LIGITEK LHR2043-TRS-X

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND REEL TYPE LED LAMPS
LHR2043/TRS-X
DATA SHEET
DOC. NO
:
QW0905- LHR2043/TRS-X
REV.
:
A
DATE
: 23 - Mar. - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043/TRS-X
Page 1/5
Package Dimensions
ΔH
P2
H2
W2
H1
L W0
W1 W3
D
P1
F
P
T
LHR2043
3.0
4.0
4.2
5.2
1.5MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/5
PART NO. LHR2043/TRS-X
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
HR
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/[email protected]
IFP
100
mA
Power Dissipation
PD
100
mW
Reverse Current @5V
Ir
10
μA
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
Typical Electrical & Optical Characteristics (Ta=25 ℃)
COLOR
PART NO
MATERIAL
Emitted
LHR2043/TRS-X
GaAlAs
Red
Peak
wave
length
λPnm
Spectral
halfwidth
△λnm
Lens
Water Clear
660
20
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Min.
Max.
Min.
Typ.
1.5
2.4
220
350
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
Viewing
angle
2θ1/2
(deg)
30
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043/TRS-X
Page 3/5
•Dimensions Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TRS-1
TRS-2
TRS-3
TRS-4
TRS-5
TRS-6
TRS-7
TRS-8
TRS-9
TRS-10
H1
17.5
21.5
25.5
27.5
22.5
19.9
24.0
24.5
19.0
18.4
0.69
0.85
1.0
1.08
0.89
0.78
0.94
0.96
0.75
0.72
-------
H2
-------
-------
18.5
22.5
26.5
28.5
23.5
20.9
25.0
25.5
20.0
19.4
36
0.73
0.89
1.04
1.12
0.93
0.82
0.98
1.0
0.79
0.76
1.42
Lead Length After Component Height
-------
L
11.0
0.43
Feed Hole Pitch
-------
P
12.4
0.49
13.0
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19.0
0.75
Feed Hole To Bottom Of Component
Feed Hole To Overall Component Height
W0
REMARK:TRS=Tape And Reel Straight Leads
• Package Dimensions
• Dimensions Symbol Information
Specification
Description
Symbol
minimum
maxmum
D3
mm
inch
mm
inch
Reel Diameter
D
78.2
3.08
380
14.96
Core Diameter
D1
34.9
1.37
102
4.02
Hub Recess Inside Diameter
D2
28.6
1.13
88.0
3.46
Arbor Hole Diameter
D3
13.8
0.54
38.1
1.5
Overall Reel Thickness
T2
57.2
2.25
Iside Reel Flange Thickness
T1
50.0
1.97
Quantity/Reel
30.0
1.18
2000PCS
MARKING
D2
D1
T1
T2
D
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LHR2043/TRS-X
Page4/5
Typical Electro-Optical Characteristics Curve
HR CHIP
Fig.1 Forward current vs. Forward Voltage
3.0
Relative [email protected]
1000
Forward Current(mA)
Fig.2 Relative Intensity vs. Forward Current
100
10
1.0
0.1
2.0
1.0
3.0
4.0
2.5
2.0
1.5
1.0
0.5
0
5.0
1.0
10
Fig.4 Relative Intensity vs. Temperature
1.2
Relative [email protected]
Forward [email protected]
Fig.3 Forward Voltage vs. Temperature
1.1
1.0
0.9
0.8
-20
-0
20
40
60
80
3.0
2.5
2.0
1.5
1.0
0.5
0
-40
100
-20
-0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
Relative [email protected]
1000
Forward Current(mA)
Forward Voltage(V)
-40
100
0°
1.0
-30°
30°
-60°
-60°
0.5
100% 75% 50%
0
600
650
700
Wavelength (nm)
750
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LHR2043/TRS-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11