 SM72238TDX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 SM72238TDX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 SM72238TDX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 Pack Materials-Page 2 MECHANICAL DATA NDP0003B TD03B (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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