ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER Description Features The ICS670-04 is a high speed, low phase noise, Zero Delay Buffer (ZDB) which integrates ICS’ proprietary analog/digital Phase Locked Loop (PLL) techniques. It is identical to the ICS670-02, but with an increased maximum output frequency of 210 MHz. Part of ICS’ ClockBlocksTM family, the part’s zero delay feature means that the rising edge of the input clock aligns with the rising edges of the outputs giving the appearance of no delay through the device. There are two identical outputs on the chip. The FBCLK should be used to connect to the FBIN. Each output has its own output enable pin. • • • • • • • • • • • • The ICS670-04 is ideal for synchronizing outputs in a large variety of systems, from personal computers to data communications to video. By allowing off-chip feedback paths, the chip can eliminate the delay through other devices. The 15 different on-chip multipliers work in a variety of applications. For other multipliers, including functional multipliers, see the ICS527. Packaged in 16-pin SOIC Pb (lead) free Clock inputs from 5 to 210 MHz (see page 2) Patented PLL with low phase noise Output clocks up to 210 MHz at 3.3 V 15 selectable on-chip multipliers Power down mode available Low phase noise: -111 dBc/Hz at 10 kHz Output enable function tri-states outputs Low jitter 15 ps one sigma Advanced, low power, sub-micron CMOS process Operating voltage of 3.3 V or 5 V Industrial temperature grade Block Diagram VDD OE1 3 IC L K Divide by N F B IN S 3 :S 0 Phase Detector, Charge Pump, and Loop Filter Voltage Controlled Oscillator FBCLK CLK2 4 3 GND OE2 E x te rn a l F e e d b a c k fro m F B C L K is re c o m m e n d e d . 1 MDS 670-04 B In te grated Circui t Systems l 5 25 Race Stre et, San Jose, CA 9 5126 Revision 011905 l te l (4 08) 297 -1201 l w w w. i c s t . c o m ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER Pin Assignment Multiplier Select Table S3 S2 S1 S0 CLK2 (and FBCLK) Input Range (MHz) 0 0 0 0 Low (Power down entire chip) — GND 0 0 0 1 Input x1.333 18 - 157.5 0 1 0 Input x6 5 - 35 VDD 1 16 GND VDD 2 15 GND VDD 3 14 CLK2 4 13 S0 0 OE2 5 12 S1 0 0 1 1 Input x1.5 16.67 - 140 1 0 0 Input x3.333 7.5 - 63 FBCLK 6 11 S2 0 OE1 7 10 S3 0 1 0 1 Input x2.50 10 - 84 ICLK 0 1 1 0 Input x4 6 - 52.5 0 1 1 1 Input x1 25 - 210 1 0 0 0 Input x2.333 11 - 90 1 0 0 1 Input x2.666 10 - 78.75 1 0 1 0 Input x12 5 - 17.5 1 0 1 1 Input x3 8 - 70 1 1 0 0 Input x10 5 - 21 1 1 0 1 Input x5 6 - 42 1 1 1 0 Input x8 5 - 26.25 1 1 1 1 Input x2 12 - 105 FBIN 9 8 Pin Descriptions Pin Number Pin Name Pin Type Pin Description 1-3 VDD Input 4 CLK2 5 OE2 6 FBCLK 7 OE1 Input Output clock enable 1. Tri-states the feedback clock output when low. 8 FBIN Input Feedback clock input. 9 ICLK Input Clock input. Connect to a 5 - 210 MHz clock. 10 S3 Input Multiplier select pin 3. Determines outputs per table above. Internal pull-up. 11 S2 Input Multiplier select pin 2. Determines outputs per table above. Internal pull-up. 12 S1 Input Multiplier select pin 1. Determines outputs per table above. Internal pull-up. 13 S0 Input Multiplier select pin 0. Determines outputs per table above. Internal pull-up. 14 - 16 GND Power Power supply. Connect both pins to the same voltage (either 3.3 V or 5 V). Output Clock output from VCO. Output frequency equals the input frequency times multiplier. Input Output clock enable 2. Tri-states the clock 2 output when low. Output Clock output from VCO. Output frequency equals the input frequency times multiplier. 