HT7465 2A Step-Down DC to DC Converter Feature General Description • Input voltage range: 4.75V to 24V The HT7465 is a 2A high efficiency step-down DCDC converter which includes a fully integrated MOS power transistor. The device uses a current-mode control operating methodology and can operate over a wide input voltage range of 4.75V to 24V for which it can provide a stable adjustable output voltage. • Variable output voltage range: 0.92V to 20V • 2A output current • Efficiency up to 92% • Fixed 380kHz operating frequency • 20mA shutdown current The device includes over temperature protection, over current protection and under voltage lockout protection, features which combine to prevent device damage due to overload conditions. In its shutdown mode the regulator draws a mere 20uA of supply current. • Internal power MOSFET switch • Stable operation using low ESR ceramic capacitors • Over temperature protection • Cycle-by-cycle over current protection • Soft-start function The device is available in 8-pin SOP and 10-pin MSOP package types and provides a very compact system solution with a minimum of external components. • Under voltage lockout protection • 8-pin SOP and 10-pin MSOP package Applications • Battery chargers • Distributed power systems • LED power supplies • DSL modems • Linear regulator pre power processing • Set-Top-Boxes, DVD players, LCD displays Application Circuit VIN 4.75~24V 10nF C2 10uF C1 VIN EN BS HT7465 SS 10nF C3 R + R2 VOUT = VFB × 1 R2 L VOUT SW B230A FB GND Efficiency vs Output Current COMP R1 R3 C5 R2 22uF C6 C4 Rev. 1.00 1 September 02, 2011 HT7465 Block Diagram Pin Assignment Rev. 1.00 2 September 02, 2011 HT7465 Pin Description Pin Name Description NC Not used BS Internal power NMOS gate drive boost input. A 10nF or greater value capacitor should be connected from SW to BS for additional Power NMOS gate driving purposes. VIN Power supply input. The input supply pin for the device, VIN, is connected to a supply voltage between 4.75V to 24V. SW Power switching output. The internal power MOS drain is connected to the inductor, diode and VIN. GND FB Ground. Device ground voltage reference. Feedback pin. The feedback pin is connected to an external resistor divider to measure the output voltage. COMP Error amplifier output. Used for compensation of the regulation control loop. Connect a series RC network from COMP to GND to compensate the regulation control loop. The COMP pin value is 0.92V. EN Enable input. This pin is set high to turn on the regulator and low to turn it off. The pin should be left unconnected if not used. SS Soft-start input. If the soft start function is to be used then an external capacitor should be connected between this pin and ground. If the soft start function is not required the pin should be left open. Absolute Maximum Ratings Maximum Input Supply Voltage.............................26V Comp Voltage............................................................6V Switch Node Voltage...............................................26V SS Voltage.................................................................6V Feedback Voltage......................................................6V Maximum Junction Temperature........................ 150°C EN Voltage................................................................6V Note: These are stress ratings only. Stresses exceeding the range specified under “Absolute Maximum Ratings” may cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability. Recommended Operating Conditions Ambient Temperature Range................ -40°C ~ +85°C Input Supply Voltage.................................4.75V ~ 24V Rev. 1.00 3 September 02, 2011 HT7465 Electrical Characteristics VIN=12V, Ta=25°C, unless otherwise specified refer to circuit of Figure 1. ( note 1) Symbol Parameter Test Condition Min. Typ. Max. Unit 4.75V ≤ VIN ≤ 24V 0.892 0.920 0.948 V VFB Feedback Voltage VUVLO Under Voltage Lockout Threshold — — 4.1 — V — Under Voltage Lockout Threshold Hysteresis — — 200 — mV IQ Quiescent Current VFB=1.2V, VEN=High — 1.1 1.3 mA ISS Shutdown Supply Current VEN=0V — 20 30 mA FOSC Oscillator Frequency — 380 — kHz — Short Circuit Frequency VFB=0V — 240 — kHz DMAX Maximum Duty Cycle VFB=0.6V — 90 — % ISW Upper Switch Leakage VEN=0V, VSW=0V — 0 10 mA RDS Switch On Resistance (note 2) IOUT=2A — 0.18 — W ILIMIT Current Limit — — 3.4 — A — Error Amplifier Voltage Gain (note 2) — — 70 — dB — Error Amplifier Trans-conductance (note 2) — — 800 — mA/V VEN Enable Threshold 0.7 1.0 1.3 V TJ Thermal Shutdown — 150 — °C — 4.75V ≤ VIN ≤ 24V — Note: 1. Specifications are production tested at Ta=room temperature. