TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 D D D D D D D D D D D D D SMJ: QML Processing to MIL–PRF–38535 TMP: Commercial Level Processing Operating Temperature Ranges: – Military (M) – 55°C to 125°C – Commercial (C) – 25°C to 85°C – Commercial (L) 0°C to 70°C Highest Performance Floating-Point Digital Signal Processor (DSP) – ’C40-50: 40-ns Instruction Cycle Time: 50 MFLOPS, 25 MIPS, 275 MOPS, 320 MBps – ’C40-40: 50-ns Instruction Cycle Time: 40 MFLOPS, 20 MIPS, 220 MOPS, 256 MBps Six Communications Ports 6-Channel Direct Memory Access (DMA) Coprocessor Single-Cycle Conversion to and From IEEE-745 Floating-Point Format Single Cycle 1/x, 1/ Ǹ x Source-Code Compatible With SMJ320C30 Validated Ada Compiler Single-Cycle 40-Bit Floating-Point, 32-Bit Integer Multipliers 12 40-Bit Registers, 8 Auxiliary Registers, 14 Control Registers, and 2 Timers IEEE Standard 1149.1† Test-Access Port (JTAG) D D D D Two Identical External Data and Address Buses Supporting Shared Memory Systems and High Data-Rate, Single-Cycle Transfers: – High Port-Data Rate of 100 MBytes/s (Each Bus) – 16G-Byte Continuous Program/Data/Peripheral Address Space – Memory-Access Request for Fast, Intelligent Bus Arbitration – Separate Address-, Data-, and Control-Enable Pins – Four Sets of Memory-Control Signals Support Different Speed Memories in Hardware Fabricated Using 0.72-µm Enhanced Performance Implanted CMOS (EPIC) Technology by Texas Instruments (TI) Separate Internal Program, Data, and DMA Coprocessor Buses for Support of Massive Concurrent Input/Output (I/O) of Program and Data Throughput, Maximizing Sustained Central Processing Unit (CPU) Performance On-Chip Program Cache and Dual-Access/Single-Cycle RAM for Increased Memory-Access Performance – 512-Byte Instruction Cache – 8K Bytes of Single-Cycle Dual-Access Program or Data RAM – ROM-Based Bootloader Supports Program Bootup Using 8-, 16-, or 32-Bit Memories Over Any One of the Communications Ports description The TMP / SMJ320C40KGD DSP is a 32-bit, floating-point processor manufactured in 0.72-µm, double-level metal CMOS technology. It is the fourth generation of DSPs from Texas Instruments, and it is the world’s first DSP designed for parallel processing. The on-chip parallel processing capabilities of the ’C40 make the floating-point performance required by many applications achievable and cost-effective. The TMP / SMJ320C40 is the first DSP with on-chip communication ports for processor-to-processor communication using simple communication software with no external hardware. This allows connectivity with no external glue logic. The communication ports remove I/O bottlenecks, and the independent smart-DMA coprocessor is able to handle the CPU I/O requirements. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. † IEEE Standard 1149.1–1990 Standard Test-Access Port and Boundary-Scan Architecture EPIC and TI are trademarks of Texas Instruments Incorporated. Copyright 2000, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 1443 On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. • HOUSTON, TEXAS 77251–1443 1 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 description (continued) The features of the communication ports are: D D D D Six communication ports for direct interprocessor communication and processor I/O 20 MBps bidirectional