2 MDS 670-04 B Integrated Ci rcu it Systems Connect to ground. l 525 Ra ce St reet, San Jose , CA 9512 6 Revision 011905 l tel (408 ) 29 7-120 1 l w w w. i c s t . c o m ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER External Components The ICS670-04 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01mF should be connected between VDD and GND on pins 4 and 5, and VDD and GND on pins 13 and 12, as close to the device as possible. A series termination resistor of 33Ω may be used to each clock output pin to reduce reflections. Absolute Maximum Ratings Stresses above the ratings listed below can cause permanent damage to the ICS670-04. These ratings, which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range. Item Rating Supply Voltage, VDD 7V All Inputs and Outputs -0.5 V to VDD+0.5 V Ambient Operating Temperature -40 to +85°C Storage Temperature -65 to +150°C Junction Temperature 150°C Soldering Temperature 260°C Recommended Operation Conditions Parameter Min. Typ. Max. Units Ambient Operating Temperature -40 +85 °C Power Supply Voltage (measured in respect to GND) +3.0 +5.5 V DC Electrical Characteristics VDD=3.3 V ±10%, Ambient temperature -40 to +85°C, unless stated otherwise Parameter Symbol Conditions Min. Operating Voltage VDD 3.0 Input High Voltage VIH 2 Input Low Voltage VIL Output High Voltage VOH IOH = -12 mA Output Low Voltage VOL IOL = 12 mA Output High Voltage, CMOS level VOH IOH = -4 mA Operating Supply Current IDD No Load l Max. Units 5.5 V V 0.8 2.4 525 Ra ce St reet, San Jose , CA 9512 6 V V 0.4 VDD-0.4 V V 35 mA 3 MDS 670-04 B Integrated Ci rcu it Systems Typ. Revision 011905 l tel (408 ) 29 7-120 1 l w w w. i c s t . c o m ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER Parameter Symbol Conditions Min. Typ. Max. Units Short Circuit Current IOS Each output ±50 mA Internal Pull-up Resistor RPU OE, select pins 200 kΩ Input Capacitance CIN OE, select pins 5 pF AC Electrical Characteristics VDD = 3.3V ±10%, Ambient Temperature -40 to +85°C, unless stated otherwise Parameter Symbol Input Clock Frequency fIN Conditions Min. See table on page 2 Typ. 5 Output Clock Frequency Max. Units 210 MHz 210 MHz Output Rise Time tOR 0.8 to 2.0 V, no load 1.5 ns Output Fall Time tOF 2.0 to 0.8 V, no load 1.5 ns Output Clock Duty Cycle tDC measured at VDD/2 55 % 45 50 Input to Output Skew Note 1 ±100 ps Maximum Absolute Jitter short term ±45 ps Maximum Jitter one sigma 15 ps Phase Noise, relative to carrier, 125 MHz (x5) 100 Hz offset -103 dBc/Hz 1 kHz offset -117 dBc/Hz 10 kHz -111 dBc/Hz 200 kHz -88 dBc/Hz Note 1: Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15 pF load on CLK2. Thermal Characteristics Parameter Thermal Resistance Junction to Ambient Thermal Resistance Junction to Case Conditions Min. Typ. Max. Units θJA Still air 120 °C/W θJA 1 m/s air flow 115 °C/W θJA 3 m/s air flow 105 °C/W 58 °C/W θJC 4 MDS 670-04 B Integrated Ci rcu it Systems Symbol l 525 Ra ce St reet, San Jose , CA 9512 6 Revision 011905 l tel (408 ) 29 7-120 1 l w w w. i c s t . c o m ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER Phase Noise for 125 MHz output, 25 MHz clock input (VDD = 3.3 V) 0 -20 -40 ICS670-02 phase noise 3.3 V, 25 in 125 out -60 -80 -100 -120 -140 10E+0 100E+0 1E+3 100E+3 1E+6 10E+6 5 MDS 670-04 B Integrated Ci rcu it Systems 10E+3 l 525 Ra ce St reet, San Jose , CA 9512 6 Revision 011905 l tel (408 ) 29 7-120 1 l w w w. i c s t . c o m ICS670-04 LOW PHASE NOISE, ZERO DELAY BUFFER AND MULTIPLIER Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95 Millimeters 16 Symbol E Min A A1 B C D E e H h L α H INDEX AREA 1 2 D A Inches Max Min 1.35 1.75 0.10 0.25 0.33 0.51 0.19 0.25 9.80 10.00 3.80 4.00 1.27 BASIC 5.80 6.20 0.25 0.50 0.40 1.27 0° 8° Max .0532 .0688 .0040 .0098 .013 .020 .0075 .0098 .3859 .3937 .1497 .1574 0.050 BASIC .2284 .2440 .010 .020 .016 .050 0° 8° h x 45 A1 C -Ce SEATING PLANE B L .10 (.004) C Ordering Information Part / Order Number Marking Shipping Packaging Package Temperature ICS670M-04I ICS670M-04IT ICS670M-04ILF ICS670M-04ILFT ICS670M-04I ICS670M-04I 670M-04ILF 670M-04ILF Tubes Tape and Reel Tubes Tape and Reel 16-pin SOIC 16-pin SOIC 16-pin SOIC 16-pin SOIC -40 to +85°C -40 to +85°C -40 to +85°C -40 to +85°C “LF” denotes Pb (lead) free package. While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 6 MDS 670-04 B Integrated Ci rcu it Systems l 525 Ra ce St reet, San Jose , CA 9512 6 Revision 011905 l tel (408 ) 29 7-120 1 l w w w. i c s t . c o m