iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 1/9 FEATURES APPLICATIONS ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ Line drivers for 24 V control engineering ♦ Linear scales and encoders ♦ MR sensor systems ♦ ♦ ♦ ♦ 6 current-limited and short-circuit-proof push-pull drivers Differential 3-channel operation selectable Integrated impedance adaption for 30 to 140 Ω lines Wide power supply range from 4 to 40 V 200 mA output current (at VB = 24 V) Low output saturation voltage (< 0.4 V at 30 mA) Compatible with TIA/EIA standard RS-422 Tristate switching of outputs enables use in buses Short switching times and high slew rates Low static power dissipation Schmitt trigger inputs with pull-down resistors, TTL and CMOS compatible; voltage-proof up to 40 V Thermal shutdown with hysteresis Error message trigger input TNER Open-drain error output NER, active low with excessive chip temperature and undervoltage at VCC or VB Option: Extended temperature range from -40 to 125 °C PACKAGES QFN28 5 x 5 mm² BLOCK DIAGRAM VCC ERROR DETECTION MODE TNER NER PLC 1 ENA & UNDERVOLTAGE & OVERTEMPERATURE VB1 A1 E1 vert. 8V/div. hor. 2µs/div 1 A2 E2 0 VB2 E3 A3 1 A4 E4 0 VB3 E5 A5 1 A6 E6 0 LINE 100 m DIFF GND1 Copyright © 2009 iC-Haus GND2 GND3 GND4 iC-DL http://www.ichaus.com iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 2/9 DESCRIPTION iC-DL is a fast line driver with six independent channels and integrated impedance adaptation for 30 to 140 Ω lines. Channels are paired for differential 3-channel operation by a high signal at the DIFF input, providing differential output signals for the three inputs E1, E3 and E5. All inputs are compatible with CMOS and TTL levels. The push-pull output stages have a driver power of typically 200 mA from 24 V and are short-circuitproof and current-limited, shutting down with excessive temperature. For bus applications the output stages can be switched to high impedance using input ENA. iC-DL monitors supply voltages VB and VCC and the chip temperature, switching all output stages to high impedance in the event of error and set NER activ low. In addition, the device also monitors voltage differences at the pins VB1, VB2 and VB3 and generates an error signal if the absolut value exceeds 0.75 V. The open-drain output NER allows the device to be wired-ORed to the relevant NER error outputs of other iC-DLs. Via input TNER the message outputs of other ICs can be extended to generate system error messages. NER switches to high impedance if supply voltage VCC ceases to be applied. The device is protected against ESD. PACKAGES QFN28 5 x 5 mm² JEDEC MO-220-VHHD-1 PIN CONFIGURATION QFN28 5 x 5 mm2 28 27 26 25 24 23 22 1 21 2 20 3 19 DL code... ... 4 5 6 7 8 9 10 11 PIN FUNCTIONS No. Name Function 1 E1 Input Channel 1 2 E2 Input Channel 2 3 E3 Input Channel 3 4 n.c. 12 18 17 16 15 13 14 PIN FUNCTIONS No. Name Function 5 E4 Input Channel 4 6 E5 Input Channel 5 7 E6 Input Channel 6 8 VCC +5 V Supply 9 n.c. 10 TNER Error Input, low active 11 NER Error Output, active low 12 A6 Output Channel 6 13 GND4 Ground 14 VB3 +4.5 ... 40 V Power Supply 15 A5 Output Channel 5 16 GND3 Ground 17 A4 Output Channel 4 18 VB2 +4.5 ... 40 V Power Supply 19 A3 Output Channel 3 20 GND2 Ground 21 A2 Output Channel 2 22 VB1 +4.5 ... 