interface on each communication port for high-speed and low-cost multiprocessor interface Separate input and output first-in, first-out (FIFO) buffers for I / O and processor-to-processor communication Automatic arbitration and handshaking for direct processor-to-processor connection The DMA coprocessor allows concurrent I/O and CPU processing for superior sustained CPU performance. The key features of the DMA coprocessor: D D D Link pointers that allow DMA channels to auto-initialize Parallel CPU operation and DMA transfers Six DMA channels support communication-port-to-memory data transfers The TMP/SMJ320C40KGD CPU is configured for high-speed internal parallel processing. The key features of the CPU are: D D D D D Eight operations / cycles – 40- / 32-bit floating-point / integer multiply – 40-/32-bit floating-point / integer arithmetic and logic unit (ALU) operation – Two data accesses – Two address-register updates IEEE floating-point conversion Division and square-root support ’C30 assembly language compatibility Byte and halfword accessibility Key factors in a parallel-processing implementation are the development tools that are available. The ’C40 is supported by a host of parallel-processing development tools for developing and simulating code and for debugging parallel-processing systems. The code generation tools include: D D D Optimizing ANSI C compiler with a runtime library that supports use of communication ports and DMA SPOX, by Spectron Microsystems Incorporated, which provides parallel processing support as well as DMA and communication port drivers Assembler and linker with support for mapping program and data to parallel processors. SPOX is a trademark of Spectron Microsystems, Inc. 2 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 description (continued) The simulation tools include: D D Parallel DSP system-level simulation, by Logic Modeling Corporation (LMC), which includes a hardware verification (HV) model and a full functional (FF) model TI software simulator with high-level language debugger interface for simulating a single processor The hardware development and verification tools include: D D Parallel processor in-circuit emulator and high-level language debugger: XDS510 Parallel processor development system with four TMS320C40s, local and global memory, and communication port connections known good die technology Known good die (KGD) options are offered for use in multichip modules and chip-on-board (COB) applications. There are currently two verification technologies used at TI to support KGD requirements for the TMP/SMJ320C40KGD: Removable Tab (R-Tab), and Temporary Wire Bond (TWB). The availability of selected DSP products in a tape-automated bond (TAB) configuration has made possible the use of a removable TAB technique. The TAB leadframe is attached to a gold-bumped die using modified bonding parameters. This technique allows easy removal of the tape after all needed 100% screens and parametric tests have been performed. The tape is removed from the tested part and the die is shipped in a conventional die container. The gold bumps remain on the bond pads, which allow for subsequent attachment of gold-ball bonds. Similarly, with KGD using the TWB technique, bond wires are attached to the bond pads using adjusted bonding parameters