GULFSEMI BYV26EAGP

BYV26EAGP
SINTERED GLASS JUNCTION
FAST SWITCHING PLASTIC RECTIFIER
VOLTAGE: 1000V
CURRENT: 1.5A
FEATURE
DO-15
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC blocking Voltage
Reverse avalanche breakdown voltage
at IR = 0.1 mA
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage at 1.0A
Non-repetitive peak reverse avalanche energy
(Note 1)
Maximum DC Reverse Current
Ta =25°C
at rated DC blocking voltage
Ta =150°C
Maximum Reverse Recovery Time (Note 2)
Typical Junction Capacitance
(Note 3)
Typical Thermal Resistance
(Note 4)
Storage and Operating Junction Temperature
SYMBOL
BYV26EAGP
units
Vrrm
Vrms
Vdc
1000
700
1000
V
V
V
V(BR)R
1100min
V
If(av)
1.5
A
Ifsm
30
A
Vf
2.5
V
Ersm
10
mJ
Ir
Trr
Cj
Rth(ja)
Tstg, Tj
5.0
150.0
75
15.0
55.0
-65 to +175
µA
nS
pF
°C /W
°C
Note: 1. IR=400mA; Tj=Tjmax prior to surge; inductive load switched off
2. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
3. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc
4. Thermal Resistance from Junction to Ambient at 3/8”lead length, P.C. Board Mounted
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES BYV26EAGP
Rev.A1
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