40 V Power Supply 23 GND1 Ground 24 A1 Output Channel 1 25 n.c. 26 ENA Enable Input, high active 27 n.c. 28 DIFF Differential Mode Input, high active The pins VB1, VB2 and VB3 must be connected to the same driver supply voltage VB. The pins GND1, GND2, GND3 and GND4 must be connected to GND. To improve heat dissipation, the thermal pad at the bottom of the package should be joined to an extended copper area which must have GND potential. iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 3/9 ABSOLUTE MAXIMUM RATINGS Beyond these values damage may occur; device operation is not guaranteed. Absolute Maximum Ratings are no Operating Conditions. Integrated circuits with system interfaces, e.g. via cable accessible pins (I/O pins, line drivers) are per principle endangered by injected interferences, which may compromise the function or durability. The robustness of the devices has to be verified by the user during system development with regards to applying standards and ensured where necessary by additional protective circuitry. By the manufacturer suggested protective circuitry is for information only and given without responsibility and has to be verified within the actual system with respect to actual interferences. Item No. Symbol Parameter Conditions Unit Min. G001 VCC Supply Voltage G002 VBx Driver Supply Voltage VB1, VB2, VB3 G003 V() Voltage at E1...6, A1...6, DIFF, ENA, TNER, NXS, CXS1, CXS6 G004 I(Ax) Driver Output Current (x=1...6) G005 I(Ex) Input Current Driver E1...E6, Diff, ENA, TNER, NXS G006 V(NER) Voltage at NER G007 I(NER) Current in NER G008 V() ESD Suceptibility at all pins G009 Tj G010 Ts pulse tested pulse tested Max. 0 7 V 0 40 V 0 36 V -800 800 mA -4 4 mA 0 36 V -4 25 mA 2 kV Operating Junction Temperature -40 140 °C Storage Temperature Range -40 150 °C HBM 100 pF discharged through 1.5 k Ω THERMAL DATA Operating Conditions: VB = 4...32 V, VCC = 4...5.5 V Item No. Symbol Parameter Conditions Unit Min. T01 Ta Operating Ambient Temperature Range (extended range to -40°C on request) T02 Rthja Thermal Resistance Chip to Ambient Typ. -25 surface mounted, thermal pad soldered to approx. 2 cm² heat sink All voltages are referenced to ground unless otherwise stated. All currents into the device pins are positive; all currents out of the device pins are negative. Max. 125 40 °C K/W iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 4/9 ELECTRICAL CHARACTERISTICS Operating Conditions: VB1...3 = 4.5...32 V, VCC = 4...5.5 V, Tj = -40...140 °C, unless otherwise noted input level lo = 0...0.45 V, hi = 2.4 V...VCC, timing diagram see fig. 1 Item No. Symbol Parameter Conditions Unit Min. Typ. Max. General (x=1..6) 001 VBx Supply Voltage Range (Driver) 002 I(VBx) Supply Current in VB1...3 Ax = lo 4 003 I(VBx) Supply Current in VB1...3 Ax = hi 004 I(VBx) Supply Current in VB1, Outputs A1...2 Tri-State ENA = lo, V(A1...2) = -0.3...(VB + 0.3 V) 005 I(VBx) Supply Current in VB2...3, Outputs A3...6 Tri-State ENA = lo, V(A3...6) = -0.3...(VB + 0.3 V) 1 mA 006 IO(Ax) Output Leakage Current ENA = lo, V(Ax) = 0 ... VB -20 20 µA 007 VCC Supply Voltage Range (Logic) 4 5.5 V 008 I(VCC) Supply Current in VCC ENA = hi, Ax = lo 5 10 mA 009 I(VCC) Supply Current in VCC ENA = hi, Ax = hi 1.5 5 mA 010 Vc()lo Clamp Voltage low at pins VB1...3, A1...6, E1...6, DIFF, ENA TNER, NER, VCC I() = -10 mA, all other pins open -1.2 -0.4 V 011 Vc()hi Clamp Voltage high at Vcc I() = 10 mA 5.6 7 V 012 Vc()hi Clamp Voltage high at pins VB1...3, A1...6, E1...6, DIFF, ENA TNER, NER I() ≤ 2 mA, all other pins open 40 64 V 013 I(VBx) Supply Current in VB1...3 ENA = hi, f(E1...6) = 1 MHz 10 mA 0.2 V 3 32 V 1.5 mA 