TI TMP320C40KGDCT

TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
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SMJ: QML Processing to MIL–PRF–38535
TMP: Commercial Level Processing
Operating Temperature Ranges:
– Military (M) – 55°C to 125°C
– Commercial (C) – 25°C to 85°C
– Commercial (L) 0°C to 70°C
Highest Performance Floating-Point Digital
Signal Processor (DSP)
– ’C40-50:
40-ns Instruction Cycle Time:
50 MFLOPS, 25 MIPS, 275 MOPS,
320 MBps
– ’C40-40:
50-ns Instruction Cycle Time:
40 MFLOPS, 20 MIPS, 220 MOPS,
256 MBps
Six Communications Ports
6-Channel Direct Memory Access (DMA)
Coprocessor
Single-Cycle Conversion to and From
IEEE-745 Floating-Point Format
Single Cycle 1/x, 1/ Ǹ x
Source-Code Compatible With SMJ320C30
Validated Ada Compiler
Single-Cycle 40-Bit Floating-Point,
32-Bit Integer Multipliers
12 40-Bit Registers, 8 Auxiliary Registers,
14 Control Registers, and 2 Timers
IEEE Standard 1149.1† Test-Access Port
(JTAG)
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Two Identical External Data and Address
Buses Supporting Shared Memory Systems
and High Data-Rate, Single-Cycle
Transfers:
– High Port-Data Rate of 100 MBytes/s
(Each Bus)
– 16G-Byte Continuous
Program/Data/Peripheral Address Space
– Memory-Access Request for Fast,
Intelligent Bus Arbitration
– Separate Address-, Data-, and
Control-Enable Pins
– Four Sets of Memory-Control Signals
Support Different Speed Memories in
Hardware
Fabricated Using 0.72-µm Enhanced
Performance Implanted CMOS (EPIC)
Technology by Texas Instruments (TI)
Separate Internal Program, Data, and DMA
Coprocessor Buses for Support of Massive
Concurrent Input/Output (I/O) of Program
and Data Throughput, Maximizing
Sustained Central Processing Unit (CPU)
Performance
On-Chip Program Cache and
Dual-Access/Single-Cycle RAM for
Increased Memory-Access Performance
– 512-Byte Instruction Cache
– 8K Bytes of Single-Cycle Dual-Access
Program or Data RAM
– ROM-Based Bootloader Supports
Program Bootup Using 8-, 16-, or 32-Bit
Memories Over Any One of the
Communications Ports
description
The TMP / SMJ320C40KGD DSP is a 32-bit, floating-point processor manufactured in 0.72-µm, double-level
metal CMOS technology. It is the fourth generation of DSPs from Texas Instruments, and it is the world’s first
DSP designed for parallel processing. The on-chip parallel processing capabilities of the ’C40 make the
floating-point performance required by many applications achievable and cost-effective.
The TMP / SMJ320C40 is the first DSP with on-chip communication ports for processor-to-processor
communication using simple communication software with no external hardware. This allows connectivity with
no external glue logic. The communication ports remove I/O bottlenecks, and the independent smart-DMA
coprocessor is able to handle the CPU I/O requirements.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
† IEEE Standard 1149.1–1990 Standard Test-Access Port and Boundary-Scan Architecture
EPIC and TI are trademarks of Texas Instruments Incorporated.
Copyright  2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 1443
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
• HOUSTON, TEXAS 77251–1443
1
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
description (continued)
The features of the communication ports are:
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Six communication ports for direct interprocessor communication and processor I/O
20 MBps bidirectional interface on each communication port for high-speed and low-cost multiprocessor
interface
Separate input and output first-in, first-out (FIFO) buffers for I / O and processor-to-processor
communication
Automatic arbitration and handshaking for direct processor-to-processor connection
The DMA coprocessor allows concurrent I/O and CPU processing for superior sustained CPU performance.
