EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC FEATURES • • • 6 - 18 GHz Operating Frequency Range 33 dBm Output Power at 1dB Compression 20.0 dB Typical Small Signal Gain APPLICATIONS • • • Dimension: 5330um X 3080um Thickness: 85um ± 15um Point-to-point and point-to-multipoint radio Military Radar Systems Test systems Caution! ESD sensitive device. ELECTRICAL CHARACTERISTICS (Ta = 25°C, 50 ohm, VDD=8V, IDQ=1250mA) SYMBOL PARAMETER/TEST CONDITIONS MIN TYP MAX UNITS 18 GHz Operating Frequency Range 6 P1dB Output Power at 1dB Gain Compression 31 33 dBm GSS Small Signal Gain 17 20 dB G∆ Small Signal Gain Flatness ±1.2 dB ID1dB Supply current at 1dB Gain Compression 1400 mA PAE Power Added Efficiency at 1dB Gain Compression 20 % -43.0 dBc F OIMD3 Input RL Output RL IDSS RTH Output 3rd Order Intermodulation Distortion @∆f=10MHz, Each Tone Pout 21.5dBm Input Return Loss 6GHz – 8GHz 8GHz – 18GHz Output Return Loss Saturated Drain Current VDD=3V, VGG=0V -8 -5 dB -12 -8 dB -15 -10 dB 2500 Thermal Resistance (Au-Sn Eutectic Attach) 5.5 mA o C/W ABSOLUTE MAXIMUM RATINGS FOR CONTINUOUS OPERATION1 SYMBOL CHARACTERISTIC VALUE VDS Drain to Source Voltage 8V VGS Gate to Source Voltage - 4V IDD Drain Current Idss IGSF Forward Gate Current PIN Input Power TCH Channel Temperature 175°C TSTG Storage Temperature -65/175°C PT 70 mA @ 3dB compression Total Power Dissipation 22W 1. Operating the device beyond any of the above rating may result in permanent damage. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 1 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Typical Performance Characteristics All data measured at 8V, IDQ=1250mA bias, 25°C unless otherwise noted. Gain over Temperature Output Power at 1dB gain compression over temperature 24 35 23 22 21 33 G ain , d B O u tp u t P o w er, d Bm 34 32 20 19 18 -40C +25C 31 +80C -40C 17 +25C 16 +80C 15 30 6 8 10 12 14 16 6 18 8 10 14 16 18 Frequency, GHz Frequency, GHz PAE at 1dB and 2dB gain compression Output Power at 1dB and 2dB gain compression 25 35 20 34 33 PAE % Output Power, dBm 12 32 15 10 PAE1dB 5 31 PAE2dB P1dB P2dB 0 30 6 8 10 12 14 16 6 18 8 10 Output Power at 1dB gain compression vs Vdd, Iq = 1250mA 14 34 25 33 24 32 31 8V 6V 28 6 8 5V 22 21 8V 7V 6V 5V 29 18 7V 23 30 16 Gain vs Vdd, Iq = 1250mA G ain , d B O u tp u t P o w er, d B m 12 Frequency, GHz Frequency, GHz 20 19 10 12 Freuquency, GHz 14 16 18 6 8 10 12 14 16 18 Frequency, GHz Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 2 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Gain vs Iq, Vdd = 8V 35 22.5 34 22 1500mA 1250mA 21.5 33 G ain , d B O u tp u t P o w er, d Bm Output Power at 1dB Gain Compression vs Iq, Vdd=8V 32 31 1500mA 30 21 20.5 20 1250mA 1000mA 29 1000mA 19.5 19 28 6 8 10 12 14 16 6 18 8 10 16 18 16 18 -20 DB(|S(1,1)|) -40C DB(|S(2,2)|) -5 -25 +25C +80C -30 -10 IM 3, d Bc Return Gain, dB 14 IM3 over temperature Pout=21.5dBm/tone Input and Output Return Loss 0 12 Frequency, GHz Frequency, GHz -15 -35 -40 -20 -45 -50 -25 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20 22 6 8 10 12 14 Frequency, GHz Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 3 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC 4387 4134 3487 3118 2441 2192 1882 1513 1223 601 854 93 232 Outline Drawing 3080 2990 2916 2414 1714 1372 649 164 5330 5242 4134 4387 3487 3118 2192 2441 1882 1513 1223 601 854 0 232 90 0 Dimensions in microns. Bond pad size 100um x 100um. Thickness: 85um ± 15um Assembly Drawing VGG .1uF VDD .1uF 50pF Cap, x12 Gold plated ridge IN OUT .1uF VGG .1uF Stand-off, x4 VDD Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 4 of 5 Revision 03 EMP216 6 - 18 GHz 2 Watt Power Amplifier MMIC Application Hints Biasing The EMP216 requires a negative bias voltage applied to VGG and positive bias voltage applied to VDD. Power supplies must be sequenced to apply VGG first, then VDD. When removing power, VDD must be turned off first, then VGG. VGG will draw very little current under small signal RF conditions, but as output power approaches the 1dB compression point, the VGG input will draw current up to several milliamps. The VGG supply must be capable of both sinking and sourcing this current. Assembly Recommended method of die attachment is AuSn eutectic. Wire bonding should be thermocompression bonding with no ultrasonics. To obtain full performance, RF input and output bond wires should be as short as possible. Wire length should be 7 mils maximum, with at least two wires per pad. Mounting the EMP216 on a “ridge” or pedestal is recommended to align the top surface of the MMIC to the interfacing substrate and minimize bond wire length. ESD warning The EMP216 is susceptible to damage from ESD and should only be handled in an ESD safe work station environment. Military and Hi-Rel screening Contact factory for military and hi-rel grades. DISCLAIMER EXCELICS SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. EXCELICS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN. LIFE SUPPORT POLICY EXCELICS SEMICONDUCTOR PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF EXCELICS SEMICONDUCTOR, INC. AS HERE IN: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Specifications are subject to change without notice. Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085 Phone: 408-737-1711 Fax: 408-737-1868 Web: www.excelics.com Page 5 of 5 Revision 03