3 mA 1.2 mA Driver Outputs A1...6, Low-Side-action (x = 1...6) 101 Vs(Ax)lo Saturation Voltage low I(Ax) = 10 mA, Ax = low 102 Vs(Ax)lo Saturation Voltage low I(Ax) = 30 mA, Ax = low 103 Isc(Ax)lo Short circuit current low V(Ax) = 1.5 V 104 Isc(Ax)lo Short circuit current low V(Ax) = VB, Ax = low 105 Rout(Ax) Output resistance 106 SR(Ax)lo 107 Vc(Ax)lo 40 60 VB = 10...40 V, V(Ax) = 0.5 * VB 40 75 Slew Rate low VB = 40 V, Cl(Ax) = 100 pF 200 600 Free Wheel Clamp Voltage low I(Ax) = -100 mA -1.3 0.4 V 90 mA 800 mA 100 Ω V/µs -0.5 V Driver Outputs A1...6, High-Side-action (x = 1...6) 201 Vs(Ax)hi Saturation Voltage high Vs(Ax)hi = VB - V(Ax), I(Ax) = -10 mA 0.2 V 202 Vs(Ax)hi Saturation Voltage high Vs(Ax)hi = VB - V(Ax), I(Ax) = -30 mA, Ax = hi 0.4 V 203 Isc(Ax)hi Short circuit current high V(Ax) = VB - 1.5 V, Ax = hi -90 -60 -40 mA 204 Isc(Ax)hi Short circuit current high V(Ax) = 0 V, Ax = hi -800 205 Rout(Ax) Output resistance VB = 10...40 V, V(Ax) =0.5 * VB 40 75 100 206 SR(Ax)hi Slew Rate high VB= 40 V, Cl(Ax) = 100 pF 200 400 207 Vc(Ax)hi Free Wheel Clamp Voltage high I(Ax) = 100 mA, VB = VCC = GND 0.5 mA Ω V/µs 1.3 V 2 V 800 mV Inputs E1...6, DIFF, ENA, TNER 601 Vt()hi Threshold Voltage high 602 Vt()lo Threshold Voltage low 603 Vt()hys Input Hysteresis Vt()hys = Vt()hi - Vt()lo 200 604 Ipd() Pull-Down-Current V() = 0.8 V 10 80 µA 605 Ipd() Pull-Down-Current V() ≤ 40 V 160 µA 3.95 V 0.8 V 400 Supply Voltage Control VB 701 VBon Threshold Value at VB1 for Undervoltage Detection on (NER ⇒ low) |VB1 - VB2| & |VB2 - VB3| & |VB1 - VB3| < 0.75 V 702 VBoff Threshold Value at VB1 for Undervoltage Detection off (NER ⇒ high) |VB1 - VB2| & |VB2 - VB3| & |VB1 - VB3| < 0.75 V 3 V iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 5/9 ELECTRICAL CHARACTERISTICS Operating Conditions: VB1...3 = 4.5...32 V, VCC = 4...5.5 V, Tj = -40...140 °C, unless otherwise noted input level lo = 0...0.45 V, hi = 2.4 V...VCC, timing diagram see fig. 1 Item No. 703 Symbol VBhys Parameter Conditions Hysteresis Unit VBhys = VBon - VBoff Min. Typ. 150 250 Max. mV Supply Voltage Difference Control VB1...3 801 ∆V(VBx) Threshold Condition for Supply ∆V(VBx) = MAX (|VB1 - VB2| , Voltage Difference between VB1, |VB2 - VB3| , |VB1 - VB3| ) VB2 and VB3 NER ⇒ low 0.75 1.85 V 3.95 V Supply Voltage Control VCC 901 VCCon Threshold Value at VCC for Undervoltage Detection on NER ⇒ low 902 VCCoff Threshold Value at VCC for Undervoltage Detection off NER ⇒ high 903 VCChys Hysteresis VCChys = VCCon - VCCoff 3 250 V 600 mV Temperatur Control A01 Toff Thermal Shutdown Threshold 145 175 °C A02 Ton Thermal Lock-on Threshold 130 165 °C A03 Thys Thermal Shotdown Hysteresis Thys = Ton - Toff I(NER) = 5 mA, NER = lo 12 °C Error Output NER B01 Vs() Saturation Voltage low at NER B02 Isc() Short Circuit Current low at NER V(NER) = 2...40 V, NER = lo B03 IO() Leakage Current at NER V(NER) = 0 V...VB, NER = hi -10 B04 VCC Supply Voltage for NER function I(NER) = 5 mA, NER = lo, Vs(NER) < 0.4 V 2.9 12 0.4 V 20 mA 10 µA V Time Delays I01 tplh(E-A) Propagation Delay Ex ⇒ Ax DIFF = lo, Cl() = 100 pF, see Fig. 1 100 400 ns I02 tphl(E-A) Propagation Delay Ex ⇒ Ax DIFF = lo, Cl() = 100 pF, see Fig. 1 100 200 ns I03 ∆tplh(Ax) Delay Skew DIFF = hi, Cl() = 100 pF, see Fig. 1 |A1 ⇒ A2|, |A3 ⇒ A4|, |A5 ⇒ A6| 30 100 ns I04 ∆tphl(Ax) Delay Skew DIFF = hi, Cl() = 100 pF, see Fig. 1 |A1 ⇒ A2|, |A3 ⇒ A4|, |A5 ⇒ A6| 30 100 ns I05 tplh(ENA) Propagation Delay ENA ⇒ Ax Ex = hi, DIFF = lo, Cl() = 100 pF, Rl(Ax, GND) = 5 kΩ, see Fig. 1 130 300 ns I06 tplh(ENA) Propagation Delay ENA ⇒ Ax Ex = lo, DIFF = lo, Cl() = 100 pF, Rl(VB, Ax) = 100 kΩ, see Fig. 1 100 200 ns I07 tphl(ENA) Propagation Delay ENA ⇒ Ax Ex = lo, DIFF = lo, Rl(VB, Ax) = 5 kΩ, see Fig. 1 200 500 ns I08 tphl(ENA) Propagation Delay ENA ⇒ Ax Ex = hi, DIFF = lo, Rl(Ax, GND) = 5 kΩ, see Fig. 1 250 500 ns I09 tphl(DIFF) Propagation Delay DIFF ⇒ A2, A4, A6 E1, E3, E5 = hi, Cl() = 100 pF, see Fig. 1 100 250 ns I10 tplh(DIFF) Propagation Delay DIFF ⇒ A2, A4, A6 E1, E3, E5 = lo, Cl() = 100 pF, see Fig. 1 130 400 ns I11 tpll(TNER) Propagation Delay TNER ⇒ NER Rl(VB, NER) = 5 kΩ, Cl() = 100 pF, see Fig. 1 0.5 2 µs V Input/Output 2.4V 2.0V 0.8V 0.45V t 1 0 Figure 1: Reference levels for delays iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 6/9 DESCRIPTION Line drivers for control engineering couple TTL- or CMOS-compatible digital signals with 24 V systems via cables. The maximum permissible signal frequency is dependent on the capacitive load of the outputs (cable length) or, more specifically, the power dissipation in iC-DL resulting from this. To avoid possible short circuiting the drivers are current-limited and shutdown with excessive temperature. When the output is open the maximum output voltage corresponds to supply voltage VB (with the exception of any saturation voltages). Figure 2 gives the typical DC output characteristic of a driver as a function of the load. The differential output resistance is typically 75 Ω over a wide voltage range. VE = hi VB = 40 V 32 28 V(A) [V] Figure 3: Reflections caused by a mismatched line termination During a pulse transmission the amplitude at the iCDL output initially only increases to half the value of supply voltage VB as the internal driver resistance and characteristic line impedance form a voltage divider. A wave with this amplitude is coupled into the line and experiences after a delay a total reflection at the highimpedance end of the line. At this position, the reflected wave superimposes with the transmitted wave and generates a signal with the double wave amplitude at the receiving device. 40 36 ever, further reflection of back travelling signals is prevented by an integrated impedance network, as shown in Figure 3. 24 20 16 12 VB = 24 V 8 4 0 0 100 200 300 400 500 - I(A) [mA] Figure 2: Load dependence of the output voltage (High-side stage) Each open-circuited input is set to low by an internal pull-down current source; an additional connection to GND increases the device’s immunity to interference. The inputs are TTL- and CMOS-compatible. Due to their high input voltage range, the inputs can also be set to high-level by applying VCC or VB. LINE EFFECTS In PLC systems data transmission using 24 V signals usually occurs without a matched line termination. A mismatched line termination generates reflections which travel back and forth if there is also no line adaptation on the driver side of the device. With rapid pulse trains transmission is disrupted. In iC-DL, how- Figure 4: Pulse transmission and transit times After a further delay, the reflected wave also increases the driver output to the full voltage swing. iC-DL’s integrated impedance adapter prevents any further reflection and the achieved voltage is maintained along and at the termination of the line. A mismatch between iC-DL and the transmission line influences the level of the signal wave first coupled into the