The key features of the DMA coprocessor:
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Link pointers that allow DMA channels to auto-initialize
Parallel CPU operation and DMA transfers
Six DMA channels support communication-port-to-memory data transfers
The TMP/SMJ320C40KGD CPU is configured for high-speed internal parallel processing. The key features of
the CPU are:
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Eight operations / cycles
–
40- / 32-bit floating-point / integer multiply
–
40-/32-bit floating-point / integer arithmetic and logic unit (ALU) operation
–
Two data accesses
–
Two address-register updates
IEEE floating-point conversion
Division and square-root support
’C30 assembly language compatibility
Byte and halfword accessibility
Key factors in a parallel-processing implementation are the development tools that are available. The ’C40 is
supported by a host of parallel-processing development tools for developing and simulating code and for
debugging parallel-processing systems. The code generation tools include:
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Optimizing ANSI C compiler with a runtime library that supports use of communication ports and DMA
SPOX, by Spectron Microsystems Incorporated, which provides parallel processing support as well as
DMA and communication port drivers
Assembler and linker with support for mapping program and data to parallel processors.
SPOX is a trademark of Spectron Microsystems, Inc.
2
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
description (continued)
The simulation tools include:
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Parallel DSP system-level simulation, by Logic Modeling Corporation (LMC), which includes a hardware
verification (HV) model and a full functional (FF) model
TI software simulator with high-level language debugger interface for simulating a single processor
The hardware development and verification tools include:
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Parallel processor in-circuit emulator and high-level language debugger: XDS510
Parallel processor development system with four TMS320C40s, local and global memory, and
communication port connections
known good die technology
Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications.
There are currently two verification technologies used at TI to support KGD requirements for the
TMP/SMJ320C40KGD: Removable Tab (R-Tab), and Temporary Wire Bond (TWB).
The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the
use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using modified bonding
parameters. This technique allows easy removal of the tape after all needed 100% screens and parametric tests
have been performed. The tape is removed from the tested part and the die is shipped in a conventional die
container. The gold bumps remain on the bond pads, which allow for subsequent attachment of gold-ball bonds.
Similarly, with KGD using the TWB technique, bond wires are attached to the bond pads using adjusted bonding
parameters which allow for easy removal of the die after all needed 100% screens and parametric tests have
been performed. The die is removed from the temporary package and the die is shipped in a conventional die
container.
visual inspection of known good die (KGD) using temporary wire bond (TWB) process
QML KGD devices produced using the TWB technology do not optically meet MIL-STD-883E (Method 2010,
paragraph 3.1.1.1.h) metal bond pad visual inspection criterion due to the bond pad marks formed during
bonding removal process. However, these devices have been reliably bonded using normal wire bond
precesses, and pass bond strength evaluations.
electrical specifications
For military electrical and timing specifications, please refer to the SMJ320C40 Digital Signal Processor data
sheet, literature number SGUS017. For commercial electrical and timing specifications, see the TMS320C40
Digital Signal Processor Data Sheet, literature number SPRS038.
XDS510 is a trademark of Texas Instruments Incorporated.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
3
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
SMJ
PREFIX
SMJ =
TMP =
320
C
40
KGD
M
50
C
T
KGD OPTION
T = TWB process
blank = R-Tab process
MIL-PRF-38535 Processing
Commercial Level
DIE REVISION
C = Revision 5.2
DEVICE FAMILY
320 = DSP Family
SPEED RANGE
40 = 40 MHz
50 = 50 MHz
TECHNOLOGY
C = CMOS
TEMPERATURE RANGE
M (Military)
= –55°C to 125°C
L (Commercial) =
0°C to 70°C
DEVICE
40 = Floating-Point DSP
PACKAGE TYPE
KGD = Known Good Die
Figure 1. TMP / SMJ320C40KGD Device Nomenclature
JEDEC STANDARD
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4
Die thickness is approximately 15 mils ± 1 mil.
Backside surface finish is silicon.
Maximum allowable die junction operating temperature is 175°C.
Glassivation material is compressive nitride.
Bond pad metal is composed of copper-doped aluminum.
Percent defective allowed for burned-in die is 5.
Life test data is available.
Configuration control notification.
Group A attribute summary is available (SMJ only).
Suggested die-attach material is silver glass (QMI 2569F).
Suggested bond wire size is 1.25 mil.
For gold bumped KGD die, suggested bonding method is gold-ball bonding.
ESD rating is Class II.
Maximum allowable peak process temperature for die-attach is 440°C ± 5°C (for QMS2569F)
Saw kerf is dependent on blade size used.
Die backside potential is left floating.