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 2. Designer test specifications. Rev. 1.00 4 September 02, 2011 HT7465 Functional Description the MOSFET oscillator frequency will be transformed from 380kHz to a short circuit frequency of 240kHz and the output current will remain at its current limit value. Setting the Output Voltage The HT7465 is a step down switching DC/DC converter device. The device switching output, SW, is connected to a standard converter LC filter circuit for buck conversion. The output current is sensed using an external voltage divider network connected to the load output voltage and ground, and the sense voltage feedback to the device on the FB pin. By comparing this sense voltage with an internally generated 0.92 voltage reference, suitable regulation can be implemented to achieve the required output voltage. By selecting suitable values of external voltage divider resistors, the desired output voltage can be adjusted to the required level. The output voltage can be calculated using the following formula: Over Temperature Protection A thermal shutdown is implemented to prevent damages due to excessive heat and power dissipation. Typically the thermal shutdown threshold is 150°C. The thermal shutdown is triggered the device stops switching and when the device thermal falls until the temperature hysteresis windows the device will be starts switching again. Application Information Inductor The inductor is required to supply a constant current to the output load while being driven by the switched input voltage. The choice of inductor affects steady state operation as well as transient behavior and loop stability. There are three important electrical parameters which need to be considered when choosing an inductor: Where R2 is the resistor divider lower resistor and R1 is the upper resistor, and the R1, R2 must be kW level. Compensation Components Care must be taken when selecting external components. The COMP pin is the output of the error amplifier and must be properly connected to an external RC network to ensure regulator loop stability. The values of the compensation components given in Table 1 yield a stable control loop for the output voltage and capacitor given. • The inductor value • DCR - copper wire resistance • The saturation current Inductor choice is especially important as it is important to ensure the inductor does not saturate under its peak current conditions, the general rule of keeping the inductor current peak-to-peak ripple approximately 30% of the nominal output current. Using this value of ripple current is a good compromise between excessive output voltage ripple and excessive component size and cost. Also ensure that the inductor has a low DCR to minimize power losses. Table 1 Compensation Values for Typical Output Voltage/Capacitor Combinations. VOUT L R2 C4 C6 C5 2.5V 15mH 9.1kW 17.2kW R3 R1 10kW 2.2nF 22mF Ceramic — 3.3V 15mH 10kW 25.8kW 10kW 3.9nF 22mF Ceramic — 5.0V 15mH 18kW 44.4kW 10kW 1.5nF 22mF Ceramic — Bootstrap Circuit Input/Output Capacitor In this device bootstrap capacitor is connected from SW to BS pin, the Step-Down converter is use N-Channel MOSFET, and MOS source pin is floating to ground, this drive circuit of the application is called high-side circuit, and the drive circuit used in this kind of situation is called bootstrap circuit. Large capacitor values can keep internal high-side N-Channel MOSFET gate voltage greater than zero when power MOS is turn on; usually a 10nF capacitor is sufficient for most applications. Input Capacitor Because the Vin pin is connected to the internal power MOSFET, when the power MOSFET is switching and the input current is discontinuous, therefore an input capacitor C1 (in PCB layout C1 and C8 is parallels input capacitor) is required to supply the AC current to the step-down converter while maintaining