ICS670-01 Low Phase Noise Zero Delay Buffer and Multiplier Description Features The ICS670-01 is a high speed, low phase noise Zero Delay Buffer (ZDB) which integrates ICS’ proprietary analog/digital Phase Locked Loop (PLL) techniques. Part of ICS’ ClockBlocks™ family, the zero delay feature means that the rising edge of the input clock aligns with the rising edges of the outputs, giving the appearance of no delay through the device. There are two identical outputs on the chip. The FBCLK should be used to connect to the FBIN. Each output has its own output enable pin. The chip is ideal for synchronizing outputs in a large variety of systems, from personal computers to data communications to video. By allowing offchip feedback paths, the ICS670-01 can eliminate the delay through other devices. The 15 different on-chip multipliers work in a variety of applications. For other multipliers, including fractional multipliers, see the ICS527. • Packaged in 16 pin SOIC • Clock inputs from 5 to 160 MHz (see page 2) • Patented PLL with the lowest phase noise • Output clocks up to 160 MHz at 3.3 V • 15 selectable on-chip multipliers • Power down mode available • Low phase noise: -124 dBc/Hz at 10 kHz • Output Enable function tri-states outputs • Low jitter 15 ps one sigma • Full swing CMOS outputs with 25 mA drive capability at TTL levels • Advanced, low power, sub-micron CMOS process • Industrial temperature version available • 3.3 V or 5 V operation Block Diagram OE1 ICLK FBIN Phase Detector, Charge Pump, and Loop Filter Voltage Controlled Oscillator ROMBased Multipliers 4 S3:S0 External feedback from FBCLK is recommended. Output Buffer FBCLK Output Buffer CLK2 OE2 1 Revision 100900 Printed 11/15/00 Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com MDS 670-01 B ICS670-01 Low Phase Noise Zero Delay Buffer and Multiplier Multiplier Select Table Pin Assignment VDD 1 2 3 4 5 6 7 8 VDD VDD CLK2 OE2 FBCLK OE1 FBIN 16 15 14 13 12 11 10 9 GND GND GND S0 S1 S2 S3 ICLK ICS670-01 S3 S2 S1 S0 CLK2 (and FBCLK) 0 0 0 0 Low (Power down entire chip) 0 0 0 1 Input x1.333 0 0 1 0 Input x6 0 0 1 1 Input x1.5 0 1 0 0 Input x3.333 0 1 0 1 Input x2.50 0 1 1 0 Input x4 0 1 1 1 Input x1 1 0 0 0 Input x2.333 1 0 0 1 Input x2.666 1 0 1 0 Input x12 1 0 1 1 Input x3 1 1 0 0 Input x10 1 1 0 1 Input x5 1 1 1 0 Input x8 1 1 1 1 Input x2 0=connect directly to ground 1=connect directl to VDD Input Range (MHz) 18 - 120 5 - 26.67 16.67 - 107 7.5 - 48 10 - 64 6 - 40 25 - 160 11 - 69 10 - 60 5 - 13.33 8 - 53.33 5 - 16 6 - 32 5 - 20 12 - 80 Pin Descriptions Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Name VDD VDD VDD CLK2 OE2 FBCLK OE1 FBIN ICLK S3 S2 S1 S0 GND GND GND Type P P P O I O I CI CI I I I I P P P Description Connect to +3.3V or +5V. Must match other VDDs. Connect to +3.3V or +5V. Must match other VDDs. Connect to +3.3V or +5V. Must match other VDDs. Clock output from VCO. Output frequency equals the input frequency times multiplier. Output clock enable 2. Tri-states the clock 2 output when low. Clock ouput from VCO. Output frequency equals the input frequency times multiplier. Output clock enable 1. Tri-states the feedback clock output when low. Feedback clock input. Clock input. Connect to a 5 - 160 MHz clock. Multiplier select pin 3. Determines outputs per table above. Internal pull-up. Multiplier select pin 2. Determines outputs per table above. Internal pull-up. Multiplier select pin 1. Determines outputs per table above. Internal pull-up. Multiplier select pin 0. Determines outputs per table above. Internal pull-up. Connect to ground. Connect to ground. Connect to ground. Key: I = Input with internal pull-up resistor; O = output; P = power supply connection; CI = clock input. 