TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 D D D D D D D 35-ns and 50-ns Single-Cycle Instruction Execution Time for 5 V Operation 50-ns Single-Cycle Instruction Execution Time for 3.3 V Operation Source-Code Compatible With All ’C1x and ’C2x Devices RAM-Based Operation – 9K-Words × 16-Bit Single-Access On-Chip Program / Data RAM – 1 056-Word × 16-Bit Dual-Access On-Chip Data RAM 2K-Word × 16-Bit On-Chip Boot ROM 224K-Word × 16-Bit Maximum Addressable External Memory Space (64K-Word Program, 64K-Word Data, 64K-Word I / O, and 32K-Word Global) 32-Bit Arithmetic Logic Unit (ALU) – 32-Bit Accumulator (ACC) – 32-Bit Accumulator Buffer (ACCB) D D D D D D D D D D D D 16-Bit Parallel Logic Unit (PLU) 16 × 16-Bit Multiplier, 32-Bit Product Eleven Context Switch Registers Two Buffers for Circular Addressing Full-Duplex Synchronous Serial Port Time-Division Multiplexed Serial Port (TDM) Timer With Control and Counter Registers 16 Software Programmable Wait-State Generators Divide-By-1 Clock Option IEEE Standard 1149.1† Test Access Port Operations are Fully Static Fabricated Using the Texas Instruments Enhanced Performance Implanted CMOS (EPIC) 0.72-µm Technology description The TMP320C50KGD digital signal processor (DSP) is a high performance, 16-bit, fixed-point processor manufactured in 0.72-µm double-level metal CMOS technology. The TMP320LC50KGD has the same functionality as the ’C50KGD except for operation at 3.3 V instead of 5 V. Texas Instruments Military Products currently employs three primary processes for the development of a known good die (KGD), one of which is applied to the TMP320C50 and TMP320LC50 devices. This process, known as hot-chuck-probe, uses a standard probed product that is tested again, this time at full data sheet specifications, in wafer form at speed and elevated temperature (85°C). Each individual die then is sawed, inspected, and packed for shipment. This flow produces a bare die that has been temperature-tested at speed and is known to be good, without having to use a temporary package. A number of enhancements to the basic ’C2x architecture give the ’C5x a minimum 2x performance over the previous generation. A four-deep instruction pipeline, incorporating delayed branching, delayed call to subroutine, and delayed return from subroutine, allows the ’C5x to perform instructions in fewer cycles. The addition of a PLU gives the ’C5x a method of manipulating bits in data memory without using the accumulator and ALU. The ’C5x has additional shifting and scaling capability for proper alignment of multiplicands or storage of values to data memory. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. † IEEE Standard 1149.1–1990, IEEE Standard Test-Access Port and Boundary-Scan Architecture EPIC is a trademark of Texas Instruments Incorporated. Copyright 1999, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 1 TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 description (continued) With the addition of the IDLE2 instruction, the ’C5x achieves low-power consumption. IDLE2 removes the functional clock from the internal hardware of the ’C5x that puts it into a total-sleep mode using only 5 µA. A low-logic level on an external interrupt with chip duration of at least five clock cycles ends the IDLE2 mode. TMP Product Flow; 40 and 57 MHz Multiprobe dc test @ 25°C Visual 40x Test conditions Per commercial data sheet DC test Hot chuck probe @ 85°C AC test Hot chuck probe @ 85°C @ Speed Warranty Datasheet upon shipment, 1 year For electrical and timing specifications, see the TMS320C5x, TMS320LC5x Digital Signal Processors data sheet, literature number SPRS030. Specific Die-Related Information 2 Die Size (approximate) 391 mils x 421 mils Die Thickness 