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
’320C40 (rev 5.2) known good die pad information
325
Pad Number One
Die Side Number 4
244
1
243
•
•
•
•
•
•
Die Side Number 1
Zero-Zero
(origin)
Die Designator
Die Side Number 3
•
•
•
•
•
•
81
163
82
Die Side Number 2
162
Figure 2. ’320C40 Die Numbering Format
(See Table 1)
Table 1 provides a reference for the following:
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The ’C40 signal identities in relation to the pad numbers
The ’C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0)
In addition, the following notes are significant:
A.
X,Y coordinate data is in microns.
B.
The active silicon dimensions are 12 424.86 µm × 12 035.52 µm (489.16 mils × 473.83 mils).
C.
The die size is approximately 12 598.40 µm × 12 192.00 µm (496.00 mils × 480.00 mils).
D.
Bond pad dimensions are 108.00 µm × 108.00 µm (4.25 mils × 4.25 mils).
E.
Center of bond pad to edge of die min (without scribe) = 107.80 µm (4.24 mils).
F.
For R-Tab devices, gold bump dimensions are approximately 92 µm × 92 µm (3.62 mils × 3.62 mils).
G.
Coordinate origin is at (0,0) (center of bond pad 82).
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
5
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm)
DIE SIDE #1
DIE/TAB BOND
PAD IDENTITY
1
D31
11368.44
126.00 (1, 2)
2
D30
11242.44
126.00 (2, 3)
3
D29
11116.44
126.00 (3, 4)
4
D28
10990.44
126.00 (4, 5)
5
D27
10864.44
126.00 (5, 6)
6
D26
10738.44
126.00 (6, 7)
7
GDDVDD
10612.44
126.00 (7, 8)
8
D25
10486.44
126.00 (8, 9)
9
D24
10360.44
126.00 (9, 10)
10
D23
10234.44
126.00 (10, 11)
Y-COORDINATE OF DIE
BOND PAD
11
D22
10108.44
126.00 (11, 12)
12
D21
9982.44
126.00 (12, 13)
13
D20
9856.44
126.00 (13, 14)
14
D19
9730.44
126.00 (14, 15)
15
D18
9604.44
126.00 (15, 16)
16
D17
9478.44
126.00 (16, 17)
17
D16
9352.44
126.00 (17, 18)
18
9226.44
126.00 (18, 19)
19
CVSS
IVSS
9100.44
126.00 (19, 20)
20
GDDVDD
8974.44
126.00 (20, 21)
21
DVSS
8848.44
126.00 (21, 22)
22
D15
8722.44
126.00 (22, 23)
23
D14
8596.44
126.00 (23, 24)
24
D13
8470.44
126.00 (24, 25)
25
D12
8344.44
126.00 (25, 26)
26
D11
8218.44
126.00 (26, 27)
27
D10
8092.44
126.00 (27, 28)
28
D9
7966.44
126.00 (28, 29)
29
D8
7840.44
126.00 (29, 30)
30
D7
7714.44
126.00 (30, 31)
31
D6
7588.44
126.00 (31, 32)
32
D5
7462.44
126.00 (32, 33)
33
GDDVDD
7336.44
126.00 (33, 34)
34
D4
7210.44
126.00 (34, 35)
35
D3
7084.44
126.00 (35, 36)
36
D2
6958.44
126.00 (36, 37)
37
D1
6832.44
126.00 (37, 38)
38
D0
6706.44
156.42 (38, 39)
39
CE1
6550.02
172.80 (39, 40)
40
RDY1
6377.22
152.10 (40, 41)
41
DVSS
CVSS
6225.12
126.00 (41, 42)
6099.12
126.00 (42, 43)
42
6
X-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
429 48
– 429.48
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #1 (CONTINUED)
DIE/TAB BOND
PAD IDENTITY
43
LOCK
5973.12
126.00 (43, 44)
44
5847.12
126.00 (44, 45)
45
VDDL
VSSL
5721.12
156.42 (45, 46)