which allow for easy removal of the die after all needed 100% screens and parametric tests have been performed. The die is removed from the temporary package and the die is shipped in a conventional die container. visual inspection of known good die (KGD) using temporary wire bond (TWB) process QML KGD devices produced using the TWB technology do not optically meet MIL-STD-883E (Method 2010, paragraph 3.1.1.1.h) metal bond pad visual inspection criterion due to the bond pad marks formed during bonding removal process. However, these devices have been reliably bonded using normal wire bond precesses, and pass bond strength evaluations. electrical specifications For military electrical and timing specifications, please refer to the SMJ320C40 Digital Signal Processor data sheet, literature number SGUS017. For commercial electrical and timing specifications, see the TMS320C40 Digital Signal Processor Data Sheet, literature number SPRS038. XDS510 is a trademark of Texas Instruments Incorporated. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 3 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 SMJ PREFIX SMJ = TMP = 320 C 40 KGD M 50 C T KGD OPTION T = TWB process blank = R-Tab process MIL-PRF-38535 Processing Commercial Level DIE REVISION C = Revision 5.2 DEVICE FAMILY 320 = DSP Family SPEED RANGE 40 = 40 MHz 50 = 50 MHz TECHNOLOGY C = CMOS TEMPERATURE RANGE M (Military) = –55°C to 125°C L (Commercial) = 0°C to 70°C DEVICE 40 = Floating-Point DSP PACKAGE TYPE KGD = Known Good Die Figure 1. TMP / SMJ320C40KGD Device Nomenclature JEDEC STANDARD D D D D D D D D D D D D D D D D 4 Die thickness is approximately 15 mils ± 1 mil. Backside surface finish is silicon. Maximum allowable die junction operating temperature is 175°C. Glassivation material is compressive nitride. Bond pad metal is composed of copper-doped aluminum. Percent defective allowed for burned-in die is 5. Life test data is available. Configuration control notification. Group A attribute summary is available (SMJ only). Suggested die-attach material is silver glass (QMI 2569F). Suggested bond wire size is 1.25 mil. For gold bumped KGD die, suggested bonding method is gold-ball bonding. ESD rating is Class II. Maximum allowable peak process temperature for die-attach is 440°C ± 5°C (for QMS2569F) Saw kerf is dependent on blade size used. Die backside potential is left floating. POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 ’320C40 (rev 5.2) known good die pad information 325 Pad Number One Die Side Number 4 244 1 243 • • • • • • Die Side Number 1 Zero-Zero (origin) Die Designator Die Side Number 3 • • • • • • 81 163 82 Die Side Number 2 162 Figure 2. ’320C40 Die Numbering Format (See Table 1) Table 1 provides a reference for the following: D D The ’C40 signal identities in relation to the pad numbers The ’C40 X,Y coordinates, where bond pad 82 serves as the origin (0,0) In addition, the following notes are significant: A. X,Y coordinate data is in microns. B. The active silicon dimensions are 12 424.86 µm × 12 035.52 µm (489.16 mils × 473.83 mils). C. The die size is approximately 12 598.40 µm × 12 192.00 µm (496.00 mils × 480.00 mils). D. Bond pad dimensions are 108.00 µm × 108.00 µm (4.25 mils × 4.25 mils). E. Center of bond pad to edge of die min (without scribe) = 107.80 µm (4.24 mils). F. For R-Tab