2 Revision 100900 Printed 11/15/00 Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com MDS 670-01 B ICS670-01 Low Phase Noise Zero Delay Buffer and Multiplier Electrical Specifications Parameter Conditions Minimum Typical Maximum Units 7 VDD+0.5 70 85 260 150 V V °C °C °C °C 5.5 V V V V V V mA mA kΩ pF ABSOLUTE MAXIMUM RATINGS (n note 1) Supply voltage, VDD Referenced to GND Inputs and Clock Outputs Referenced to GND Ambient Operating Temperature Ambient Operating Temperature, ICS670M-01I Industrial temperature Soldering Temperature Max of 10 seconds Storage temperature -0.5 0 -40 -65 DC CHARACTERISTICS (VDD = 3.3 V unless noted) Operating Voltage, VDD Input High Voltage, VIH Input Low Voltage, VIL Output High Voltage, VOH, CMOS level Output High Voltage, VOH Output Low Voltage, VOL Operating Supply Current, IDD Short Circuit Current Internal Pull-up Resistor Input Capacitance 3.0 2 0.8 IOH=-4mA IOH=-12mA IOL=12mA No Load Each output OE, select pins OE, select pins VDD-0.4 2.4 0.4 35 ±50 200 5 AC CHARACTERISTICS (VDD = 3.3 V unless noted) Input Frequency (see table on page 2) Output Frequency Output Clock Rise Time Output Clock Fall Time Output Clock Duty Cycle Input to output skew, rising edges Maximum Absolute Jitter, short term Maximum Jitter, one sigma Phase Noise, relative to carrier, 125 MHz (x5) Phase Noise, relative to carrier, 125 MHz (x5) Phase Noise, relative to carrier, 125 MHz (x5) Phase Noise, relative to carrier, 125 MHz (x5) Notes: Depends on multiplier at 3.3V or 5V 0.8 to 2.0V, no load 0.8 to 2.0V, no load At VDD/2 Note 2 100 Hz offset 1 kHz offset 10 kHz offset 100 kHz offset 5 45 50 ±100 ±45 15 -110 -122 -121 -117 160 160 1.5 1.5 55 MHz MHz ns ns % ps ps ps dBc/Hz dBc/Hz dBc/Hz dBc/Hz 1. Stresses beyond those listed under Absolute Maximum Ratings could cause permanent damage to the device. Prolonged exposure to levels above the operating limits but below the Absolute Maximums may affect device reliability. 2. Rising edge of ICLK compared with rising edge of CLK2, with FBCLK connected to FBIN, and 15 pF load on CLK2. See the graph on page 4 for skew versus frequency and loading. 3 Revision 100900 Printed 11/15/00 Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com MDS 670-01 B ICS670-01 Low Phase Noise Zero Delay Buffer and Multiplier 300 CL = 20 pF 200 Skew (ps) 100 0 0 25 50 75 100 125 150 -100 -200 -300 CL = 10 pF -400 CLK2 Frequency (MHz) Figure 1. ICS670-01 skew from ICLK to CLK2, with change in load capacitance. VDD = 3.3 V. Adjusting Input/Output Skew The data in Figure 1 can be used to adjust individual circuit characteristics and achieve the minimum possible skew between ICLK and CLK2. With a 125 MHz output, for example, having a total load capacitance of 15 pF will result in nearly zero skew between ICLK and CLK2. Note that the load capacitance includes board trace capacitance, input capacitance of the load being driven by the ICS670-01, and any additional capacitors connected to CLK2. 0 Phase Noise (dBc/Hz) -20 -40 -60 -80 -100 -120 -140 10.0E+0 100.0E+0 1.0E+3 10.0E+3 100.0E+3 1.0E+6 10.0E+6 Offset from Carrier (Hz) Figure 2. Phase Noise of ICS670-01 at 125 MHz out, 25 MHz clock input. VDD = 3.3 V. 4 Revision 100900 Printed 11/15/00 Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com MDS 670-01 B ICS670-01 Low Phase Noise Zero Delay Buffer and Multiplier External Components Selection The ICS670-01 requires a minimum number of external components for proper operation. Decoupling capacitors of 0.01 µF should be connected between VDD and GND, as close to the part as possible. A series termination resistor of 33 Ω may be used for each clock output. Package Outline and Package Dimensions (For current dimensional specifications, see JEDEC Publication No. 95.) 16 pin SOIC narrow Symbol A E A1 H B INDEX AREA C D E e H h L 1 h x 45° D A1 e B C Inch hes Min Max 0.0532 0.0688 0.0040 0.0098 0.0130 0.0200 0.0075 0.0098 0.3859 0.3937 0.1497 0.1574 .050 BSSC 0.2284 0.2440 0.0099 0.0195 0.0160 0.0500 Millim meters Min Max 1.35 1.75 0.10 0.24 0.33 0.51 0.19 0.24 9.80 10.00 3.80 4.00 1.27 BSSC 5.80 6.20 0.25 0.50 0.41 1.27 A L Ordering Information Part/Order Number ICS670M-01 ICS670M-01T ICS670M-01I ICS670M-01IT Marking ICS670M-01 ICS670M-01 ICS670M-01I ICS670M-01I Shipping packaging tubes tape and reel tubes tape and reel Package Temperature 16 pin narrow SOIC 0 to 70 °C 16 pin narrow SOIC 0 to 70 °C 16 pin narrow SOIC -40 to 85 °C 16 pin narrow SOIC -40 to 85 °C While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or critical medical instruments. 5 Revision 100900 Printed 11/15/00 Integrated Circuit Systems • 525 Race Street • San Jose •CA•95126•(408) 295-9800tel•http://www.icst.com MDS 670-01 B