46
CE0
5564.70
172.80 (46, 47)
47
RDY0
5391.90
172.80 (47, 48)
48
DE
5219.10
172.80 (48, 49)
49
TCK
5046.30
152.10 (49, 50)
50
TDO
4894.20
156.42 (50, 51)
51
TDI
4737.78
172.80 (51, 52)
52
TMS
4564.98
172.80 (52, 53)
53
TRST
4392.18
151.10 (53, 54)
54
EMU0
4240.08
126.00 (54, 55)
55
EMU1
4114.08
126.00 (55, 56)
56
3988.08
126.00 (56, 57)
3962.08
126.00 (57, 58)
58
DVSS
DVDD
PAGE1
3736.08
126.00 (58, 59)
59
R / W1
3610.08
126.00 (59, 60)
60
STRB1
3484.08
126.00 (60, 61)
61
STAT0
3358.08
126.00 (61, 62)
62
STAT1
3232.08
126.00 (62, 63)
63
3106.08
126.00 (63, 64)
64
IVSS
STAT2
2980.08
126.00 (64, 65)
65
STAT3
2854.08
127.44 (65, 66)
66
PAGE0
2726.64
126.00 (66, 67)
67
R / W0
2600.64
126.00 (67, 68)
68
STRB0
2474.64
156.42 (68, 69)
69
AE
2318.22
174.24 (69, 70)
70
RESETLOC 1
2143.98
152.10 (70, 71)
71
1991.88
156.42 (71, 72)
72
DVDD
RESETLOC 0
1835.46
172.80 (72, 73)
73
RESET
1662.66
172.80 (73, 74)
74
CRDY5
1510.56
126.00 (74, 75)
75
CSTRB5
1384.56
126.00 (75, 76)
76
CACK5
1258.56
126.00 (76, 77)
77
CREQ5
1132.56
126.00 (77, 78)
78
CRDY4
1006.56
126.00 (78, 79)
79
CSTRB4
880.56
126.00 (79, 80)
80
CACK4
754.56
126.00 (80, 81)
81
CREQ4
628.56
57
X-COORDINATE OF DIE
BOND PAD
– 429.48
POST OFFICE BOX 1443
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
• HOUSTON, TEXAS 77251–1443
7
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #2
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
82
CVSS
DVSS
0.00
1062.00 (82, 83)
1062.00
126.00 (83, 84)
DVDD
C5D7
1188.00
126.00 (84, 85)
85
1314.00
126.00 (85, 86)
86
C5D6
1440.00
126.00 (86, 87)
87
C5D5
1566.00
126.00 (87, 88)
88
C5D4
1692.00
126.00 (88, 89)
89
C5D3
1818.00
126.00 (89, 90)
90
C5D2
1944.00
126.00 (90, 91)
91
C5D1
2070.00
126.00 (91, 92)
92
C5D0
2196.00
126.00 (92, 93)
93
2322.00
126.00 (93, 94)
94
DVDD
C4D7
2448.00
126.00 (94, 95)
95
C4D6
2574.00
126.00 (95, 96)
96
C4D5
2700.00
126.00 (96, 97)
97
C4D4
2813.40
126.00 (97, 98)
98
C4D3
2952.00
126.00 (98, 99)
99
C4D2
3078.00
126.00 (99, 100)
100
C4D1
3204.00
126.00 (100, 101)
101
C4D0
3330.00
126.00 (101, 102)
102
CVSS
DVSS
3456.00
3708.00
126.00 (104, 105)
105
DVDD
C3D7
3834.00
126.00 (105, 106)
106
C3D6
3960.00
126.00 (106, 107)
107
C3D5
4086.00
126.00 (107, 108)
108
C3D4
4212.00
126.00 (108, 109)
109
C3D3
4338.00
126.00 (109, 110)
110
C3D2
4464.00
126.00 (110, 111)
83
84
103
104
8
3582.00
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
0 00
0.00
126.00 (102, 103)
126.00 (103, 104)
111
C3D1
4590.00
126.00 (111, 112)
112
C3D0
4716.00
126.00 (112, 113)
113
4842.00
126.00 (113, 114)
114
DVDD
IVSS
4968.00
126.00 (114, 115)
115
C2D7
5094.00
126.00 (115, 116)
116
C2D6
5220.00
126.00 (116, 117)
117
C2D5
5346.00
126.00 (117, 118)
118
C2D4
5472.00
126.00 (118, 119)
119
C2D3
5598.00
126.00 (119, 120)
120
C2D2
5724.00
126.00 (120, 121)
121
C2D1
5850.00
126.00 (121, 122)
122
C2D0
5976.00
126.00 (122, 123)
