Product Information ISO 9001 CERTIFIED TA G - 1 0 3 0 5.725 to 5.825 GHz GaAs MMIC U-NII Band Power Amplifier F e a t u rre es: ♦ ♦ ♦ ♦ 25 dBm Minimum Linear Output Power 20 dB Small Signal Gain 35 dBm 3rd Order Intercept Point Surface Mount Thermally Efficient Moly-Copper Package Product Description The TAG-1030 GaAs MMIC power amplifier is designed to operate in the ETSI approved Unlicensed band of 5.725 to 5.825 GHz. It provides a minimum of 20 dB gain, a minimum of +25 dBm linear output power when measured at 1 dB GCP, and has an IP3 of +35 dBm. It is housed in a thermally efficient moly-copper surface mount package and is capable of performing within typical commercial system operating temperature ranges. Electrical Specifications (All Specifications at 25oC, Vd = +7.0V, Id = 500 to 700 mA) Pa ra m e te r Small Signal Gain Sym bol S 21 Fre que ncy 5.7 to 5.9 GHz Min 20.0 Ma x - Typica l 23.0 Units dB Input Return Loss S 11 5.7 to 5.9 GHz - - -10.0 dB Reverse Isolation S 12 5.7 to 5.9 GHz 5.7 GHz 5.8 GHz 5.9 GHz 5.7 to 5.9 GHz 25.0 25.0 25.0 - - 52.0 26.0 26.3 26.8 -0.045 dB dBm dBm dBm dB/ o C Output Power @ 1dB Gain Compression P -1dB Temperature Coefficient of Gain ∆ S 21 Typical Output Power Output Power (dBm) Gain / Return Loss (dB) Typical Small Signal Gain and Input Return Loss 30 20 Gain 10 Return 0 -10 -20 5.70 5.75 5.80 5.85 5.90 30 29 28 27 26 25 24 23 22 5.70 P-1dB Psat 5.75 5.80 5.85 5.90 5.95 Frequency (GHz) Frequency (GHz) www.teledynewireless.com email: [email protected] 10/2001 1274 Terra Bella Avenue, Mountain View, CA 94043 • Tel: 800-832-6869 • Fax: (650) 962-6845 7 TAG-1030 5.725 to 5.825 GHz GaAs MMIC Power Amplifier for U-NII Applications Package Outline T ypical Biasing Configuration Pin 3: RF Input Pin 5: Vg Pin 8: RF Output Pin 10:Vd 10 PIN 1 3 10 PACKAGED AMPLIFIER RF Input (50 ohms) 8 3 470 pF 8 GaAs MMIC Input Vd Bypass (1µF Typical) RF Output (50 ohms) 470 pF 5 PIN 6 Bypass (1µF Typical) External Components Required: Bypass Capacitors: 1µ F, typical 50 Ohm microsrtip interface Tolerance: .XXX ± 0.005 Evaluation Board Evaluation Circuit GND Vdd GND C2 1 10 2 9 GND 3 50 OHM LINE RF IN TAG-1030 1.0 µf GND 8 4 7 5 6 50 OHM LINE GND C1 5 Vg RF OUT GND GND 1.0 µf GND V6 Notes 1. Dual bias supply required. 2. DC supply sequencing or protection circuitry not included. See Amplifier Biasing Procedure 3. A 360 pF DC supply line decoupling capacitor is included on both Vd and Vg lines. (See typical biasing configuration shown above). 4. The last fixture or circuit should incorporate additional bypass capacity (25ufd) on the drain and gate bias terminals to prevent oscillations caused by feedback signals. 5. Supply (drain and gate) wire/leads should be as short as possible. 6. Close placement of external components to the power amplifier is essential for stability purposes. 7. TET recommends the unit be soldered to DC and RF ground for best results. 8. Pin numbers indicated on outline drawing are for user information only. Units are not labeled with pin numbers. 9. MASK drawing for circuit board available on the Teledyne Wireless website at www.teledynewireless.com. Teledyne reserves the right to make changes without further notice to any specification herein. “Typical” parameters can and do vary. www.teledynewireless.com email: [email protected] 10/2001 1274 Terra Bella Avenue, Mountain View, CA 94043 • Tel: 800-832-6869 • Fax: (650) 962-6845 8