devices, gold bump dimensions are approximately 92 µm × 92 µm (3.62 mils × 3.62 mils). G. Coordinate origin is at (0,0) (center of bond pad 82). POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 5 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) DIE SIDE #1 DIE/TAB BOND PAD IDENTITY 1 D31 11368.44 126.00 (1, 2) 2 D30 11242.44 126.00 (2, 3) 3 D29 11116.44 126.00 (3, 4) 4 D28 10990.44 126.00 (4, 5) 5 D27 10864.44 126.00 (5, 6) 6 D26 10738.44 126.00 (6, 7) 7 GDDVDD 10612.44 126.00 (7, 8) 8 D25 10486.44 126.00 (8, 9) 9 D24 10360.44 126.00 (9, 10) 10 D23 10234.44 126.00 (10, 11) Y-COORDINATE OF DIE BOND PAD 11 D22 10108.44 126.00 (11, 12) 12 D21 9982.44 126.00 (12, 13) 13 D20 9856.44 126.00 (13, 14) 14 D19 9730.44 126.00 (14, 15) 15 D18 9604.44 126.00 (15, 16) 16 D17 9478.44 126.00 (16, 17) 17 D16 9352.44 126.00 (17, 18) 18 9226.44 126.00 (18, 19) 19 CVSS IVSS 9100.44 126.00 (19, 20) 20 GDDVDD 8974.44 126.00 (20, 21) 21 DVSS 8848.44 126.00 (21, 22) 22 D15 8722.44 126.00 (22, 23) 23 D14 8596.44 126.00 (23, 24) 24 D13 8470.44 126.00 (24, 25) 25 D12 8344.44 126.00 (25, 26) 26 D11 8218.44 126.00 (26, 27) 27 D10 8092.44 126.00 (27, 28) 28 D9 7966.44 126.00 (28, 29) 29 D8 7840.44 126.00 (29, 30) 30 D7 7714.44 126.00 (30, 31) 31 D6 7588.44 126.00 (31, 32) 32 D5 7462.44 126.00 (32, 33) 33 GDDVDD 7336.44 126.00 (33, 34) 34 D4 7210.44 126.00 (34, 35) 35 D3 7084.44 126.00 (35, 36) 36 D2 6958.44 126.00 (36, 37) 37 D1 6832.44 126.00 (37, 38) 38 D0 6706.44 156.42 (38, 39) 39 CE1 6550.02 172.80 (39, 40) 40 RDY1 6377.22 152.10 (40, 41) 41 DVSS CVSS 6225.12 126.00 (41, 42) 6099.12 126.00 (42, 43) 42 6 X-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS 429 48 – 429.48 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #1 (CONTINUED) DIE/TAB BOND PAD IDENTITY 43 LOCK 5973.12 126.00 (43, 44) 44 5847.12 126.00 (44, 45) 45 VDDL VSSL 5721.12 156.42 (45, 46) 46 CE0 5564.70 172.80 (46, 47) 47 RDY0 5391.90 172.80 (47, 48) 48 DE 5219.10 172.80 (48, 49) 49 TCK 5046.30 152.10 (49, 50) 50 TDO 4894.20 156.42 (50, 51) 51 TDI 4737.78 172.80 (51, 52) 52 TMS 4564.98 172.80 (52, 53) 53 TRST 4392.18 151.10 (53, 54) 54 EMU0 4240.08 126.00 (54, 55) 55 EMU1 4114.08 126.00 (55, 56) 56 3988.08 126.00 (56, 57) 3962.08 126.00 (57, 58) 58 DVSS DVDD PAGE1 3736.08 126.00 (58, 59) 59 R / W1 3610.08 126.00 (59, 60) 60 STRB1 3484.08 126.00 (60, 61) 61 STAT0 3358.08 126.00 (61, 62) 62 STAT1 3232.08 126.00 (62, 63) 63 3106.08 126.00 (63, 64) 64 IVSS STAT2 2980.08 126.00 (64, 65) 65 STAT3 2854.08 127.44 (65, 66) 66 PAGE0 2726.64 126.00 (66, 67) 67 R / W0 2600.64 126.00 (67, 68) 68 STRB0 2474.64 156.42 (68, 69) 69 AE 2318.22 174.24 (69, 70) 70 RESETLOC 1 2143.98 152.10 (70, 71) 71 1991.88 156.42 (71, 72) 72 DVDD RESETLOC 0 1835.46 172.80 (72, 73) 73 RESET 1662.66 172.80 (73, 74) 74 CRDY5 1510.56 126.00 (74, 75) 75 CSTRB5 1384.56 126.00 (75, 76) 76 CACK5 1258.56 126.00 (76, 77) 77 CREQ5 1132.56 126.00 (77, 78) 78 CRDY4 1006.56 126.00 (78, 79) 79 CSTRB4 880.56 126.00 (79, 80) 80 CACK4 754.56 126.00 (80, 81) 81 CREQ4 628.56 57 X-COORDINATE OF DIE BOND PAD – 429.48 POST OFFICE BOX 1443 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS • HOUSTON, TEXAS 77251–1443 7 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #2 DIE/TAB BOND PAD IDENTITY X-COORDINATE OF DIE BOND PAD 82 CVSS DVSS 0.00 1062.00 (82, 83) 1062.00 126.00 (83, 84) DVDD C5D7 1188.00 126.00 (84, 85) 85 1314.00 126.00 (85, 86) 86 C5D6 1440.00 126.00 (86, 87) 87 C5D5 1566.00 126.00 (87, 88) 88 C5D4 1692.00 126.00 (88, 89) 89 C5D3 1818.00 126.00 (89, 90) 90 C5D2 1944.00 126.00 (90, 91) 91 C5D1 2070.00 126.00 (91, 92) 92 C5D0 2196.00 126.00 (92, 93) 93 2322.00 126.00 (93, 94) 94 DVDD C4D7 2448.00 126.00 (94, 95) 95 C4D6 2574.00 126.00 (95, 96) 96 C4D5 2700.00 126.00 (96, 97) 97 C4D4 2813.40 126.00 (97, 98) 98 C4D3 2952.00 126.00 (98, 99) 99 C4D2 3078.00 126.00 (99, 100) 100 C4D1 3204.00 126.00 (100, 101) 101 C4D0 3330.00 126.00 (101, 102) 102 CVSS DVSS 3456.00 3708.00 126.00 (104, 105) 105 DVDD C3D7 3834.00 126.00 (105, 106) 106 C3D6 3960.00 126.00 (106, 107) 107 C3D5 4086.00 126.00 (107, 108) 108 C3D4 4212.00 126.00 (108, 109) 109 C3D3 4338.00 126.00 (109, 110) 110 C3D2 4464.00 126.00 (110, 111) 83 84 103 104 8 3582.00 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS 0 00 0.00 126.00 (102, 103) 126.00 (103, 104) 111 C3D1 4590.00 126.00 (111, 112) 112 C3D0 4716.00 126.00 (112, 113) 113 4842.00 126.00 (113, 114) 114 DVDD IVSS 4968.00 126.00 (114, 115) 115 C2D7 5094.00 126.00 (115, 116) 116 C2D6 5220.00 126.00 (116, 117) 117 C2D5 5346.00 126.00 (117, 118) 118 C2D4 5472.00 126.00 (118, 119) 119 C2D3 5598.00 126.00 (119, 120) 120 C2D2 5724.00 126.00 (120, 121) 121 C2D1 5850.00 126.00 (121, 122) 122 C2D0 5976.00 126.00 (122, 123) 123 CVSS 6102.00 126.00 (123, 124) POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #2 (CONTINUED) DIE/TAB BOND PAD IDENTITY X-COORDINATE OF DIE BOND PAD 124 6228.00 126.00 (124, 125) 6354.00 126.00 (125, 126) 126 DVSS DVDD CRDY3 6480.00 126.00 (126, 127) 127 CSTRB3 6606.00 126.00 (127, 128) 128 CACK3 6732.00 126.00 (128, 129) 129 CREQ3 6858.00 126.00 (129, 130) 130 6984.00 126.00 (130, 131) 131 VDDL VSSL 7110.00 126.00 (131, 132) 132 CRDY2 7236.00 126.00 (132, 133) 133 CSTRB2 7362.00 126.00 (133, 134) 134 CACK2 7488.00 126.00 (134, 135) 135 CREQ2 7614.00 126.00 (135, 136) 136 7740.00 126.00 (136, 137) 137 DVDD CRDY1 7866.00 126.00 (137, 138) 138 CSTRB1 7992.00 126.00 (138, 139) 125 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS 139 CACK1 8118.00 126.00 (139, 140) 140 CREQ1 8244.00 126.00 (140, 141) 141 CRDY0 8370.00 126.00 (141, 142) 142 CSTRB0 8496.00 143 CACK0 8622.00 144 CREQ0 8748.00 126.00 (144, 145) 145 CVSS DVSS 8874.00 126.00 (145, 146) 9000.00 126.00 (146, 147) 9126.00 126.00 (147, 148) 148 IVSS DVDD 9252.00 126.00 (148, 149) 149 C1D7 9378.00 126.00 (149, 150) 150 C1D6 9504.00 126.00 (150, 151) 151 C1D5 9630.00 126.00 (151, 152) 152 C1D4 9756.00 126.00 (152, 153) 153 C1D3 9882.00 126.00 (153, 154) 154 C1D2 10008.00 126.00 (154, 155) 155 C1D1 10134.00 126.00 (155, 156) 156 C1D0 10260.00 126.00 (156, 157) 157 10386.00 126.00 (157, 158) 158 DVDD C0D7 10512.00 126.00 (158, 159) 159 C0D6 10638.00 126.00 (159, 160) 160 C0D5 10764.00 126.00 (160, 161) 161 C0D4 10890.00 126.00 (161, 162) 162 C0D3 11016.00 146 147 POST OFFICE BOX 1443 126.00 (142, 143) 0.00 • HOUSTON, TEXAS 77251–1443 126.00 (143, 144) 9 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #3 DIE/TAB BOND PAD IDENTITY 163 C0D2 810.00 126.00 (163, 164) 164 C0D1 936.00 126.00 (164, 165) 165 C0D0 1062.00 126.00 (165, 166) 166 1188.00 126.00 (166, 167) 167 CVSS DVDD 1314.00 156.42 (167, 168) 168 ROMEN 1470.42 152.46 (168, 169) 