123
CVSS
6102.00
126.00 (123, 124)
POST OFFICE BOX 1443
• HOUSTON, TEXAS 77251–1443
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #2 (CONTINUED)
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
124
6228.00
126.00 (124, 125)
6354.00
126.00 (125, 126)
126
DVSS
DVDD
CRDY3
6480.00
126.00 (126, 127)
127
CSTRB3
6606.00
126.00 (127, 128)
128
CACK3
6732.00
126.00 (128, 129)
129
CREQ3
6858.00
126.00 (129, 130)
130
6984.00
126.00 (130, 131)
131
VDDL
VSSL
7110.00
126.00 (131, 132)
132
CRDY2
7236.00
126.00 (132, 133)
133
CSTRB2
7362.00
126.00 (133, 134)
134
CACK2
7488.00
126.00 (134, 135)
135
CREQ2
7614.00
126.00 (135, 136)
136
7740.00
126.00 (136, 137)
137
DVDD
CRDY1
7866.00
126.00 (137, 138)
138
CSTRB1
7992.00
126.00 (138, 139)
125
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
139
CACK1
8118.00
126.00 (139, 140)
140
CREQ1
8244.00
126.00 (140, 141)
141
CRDY0
8370.00
126.00 (141, 142)
142
CSTRB0
8496.00
143
CACK0
8622.00
144
CREQ0
8748.00
126.00 (144, 145)
145
CVSS
DVSS
8874.00
126.00 (145, 146)
9000.00
126.00 (146, 147)
9126.00
126.00 (147, 148)
148
IVSS
DVDD
9252.00
126.00 (148, 149)
149
C1D7
9378.00
126.00 (149, 150)
150
C1D6
9504.00
126.00 (150, 151)
151
C1D5
9630.00
126.00 (151, 152)
152
C1D4
9756.00
126.00 (152, 153)
153
C1D3
9882.00
126.00 (153, 154)
154
C1D2
10008.00
126.00 (154, 155)
155
C1D1
10134.00
126.00 (155, 156)
156
C1D0
10260.00
126.00 (156, 157)
157
10386.00
126.00 (157, 158)
158
DVDD
C0D7
10512.00
126.00 (158, 159)
159
C0D6
10638.00
126.00 (159, 160)
160
C0D5
10764.00
126.00 (160, 161)
161
C0D4
10890.00
126.00 (161, 162)
162
C0D3
11016.00
146
147
POST OFFICE BOX 1443
126.00 (142, 143)
0.00
• HOUSTON, TEXAS 77251–1443
126.00 (143, 144)
9
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #3
DIE/TAB BOND
PAD IDENTITY
163
C0D2
810.00
126.00 (163, 164)
164
C0D1
936.00
126.00 (164, 165)
165
C0D0
1062.00
126.00 (165, 166)
166
1188.00
126.00 (166, 167)
167
CVSS
DVDD
1314.00
156.42 (167, 168)
168
ROMEN
1470.42
152.46 (168, 169)
169
IIOF0
1622.88
126.00 (169, 170)
170
DVSS
IIOF1
1748.88
126.00 (170, 171)
171
1874.88
126.00 (171, 172)
172
IIOF2
2000.88
126.00 (172, 173)
173
IIOF3
2126.88
156.42 (173, 174)
174
NMI
2283.30
152.10 (174, 175)
175
LSTRB0
2435.40
126.00 (175, 176)
176
LR / W0
2561.40
126.00 (176, 177)
177
LPAGE0
2687.40
156.42 (177, 178)
178
LRDY0
2843.82
172.80 (178, 179)
179
LCE0
3016.62
152.10 (179, 180)
180
LSTRB1
3168.72
126.00 (180, 181)
181
LR / W1
3294.72
126.00 (181, 182)
182
3420.72
126.00 (182, 183)
183
DVDD
CVSS
3546.72
126.00 (183, 184)
184
LPAGE1
3672.72
156.42 (184, 185)
185
LRDY1
3829.14
172.80 (185, 186)
186
LCE1
4001.94
172.80 (186, 187)
187
LDE
4174.74
152.10 (187, 188)
188
TCLK0
4326.84
126.00 (188, 189)
189
TCLK1
4452.84
126.00 (189, 190)
190
H3
4578.84
126.00 (190, 191)
191
H1
4704.84
156.42 (191, 192)
192
LAE
4861.26
152.10 (192, 193)
193
5013.36
126.00 (193, 194)