line, resulting in reflections at the beginning of the line. The output signal may then have a number of graduations. Voltage peaks beyond VB or below GND are capped by integrated diodes. By this way, transmisssion lines with a characteristic impedance between 30 and 140 Ω permit proper operation. iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 7/9 PRINTED CIRCUIT BOARD LAYOUT The thermal pad at the bottom of the package improves thermal dissipation. The board layout has to be designed so that an appropriate number of copper vias below the thermal pad area form a good conductive path to the reverse of the board where a blank copper surface of sufficient size (approx. 2 cm²) carries off heat. The thermal pad is to be soldered to the board and must be connected to GND. To smooth the local IC supply VCC and VBx, blocking capacitors must be connected directly to these pins and to GND. EVALUATION BOARD iC-DL is in a QFN28 package and comes with a evaluation board for test purposes. Figures 5 and 6 show both the wiring and the top of the evaluation board. Figure 5: Circuit diagram of the evaluation board iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 8/9 Figure 6: Evaluation board (component side) iC-Haus expressly reserves the right to change its products and/or specifications. An Infoletter gives details as to any amendments and additions made to the relevant current specifications on our internet website www.ichaus.de/infoletter; this letter is generated automatically and shall be sent to registered users by email. Copying – even as an excerpt – is only permitted with iC-Haus approval in writing and precise reference to source. iC-Haus does not warrant the accuracy, completeness or timeliness of the specification on this site and does not assume liability for any errors or omissions in the materials. The data specified is intended solely for the purpose of product description. 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As a general rule our developments, IPs, principle circuitry and range of Integrated Circuits are suitable and specifically designed for appropriate use in technical applications, such as in devices, systems and any kind of technical equipment, in so far as they do not infringe existing patent rights. In principle the range of use is limitless in a technical sense and refers to the products listed in the inventory of goods compiled for the 2008 and following export trade statistics issued annually by the Bureau of Statistics in Wiesbaden, for example, or to any product in the product catalogue published for the 2007 and following exhibitions in Hanover (Hannover-Messe). We understand suitable application of our published designs to be state-of-the-art technology which can no longer be classed as inventive under the stipulations of patent law. Our explicit application notes are to be treated only as mere examples of the many possible and extremely advantageous uses our products can be put to. iC-DL 3-CHANNEL DIFFERENTIAL LINE DRIVER Rev B1, Page 9/9 ORDERING INFORMATION Type Package Order Designation iC-DL QFN28 5 x 5 mm² iC-DL QFN28 iC-DL Evaluation Board iC-DL EVAL DL2D For technical support, information about prices and terms of delivery please contact: iC-Haus GmbH Am Kuemmerling 18 D-55294 Bodenheim GERMANY Tel.: +49 (61 35) 92 92-0 Fax: +49 (61 35) 92 92-192 Web: http://www.ichaus.com E-Mail: [email protected] Appointed local distributors: http://www.ichaus.com/sales_partners