KEC PG05TADF10

SEMICONDUCTOR
PG05TADF10
TECHNICAL DATA
TVS Diode Array for ESD
Protection in Portable Electronics
Protection in Portable Electronics Applications.
C
F
E
FEATURES
A
9
Transient protection for data lines to
8
7
6
4
5
1
IEC 61000-4-2(ESD) 20KV (air/contact)
B
3
2
G
30 Watts peak pulse power (tp=8/20 )s
H
Small package for use in portable electronics.
D
Suitable replacement for Multi-Layer Varistors in ESD protection applications.
J
Protects one I/O or power line.
K
Low clamping voltage.
Low leakage current.
1.
2.
3.
4.
5.
APPLICATIONS
USB 2.0, 10/100/1000 Ethernet, FireWire, DVI, HDMI, S-ATA
DIM
A
B
C
D
E
F
G
H
J
K
Input / Output 1
Input / Output 2
GND
Input / Output 3
Input / Output 4
Mobile Communication
MILLIMETERS
_ 0.035
2.3 +
_ 0.035
1+
2.0
_ 0.025
0.2 +
0.5
_ 0.025
0.4 +
_ 0.025
0.35 +
_ 0.025
0.94 +
_ 0.01, -0.02
0.31 +
0.05 MAX
Consumer Products (STB, MP3, DVD, DSC...)
DFN10
LCD-Display, Camera
Notebooks and desktop computers, peripherals
Marking
Type Name
Z1
0825
MAXIMUM RATING (Ta=25)
CHARACTERISTIC
SYMBOL
RATING
UNIT
Peak Pulse Current (tp=8/20 s)
IPP
3
A
Operating Temperature Range
TOP
-40~125
Storage Temperature
Tstg
-55 150
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC
Reverse Stand-Off Voltage
1
2
4
5
MIN.
TYP.
MAX.
UNIT
VRWM
-
-
-
5.3
V
It=1mA (I/O to GND)
6
-
-
V
VRWM=5.3V (I/O to GND)
-
-
50
IPP=1A, tp=8/20㎲, (I/O to GND)
-
10
13
IPP=3A, tp=8/20㎲, (I/O to GND)
-
12
15
VR=0V, f=1MHz (I/O to GND)
-
0.4
0.6
Clamping Voltage
VC
CJ
Revision No : 0
6
TEST CONDITION
IR
2009. 12. 21
7
SYMBOL
Reverse Leakage Current
Junction Capacitance
8
)
VBR
Reverse Breakdown Voltage
9
Lot No.
A
V
pF
1/3
PG05TADF10
FORWARD CLAMPING VOLTAGE
6
13
12
FORWARD CLAMPING
VOLTAGE VFC (V)
CLAMPING VOLTAGE VC (V)
CLAMPING VOLTAGE
11
10
9
8
tP=8/20 us
I/O to GND
7
6
5
4
3
2
tP=8/20 us
GND to I/O
1
0
0
1
2
3
4
0
PEAK PULSE CURRENT IPP (Α)
1
10
-7
10
-8
10
-9
10
-10
10
-11
25
VR=5.3V
I/O to GND
50
75
100
125
0.5
0.4
0.3
0.2
f=1 MHZ
I/O to GND
0.1
0
150
0
1
0.5
0.6
CAPACITANCE Cj (pF)
0.7
VR=0V
VR=5.3V
0.3
0.2
0.1
I/O to GND
0
0
500
1000
15000
2000
FREQUENCY f (ΜΗΖ)
Revision No : 0
3
4
5
LINE CAPACITANCE
0.6
0.4
2
REVERSE VOLTAGE VR (V)
LINE CAPACITANCE
CAPACITANCE Cj (pF)
5
0.6
AMBIENT TEMPERATURE Ta (℃)
2009. 12. 21
4
CAPACITANCE
CAPACITANCE Cj (pF)
REVERSE CURRENT IR (A)
-6
3
PEAK PULSE CURRENT IPP (Α)
REVERSE CURRENT
10
2
2500
3000
0.5
5.3V
0.4
0V
0.3
0.2
VR=0V
0.1
f=1MHZ
0
-50
-25
0
25
50
75
100
AMBIENT TEMPERATURE Ta (℃)
2/3
PG05TADF10
C
F
E
A
8
7
6
4
5
1
2
B
3
G
9
H
K
J
D
1.
2.
3.
4.
5.
DIM
A
B
C
D
E
F
G
H
J
K
Input / Output 1
Input / Output 2
GND
Input / Output 3
Input / Output 4
MILLIMETERS
_ 0.035
2.3 +
_
1 + 0.035
2.0
_ 0.025
0.2 +
0.5
_
0.4 + 0.025
_ 0.025
0.35 +
_ 0.025
0.94 +
_ 0.01, -0.02
0.31 +
0.05 MAX
DFN10
2009. 12. 21
Revision No : 0
3/3