GULFSEMI SBYT42M

SBYT42M
SINTERED GLASS JUNCTION
SURFACE MOUNTED RECTIFIER
VOLTAGE: 1000V
CURRENT: 1.25A
FEATURE
GF1/ DO-214BA
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of
MIL-S-19500
High temperature soldering guaranteed
450℃/5sec at terminal
Complete device submersible temperature of
265℃ for 10 seconds in solder bath
Operate at Ta =55°C with no thermal run away
Typical Ir<0.1µA
Fast Soft Recovery Rectifier
MECHANICAL DATA
Terminal: Plated axial leads solderable per
MIL-STD 202E, method 208C
Case: Molded with UL-94 Class V-0 recognized Flame
Retardant Epoxy
Polarity: color band denotes cathode
Mounting position: any
Mark: T42M
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(single-phase, half-wave, 60HZ, resistive or inductive load rating at 25°C, unless otherwise stated)
SYMBOL
SBYT42M
units
Maximum Recurrent Peak Reverse Voltage
Vrrm
1000
V
Maximum RMS Voltage
Vrms
700
V
Maximum DC blocking Voltage
Vdc
1000
V
Maximum Average Forward Rectified
Current 3/8”lead length at Ta =55°C
Peak Forward Surge Current 8.3ms single
half sine-wave superimposed on rated load
Maximum Forward Voltage atForward Current
1.0A and 25°C
Maximum DC Reverse Current
Ta =25°C
at rated DC blocking voltage
Ta =150°C
If(av)
1.25
A
Ifsm
30.0
A
Vf
1.4
V
Ir
5.0
150.0
µA
(Note 1)
Trr
200
nS
Non repetitive reverse avalanche energy
I(BR)R=0.4A
Er
10.0
mJ
(Note 2)
Rth(ja)
55.0
°C /W
Storage and Operating Junction Temperature
Tstg, Tj
-65 to +175
°C
Maximum Reverse Recovery Time
Typical Thermal Resistance
Note:
1. Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
2. Thermal Resistance from Junction to Ambient, P.C.B. Mounted on 0.2×0.2″(5.0×5.0mm) copper pad areas
Rev.A1
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RATINGS AND CHARACTERISTIC CURVES SBYT42M
Rev.A1
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