194
IVSS
LLOCK
5139.36
126.00 (194, 195)
195
LSTAT0
5265.36
126.00 (195, 196)
196
LSTAT1
5391.36
126.00 (196, 197)
197
LSTAT2
5517.36
126.00 (197, 198)
198
LSTAT3
5643.36
127.44 (198, 199)
199
IACK
5770.80
126.00 (199, 200)
200
VDDL
VSSL
5896.80
126.00 (200, 201)
201
6022.80
131.94 (201, 202)
202
X1
6154.74
171.58 (202, 203)
203
X2 / CLKIN
6326.28
168.12 (203, 204)
204
CVSS
6494.40
126.00 (204, 205)
10
X-COORDINATE OF DIE
BOND PAD
11779 74
11779.74
POST OFFICE BOX 1443
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
• HOUSTON, TEXAS 77251–1443
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #3 (CONTINUED)
DIE/TAB BOND
PAD IDENTITY
205
DVDD
DVSS
6620.40
126.00 (205, 206)
206
6746.40
127.44 (206, 207)
207
LA30
6873.84
126.00 (207, 208)
208
LA29
6999.84
126.00 (208, 209)
209
LA28
7125.84
126.00 (209, 210)
210
LA27
7251.84
126.00 (210, 211)
211
7377.84
126.00 (211, 212)
212
LADVDD
LA26
7503.84
126.00 (212, 213)
213
LA25
7629.84
126.00 (213, 214)
214
LA24
7755.84
126.00 (214, 215)
215
LA23
7881.84
126.00 (215, 216)
216
LA22
8007.84
126.00 (216, 217)
217
LA21
8133.84
126.00 (217, 218)
218
LA20
8259.84
126.00 (218, 219)
219
LA19
8385.84
126.00 (219, 220)
220
LA18
8511.84
126.00 (220, 221)
221
LA17
8637.84
126.00 (221, 222)
222
LA16
8763.84
126.00 (222, 223)
223
LADVDD
CVSS
8889.84
126.00 (223, 224)
9015.84
126.00 (224, 225)
9141.84
126.00 (225, 226)
226
DVSS
LA15
9267.84
126.00 (226, 227)
227
LA14
9393.84
126.00 (227, 228)
228
LA13
9519.84
126.00 (228, 229)
229
LA12
9645.84
126.00 (229, 230)
230
LA11
9771.84
126.00 (230, 231)
231
LA10
9897.84
126.00 (231, 232)
232
LA9
10023.84
126.00 (232, 233)
233
LA8
10149.84
126.00 (233, 234)
234
LA7
10275.84
126.00 (234, 235)
235
LA6
10401.84
126.00 (235, 236)
236
LA5
10527.84
126.00 (236, 237)
237
LA4
10653.84
126.00 (237, 238)
238
10779.84
126.00 (238, 239)
239
LADVDD
LA3
10905.84
126.00 (239, 240)
240
LA2
11031.84
126.00 (240, 241)
241
LA1
11157.84
126.00 (241, 242)
242
LA0
11283.84
205.92 (242, 243)
243
DVSS
11489.76
224
225
X-COORDINATE OF DIE
BOND PAD
11779.74
POST OFFICE BOX 1443
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
• HOUSTON, TEXAS 77251–1443
11
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #4
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
244
CVSS
LD31
10953.72
126.00 (244, 245)
245
10827.72
126.00 (245, 246)
246
LD30
10701.72
126.00 (246, 247)
247
LD29
10575.72
126.00 (247, 248)
248
LD28
10449.72
126.00 (248, 249)
249
10323.72
126.00 (249, 250)
250
LDDVDD
LD27
10197.72
126.00 (250, 251)
251
LD26
10071.72
126.00 (251, 252)
252
LD25
9945.72
126.00 (252, 253)
253
LD24
9819.72
126.00 (253, 254)
254
LD23
9693.72
126.00 (254, 255)
255
LD22
9567.72
126.00 (255, 256)
256
LD21
9441.72
126.00 (256, 257)
257
LD20
9315.72
126.00 (257, 258)
258
LD19
9189.72
126.00 (258, 259)
259
LD18
9063.72
126.00 (259, 260)
260
LD17
8937.72
126.00 (260, 261)