the DC input voltage. A low ESR ceramic capacitor is required to keep noise to a minimum. Output Capacitor Current Limit Protection The output capacitor is required to maintain the DC output voltage. Ceramic or low ESR electrolytic capacitors is the rule to choice of external load capacitor is also critical and low ESR value capacitors The device has a cycle-by-cycle current limit to protect the internal power MOSFET. If the inductor current reaches the current limit threshold of 3.4A, Rev. 1.00 5 September 02, 2011 HT7465 must be used to ensure stability. This capacitor must be connected very close to the inductor, with short traces for good noise performance. Schottky Diode The output diode conducts when the internal power MOSFET is switched off. There are three important electrical parameters to consider when choosing the diode: • The diode maximum reverse voltage value must be greater than the maximum input voltage. • Short recovery time and low forward voltage -- use a schottky diode type. • Diode current rating should be greater than the maximum load current. SOP8 Bottom Layer Layout Considerations Circuit board layout is a very important consideration for switching regulators if they are to function properly. Poor circuit layout may result in related noise problems. In order to minimise EMI and switching noise, follow the guidelines below: • All tracks should be as wide as possible. • The input and output capacitors, C1 (C8) and C6 (C7), should be placed close to the VIN, VOUT and GND pins (C1 and C8 is parallel; C6 and C7 is parallel). • The Schottky diode D and inductor L must be placed close to the SW pin. • Feedback resistor, R1 (R1-1) and R2, must be placed close to the FB and GND pins (R1 and R1-1 is series). MSOP10 Top Layer • A full ground plane is always helpful for better EMI performance. A recommended PCB layout with component locations is shown below. MSOP10 Bottom Layer SOP8 Top Layer Rev. 1.00 6 September 02, 2011 HT7465 Package Information Note that the package information provided here is for consultation purposes only. As this information may be updated at regular intervals users are reminded to consult the Holtek website (http://www.holtek.com.tw/english/ literature/package.pdf) for the latest version of the package information. 8-pin SOP (150mil) Outline Dimensions MS-012 Symbol Nom. Max. A 0.228 ― 0.244 B 0.150 ― 0.157 C 0.012 ― 0.020 C' 0.188 ― 0.197 D ― ― 0.069 E ― 0.050 ― F 0.004 ― 0.010 G 0.016 ― 0.050 H 0.007 ― 0.010 α 0° ― 8° Symbol Rev. 1.00 Dimensions in inch Min. Dimensions in mm Min. Nom. Max. A 5.79 ― 6.20 B 3.81 ― 3.99 C 0.30 ― 0.51 C' 4.78 ― 5.00 D ― ― 1.75 E ― 1.27 ― F 0.10 ― 0.25 G 0.41 ― 1.27 H 0.18 ― 0.25 α 0° ― 8° 7 September 02, 2011 HT7465 10-pin MSOP Outline Dimensions Symbol Min. Nom. Max. A ― ― 0.043 A1 0.000 ― 0.006 A2 0.030 0.033 0.037 B 0.007 ― 0.011 C ― ― 0.010 D ― 0.018 ― E ― 0.193 ― E1 ― 0.118 ― e ― 0.020 ― L 0.016 0.024 0.031 L1 ― 0.037 ― θ 0° ― 8° Symbol Rev. 1.00 Dimensions in inch Dimensions in mm Min. Nom. Max. A ― ― 1.10 A1 0.00 ― 0.15 A2 0.75 0.85 0.95 B 0.17 ― 0.27 C ― ― 0.25 D ― 3.00 ― E ― 4.90 ― E1 ― 3.00 ― e ― 0.50 ― L 0.40 0.60 0.80 L1 ― 0.95 ― θ 0° ― 8° 8 September 02, 2011 HT7465 Reel Dimensions SOP 8N (150mil) Symbol Description A Reel Outer Diameter Dimensions in mm 330.0±1.0 B Reel Inner Diameter 100.0±1.5 C Spindle Hole Diameter 13.0 +0.5/-0.2 D Key Slit Width T1 Space Between Flange T2 Reel Thickness Rev. 1.00 2.0±0.5 12.8 +0.3/-0.2 18.2±0.2 9 September 02, 2011 HT7465 Carrier Tape Dimensions SOP 8N (150mil) Symbol Description W Carrier Tape Width P Cavity Pitch E Perforation Position Dimensions in mm 12.0+0.3/-0.1 8.0±0.1 1.75±0.10 F Cavity to Perforation (Width Direction) 5.5±0.1 D Perforation Diameter 1.55±0.1 D1 Cavity Hole Diameter 1.50 +0.25/-0.00 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation (Length Direction) 2.0±0.1 A0 Cavity Length 6.4±0.1 B0 Cavity Width 5.2±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness C Cover Tape Width Rev. 1.00 0.30±0.05 9.3±0.1 10 September 02, 2011 HT7465 Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-5631999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright © 2011 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 11 September 02, 2011