15.5 mils Backside Surface Finish SIO2 Die Backside Potential Floating " 1 mil Max Allowable Die Junction Operating Temperature 175°C Glassivation Material and Thickness 3KAOX/9KACN Recommended Packing GEL PAK Die Attach Information SILVER GLASS Suggested Bond Wire Size 1.25 AL Suggested Bonding Method WEDGE ESD Sensitivity Class II Max Allowable Process Temperature for Die Attach 450°C POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 TMP320C50/LC50 Pad Information TOP LEFT PAD XCENTER YCENTER PAD XCENTER YCENTER 1 5347.4 9670.8 PAD NAME IAQ 41 106.3 1783.3 CLKR 2 5161.8 9670.8 TRST 42 106.3 1353.6 3 4908.6 9670.8 43 106.3 1218.6 VDD5 VDD6 4 4773.6 9670.8 VSS1 VSS2 44 1513.4 106.3 5 4573.4 9670.8 MP / MC 45 1648.4 106.3 VSS7 VSS8 6 4139.3 9670.8 D15 46 2128.3 106.3 A0 7 3851.3 9670.8 D14 47 2403.3 106.3 A1 8 3515.3 9670.8 D13 48 2637.3 106.3 A2 BOTTOM PAD NAME 9 3272.3 9670.8 D12 49 2912.2 106.3 A3 10 3024.8 9670.8 D11 50 3132.7 106.3 A4 11 2777.3 9670.8 D10 51 3407.7 106.3 A5 12 2421.0 9670.8 D9 52 3628.2 106.3 A6 13 2121.1 9670.8 D8 53 3903.1 106.3 A7 14 1702.6 9670.8 VDD1 VDD2 54 4123.6 106.3 A8 55 4398.6 106.3 A9 56 4569.6 106.3 15 1567.6 9670.8 16 106.3 8552.8 17 106.3 8417.8 VSS3 VSS4 57 4704.6 106.3 VDD7 VDD8 18 106.3 7859.8 D7 58 4896.7 106.3 TDI 19 106.3 7616.8 D6 59 5319.8 106.3 20 106.3 7321.3 D5 60 5454.8 106.3 VSS9 VSS10 21 106.3 7096.3 D4 61 5646.0 106.3 CLKMOD1 22 106.3 6871.3 D3 62 5886.6 106.3 A10 23 106.3 6646.3 D2 63 6161.6 106.3 A11 24 106.3 6323.9 D1 64 6527.3 106.3 A12 25 106.3 6098.9 D0 65 6802.3 106.3 A13 26 106.3 5818.7 TMS 66 7036.3 106.3 A14 27 106.3 5498.0 7311.2 106.3 A15 106.3 5363.0 VDD3 VDD4 67 28 68 8202.2 106.3 29 106.3 4942.2 TCK 69 8337.2 106.3 VDD9 VDD10 30 106.3 4764.3 NC 70 8649.0 106.3 RD 31 106.3 4601.2 71 9195.5 106.3 WE 32 106.3 4466.2 VSS5 VSS6 72 10274.3 1253.8 33 106.3 4041.0 INT1 73 10274.3 1388.8 VSS11 VSS12 34 106.3 3789.2 INT2 74 10274.3 1902.2 DS 35 106.3 3537.4 INT3 75 10274.3 2236.6 IS 36 106.3 3201.4 INT4 76 10274.3 2524.8 PS 37 106.3 2949.6 NMI 77 10274.3 2882.6 RW 38 106.3 2697.8 DR 78 10274.3 3168.8 STRB 39 106.3 2445.9 TDR 79 10274.3 3365.0 BR 40 106.3 2035.1 FSR 80 10274.3 3625.7 NC POST OFFICE BOX 1443 RIGHT • HOUSTON, TEXAS 77251–1443 3 TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 TMP320C50/LC50 Pad Information (Continued) TOP-R 4 PAD XCENTER YCENTER PAD NAME 81 10274.3 3795.5 CLKIN2 82 10274.3 3950.6 X2/CLKIN 83 10274.3 4126.6 X1 84 10274.3 4296.2 NC 85 10274.3 4459.4 86 10274.3 4594.4 VDD11 VDD12 87 10274.3 4766.7 TDO 88 10274.3 5085.1 89 10274.3 5220.1 VSS13 VSS14 90 10274.3 5375.3 CLKMD2 91 10274.3 5579.4 FSX 92 10274.3 5866.1 TFSX/TFRM 93 10274.3 6086.8 DX 94 10274.3 6379.1 TDX 95 10274.3 6599.8 HOLDA 96 10274.3 6820.5 XF 97 10274.3 7180.3 CLKOUT1 98 10274.3 7558.5 IACK 99 10274.3 8089.5 100 10274.3 8224.5 VDD13 VDD14 101 10274.3 8724.3 NC 102 10274.3 8859.3 NC 103 9201.4 9670.8 EMU0 104 8796.6 9670.8 EMU1/OFF 105 8540.1 9670.8 106 8405.1 9670.8 VSS15 VSS16 107 7927.9 9670.8 TOUT 108 7690.0 9670.8 TCLKX 109 7456.5 9670.8 CLKX 110 7133.8 9670.8 TFSR/TADD 111 6956.1 9670.8 TCLKR 112 6771.8 9670.8 RS 113 6587.5 9670.8 READY 114 6403.1 9670.8 HOLD 115 6016.9 9670.8 BIO 116 5780.7 9670.8 VDD15 117 5645.7 9670.8 VDD16 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C50KGD, TMP320LC50KGD DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIE SGZS008B – JULY 1996 – REVISED JUNE 1999 MECHANICAL DATA MOUNT AND BOND PAD #1 ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ ÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇÇ POST OFFICE BOX 1443 TMS320C50BS • HOUSTON, TEXAS 77251–1443 5 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. 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