261
LDDVDD
CVSS
8811.72
126.00 (261, 262)
262
8685.72
126.00 (262, 263)
8559.72
126.00 (263, 264)
264
DVSS
IVSS
265
LD16
8307.72
266
LD15
8181.72
126.00 (266, 267)
267
LD14
8055.72
126.00 (267, 268)
268
LD13
7929.72
126.00 (268, 269)
269
LD12
7803.72
126.00 (269, 270)
270
LD11
7677.72
126.00 (270, 271)
271
LD10
7551.72
126.00 (271, 272)
272
LD9
7425.72
126.00 (272, 273)
273
LD8
7299.72
126.00 (273, 274)
274
LD7
7173.72
126.00 (274, 275)
275
LD6
7047.72
126.00 (275, 276)
276
LD5
6921.72
126.00 (276, 277)
277
6795.72
126.00 (277, 278)
278
LDDVDD
LD4
6669.72
126.00 (278, 279)
279
LD3
6543.72
126.00 (279, 280)
280
LD2
6417.72
126.00 (280, 281)
281
LD1
6291.72
126.00 (281, 282)
282
LD0
6165.72
127.62 (282, 283)
283
6038.10
126.00 (283, 284)
284
VDDL
VSSL
5912.10
126.00 (284, 285)
285
CVSS
5786.10
126.00 (285, 286)
263
12
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
8433.72
POST OFFICE BOX 1443
11819 88
11819.88
• HOUSTON, TEXAS 77251–1443
126.00 (264, 265)
126.00 (265, 266)
TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT
FLOATING-POINT DIGITAL SIGNAL PROCESSOR
KNOWN GOOD DIES
SGUS024B – MARCH 1997 – REVISED APRIL 2000
Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued)
DIE SIDE #4 (CONTINUED)
DIE/TAB BOND
PAD IDENTITY
X-COORDINATE OF DIE
BOND PAD
286
DVSS
A30
5660.10
126.00 (286, 287)
287
5534.10
126.00 (287, 288)
288
A29
5408.10
126.00 (288, 289)
289
A28
5282.10
126.00 (289, 290)
290
GADVDD
5156.10
126.00 (290, 291)
291
A27
5030.10
126.00 (291, 292)
292
A26
4904.10
126.00 (292, 293)
293
A25
4778.10
126.00 (293, 294)
294
A24
4652.10
126.00 (294, 295)
295
A23
4526.10
126.00 (295, 296)
296
A22
4400.10
126.00 (296, 297)
297
A21
4274.10
126.00 (297, 298)
298
A20
4148.10
126.00 (298, 299)
299
A19
4022.10
126.00 (299, 300)
300
A18
3896.10
126.00 (300, 301)
301
A17
3770.10
126.00 (301, 302)
302
GADVDD
3644.10
126.00 (302, 303)
303
3518.10
126.00 (303, 304)
304
CVSS
DVSS
3392.10
126.00 (304, 305)
305
A16
3266.10
306
A15
3140.10
307
A14
3014.10
126.00 (307, 308)
308
A13
2888.10
126.00 (308, 309)
309
A12
2762.10
126.00 (309, 310)
310
A11
2636.10
126.00 (310, 311)
311
A10
2510.10
126.00 (311, 312)
312
A9
2384.10
126.00 (312, 313)
313
A8
2258.10
126.00 (313, 314)
314
A7
2132.10
126.00 (314, 315)
315
A6
2006.10
126.00 (315, 316)
316
A5
1880.10
126.00 (316, 317)
317
A4
1754.10
126.00 (317, 318)
318
GADVDD
1628.10
126.00 (318, 319)
319
A3
1502.10
126.00 (319, 320)
320
A2
1376.10
126.00 (320, 321)
321
A1
1250.10
126.00 (321, 322)
322
A0
1124.10
126.00 (322, 323)
323
CVSS
DVSS
998.10
558.00 (323, 324)
324
440.10
630.00 (324, 325)
325
SUBS
– 189.90
POST OFFICE BOX 1443
Y-COORDINATE OF DIE
BOND PAD
PITCH OF LEAD
(#, #) REFERENCES WHICH DIE
BOND PADS
C40 DIE BOND
PAD LOCATIONS
11819 88
11819.88
• HOUSTON, TEXAS 77251–1443
126.00 (305, 306)
126.00 (306, 307)
13
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