169 IIOF0 1622.88 126.00 (169, 170) 170 DVSS IIOF1 1748.88 126.00 (170, 171) 171 1874.88 126.00 (171, 172) 172 IIOF2 2000.88 126.00 (172, 173) 173 IIOF3 2126.88 156.42 (173, 174) 174 NMI 2283.30 152.10 (174, 175) 175 LSTRB0 2435.40 126.00 (175, 176) 176 LR / W0 2561.40 126.00 (176, 177) 177 LPAGE0 2687.40 156.42 (177, 178) 178 LRDY0 2843.82 172.80 (178, 179) 179 LCE0 3016.62 152.10 (179, 180) 180 LSTRB1 3168.72 126.00 (180, 181) 181 LR / W1 3294.72 126.00 (181, 182) 182 3420.72 126.00 (182, 183) 183 DVDD CVSS 3546.72 126.00 (183, 184) 184 LPAGE1 3672.72 156.42 (184, 185) 185 LRDY1 3829.14 172.80 (185, 186) 186 LCE1 4001.94 172.80 (186, 187) 187 LDE 4174.74 152.10 (187, 188) 188 TCLK0 4326.84 126.00 (188, 189) 189 TCLK1 4452.84 126.00 (189, 190) 190 H3 4578.84 126.00 (190, 191) 191 H1 4704.84 156.42 (191, 192) 192 LAE 4861.26 152.10 (192, 193) 193 5013.36 126.00 (193, 194) 194 IVSS LLOCK 5139.36 126.00 (194, 195) 195 LSTAT0 5265.36 126.00 (195, 196) 196 LSTAT1 5391.36 126.00 (196, 197) 197 LSTAT2 5517.36 126.00 (197, 198) 198 LSTAT3 5643.36 127.44 (198, 199) 199 IACK 5770.80 126.00 (199, 200) 200 VDDL VSSL 5896.80 126.00 (200, 201) 201 6022.80 131.94 (201, 202) 202 X1 6154.74 171.58 (202, 203) 203 X2 / CLKIN 6326.28 168.12 (203, 204) 204 CVSS 6494.40 126.00 (204, 205) 10 X-COORDINATE OF DIE BOND PAD 11779 74 11779.74 POST OFFICE BOX 1443 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS • HOUSTON, TEXAS 77251–1443 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #3 (CONTINUED) DIE/TAB BOND PAD IDENTITY 205 DVDD DVSS 6620.40 126.00 (205, 206) 206 6746.40 127.44 (206, 207) 207 LA30 6873.84 126.00 (207, 208) 208 LA29 6999.84 126.00 (208, 209) 209 LA28 7125.84 126.00 (209, 210) 210 LA27 7251.84 126.00 (210, 211) 211 7377.84 126.00 (211, 212) 212 LADVDD LA26 7503.84 126.00 (212, 213) 213 LA25 7629.84 126.00 (213, 214) 214 LA24 7755.84 126.00 (214, 215) 215 LA23 7881.84 126.00 (215, 216) 216 LA22 8007.84 126.00 (216, 217) 217 LA21 8133.84 126.00 (217, 218) 218 LA20 8259.84 126.00 (218, 219) 219 LA19 8385.84 126.00 (219, 220) 220 LA18 8511.84 126.00 (220, 221) 221 LA17 8637.84 126.00 (221, 222) 222 LA16 8763.84 126.00 (222, 223) 223 LADVDD CVSS 8889.84 126.00 (223, 224) 9015.84 126.00 (224, 225) 9141.84 126.00 (225, 226) 226 DVSS LA15 9267.84 126.00 (226, 227) 227 LA14 9393.84 126.00 (227, 228) 228 LA13 9519.84 126.00 (228, 229) 229 LA12 9645.84 126.00 (229, 230) 230 LA11 9771.84 126.00 (230, 231) 231 LA10 9897.84 126.00 (231, 232) 232 LA9 10023.84 126.00 (232, 233) 233 LA8 10149.84 126.00 (233, 234) 234 LA7 10275.84 126.00 (234, 235) 235 LA6 10401.84 126.00 (235, 236) 236 LA5 10527.84 126.00 (236, 237) 237 LA4 10653.84 126.00 (237, 238) 238 10779.84 126.00 (238, 239) 239 LADVDD LA3 10905.84 126.00 (239, 240) 240 LA2 11031.84 126.00 (240, 241) 241 LA1 11157.84 126.00 (241, 242) 242 LA0 11283.84 205.92 (242, 243) 243 DVSS 11489.76 224 225 X-COORDINATE OF DIE BOND PAD 11779.74 POST OFFICE BOX 1443 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS • HOUSTON, TEXAS 77251–1443 11 TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #4 DIE/TAB BOND PAD IDENTITY X-COORDINATE OF DIE BOND PAD 244 CVSS LD31 10953.72 126.00 (244, 245) 245 10827.72 126.00 (245, 246) 246 LD30 10701.72 126.00 (246, 247) 247 LD29 10575.72 126.00 (247, 248) 248 LD28 10449.72 126.00 (248, 249) 249 10323.72 