LIGITEK LDGM32840-S4-TBS-X

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LDGM32840/S4/TBS-X
DATA SHEET
DOC. NO :
QW0905-LDGM32840/S4/TBS-X
REV.
:
B
DATE
:
15 - Feb.- 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LDGM32840/S4/TBS-X
Page 1/5
Package Dimensions
P2
ΔH
H2
W2
H1
L
W0
W1
D
P1
- +
F
P
T
LDGM32840/S4
3.9
3.1
6.3
9.8±0.5
1.5
MAX
25.0MIN
□0.5
TYP
1.0MIN
2.54TYP
+
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
W3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 2/5
PART NO. LDGM32840/S4/TBS-X
Absolute Maximum Ratings at Ta=25 ℃
Absolute Maximum Ratings
Symbol
Parameter
UNIT
DGM
Forward Current
IF
30
mA
Peak Forward Current
Duty 1/[email protected]
IFP
100
mA
Power Dissipation
PD
120
mW
Ir
50
μA
Electrostatic Discharge( * )
ESD
150
V
Operating Temperature
Topr
-20 ~ +80
℃
Storage Temperature
Tstg
-30 ~ +100
℃
Soldering Temperature
Tsol
Reverse Current @5V
Max 260 ℃ for 5 sec Max
(2mm from body)
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
* glove
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
MATERIAL
COLOR
Emitted
LDGM32840/S4/TBS-X
Luminous
Peak Dominant Spectral Forward
intensity
wave
wave halfwidth voltage
length
length △λ nm @20mA(V) @20mA(mcd)
λPnm λDnm
Typ. Max. Min. Typ.
Lens
InGaN/GaN Green Green Diffused
Viewing
angle
2θ 1/2
(deg)
518
525
36
3.5 4.0
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
900 1500
Horizontal
Axis 110°
Vertical Axis
60°
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LDGM32840/S4/TBS-X
Page 3/5
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TBS-1
17.5
0.69
18.5
0.73
TBS-2
21.5
0.85
22.5
0.89
TBS-3
25.5
1.0
26.5
1.04
TBS-5
22.5
0.89
23.5
0.93
TBS-6
19.9
0.78
20.9
0.82
24.0
0.94
25.0
0.98
24.5
0.96
25.5
1.0
TBS-9
19.0
0.75
20.0
0.79
TBS-10
18.4
0.72
19.4
0.76
TBS-11
21.0
0.83
22.0
0.87
TBS-12
20.5
0.81
21.5
0.85
TBS-13
18.0
0.71
19.0
0.75
-------
36
1.42
11
0.43
TBS-7
Feed Hole To Bottom Of Component
H1
TBS-8
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
-------
W0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/5
PART NO. LDGM32840/S4/TBS-X
Typical Electro-Optical Characteristics Curve
DGM CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
2.5
2.0
1.5
1.0
0.5
0.0
0.1
2.0
1.0
3.0
4.0
5.0
1.0
10
1000
Forward Current(mA)
Forward Voltage(V)
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative [email protected]
Normalize @25℃
Forward [email protected]
Normalize @25℃
100
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
100
2.5
2.0
1.5
1.0
0.5
0.0
-40
-20
0
20
40
60
80
100
Ambient Temperature( ℃)
Ambient Temperature( ℃)
Fig.5 Relative Intensity vs. Wavelength
Fig.6 Directivity Radiation
Relative [email protected]
1.0
Vertcal Axis 60 °
Horizontal Axis 110 °
0°
-30°
30°
0.5
-60°
0.0
450
500
550
Wavelength (nm)
600
100% 75% 50%
60°
25%
0
25% 50% 75% 100%
Radiation Angle(0.5):H 110 Degree/V 74 Degree
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LDGM32840/S4/TBS-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hours.
1.Ta=105 ℃±5 ℃&-40 ℃±5 ℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11