126.00 (249, 250) 250 LDDVDD LD27 10197.72 126.00 (250, 251) 251 LD26 10071.72 126.00 (251, 252) 252 LD25 9945.72 126.00 (252, 253) 253 LD24 9819.72 126.00 (253, 254) 254 LD23 9693.72 126.00 (254, 255) 255 LD22 9567.72 126.00 (255, 256) 256 LD21 9441.72 126.00 (256, 257) 257 LD20 9315.72 126.00 (257, 258) 258 LD19 9189.72 126.00 (258, 259) 259 LD18 9063.72 126.00 (259, 260) 260 LD17 8937.72 126.00 (260, 261) 261 LDDVDD CVSS 8811.72 126.00 (261, 262) 262 8685.72 126.00 (262, 263) 8559.72 126.00 (263, 264) 264 DVSS IVSS 265 LD16 8307.72 266 LD15 8181.72 126.00 (266, 267) 267 LD14 8055.72 126.00 (267, 268) 268 LD13 7929.72 126.00 (268, 269) 269 LD12 7803.72 126.00 (269, 270) 270 LD11 7677.72 126.00 (270, 271) 271 LD10 7551.72 126.00 (271, 272) 272 LD9 7425.72 126.00 (272, 273) 273 LD8 7299.72 126.00 (273, 274) 274 LD7 7173.72 126.00 (274, 275) 275 LD6 7047.72 126.00 (275, 276) 276 LD5 6921.72 126.00 (276, 277) 277 6795.72 126.00 (277, 278) 278 LDDVDD LD4 6669.72 126.00 (278, 279) 279 LD3 6543.72 126.00 (279, 280) 280 LD2 6417.72 126.00 (280, 281) 281 LD1 6291.72 126.00 (281, 282) 282 LD0 6165.72 127.62 (282, 283) 283 6038.10 126.00 (283, 284) 284 VDDL VSSL 5912.10 126.00 (284, 285) 285 CVSS 5786.10 126.00 (285, 286) 263 12 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS 8433.72 POST OFFICE BOX 1443 11819 88 11819.88 • HOUSTON, TEXAS 77251–1443 126.00 (264, 265) 126.00 (265, 266) TMP320C40KGDC, SMJ320C40KGDC, TMP320C40KGDCT, SMJ320C40KGDCT FLOATING-POINT DIGITAL SIGNAL PROCESSOR KNOWN GOOD DIES SGUS024B – MARCH 1997 – REVISED APRIL 2000 Table 1. ’320C40 Die Pad / TAB Lead Information : Rev. 5.2 (0,72 µm) (Continued) DIE SIDE #4 (CONTINUED) DIE/TAB BOND PAD IDENTITY X-COORDINATE OF DIE BOND PAD 286 DVSS A30 5660.10 126.00 (286, 287) 287 5534.10 126.00 (287, 288) 288 A29 5408.10 126.00 (288, 289) 289 A28 5282.10 126.00 (289, 290) 290 GADVDD 5156.10 126.00 (290, 291) 291 A27 5030.10 126.00 (291, 292) 292 A26 4904.10 126.00 (292, 293) 293 A25 4778.10 126.00 (293, 294) 294 A24 4652.10 126.00 (294, 295) 295 A23 4526.10 126.00 (295, 296) 296 A22 4400.10 126.00 (296, 297) 297 A21 4274.10 126.00 (297, 298) 298 A20 4148.10 126.00 (298, 299) 299 A19 4022.10 126.00 (299, 300) 300 A18 3896.10 126.00 (300, 301) 301 A17 3770.10 126.00 (301, 302) 302 GADVDD 3644.10 126.00 (302, 303) 303 3518.10 126.00 (303, 304) 304 CVSS DVSS 3392.10 126.00 (304, 305) 305 A16 3266.10 306 A15 3140.10 307 A14 3014.10 126.00 (307, 308) 308 A13 2888.10 126.00 (308, 309) 309 A12 2762.10 126.00 (309, 310) 310 A11 2636.10 126.00 (310, 311) 311 A10 2510.10 126.00 (311, 312) 312 A9 2384.10 126.00 (312, 313) 313 A8 2258.10 126.00 (313, 314) 314 A7 2132.10 126.00 (314, 315) 315 A6 2006.10 126.00 (315, 316) 316 A5 1880.10 126.00 (316, 317) 317 A4 1754.10 126.00 (317, 318) 318 GADVDD 1628.10 126.00 (318, 319) 319 A3 1502.10 126.00 (319, 320) 320 A2 1376.10 126.00 (320, 321) 321 A1 1250.10 126.00 (321, 322) 322 A0 1124.10 126.00 (322, 323) 323 CVSS DVSS 998.10 558.00 (323, 324) 324 440.10 630.00 (324, 325) 325 SUBS – 189.90 POST OFFICE BOX 1443 Y-COORDINATE OF DIE BOND PAD PITCH OF LEAD (#, #) REFERENCES WHICH DIE BOND PADS C40 DIE BOND PAD LOCATIONS 11819 88 11819.88 • HOUSTON, TEXAS 77251–1443 126.00 (305, 306) 126.00 (306, 307) 13 IMPORTANT NOTICE Texas Instruments 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