LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only TAPE AND BOX TYPE LED LAMPS LUYS22841/P1/TBS-X DATA SHEET DOC. NO : QW0905-LUYS22841/P1/TBS-X REV. : B DATE : 14 - Jan - 2005 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 1/5 PART NO. LUYS22841/P1/TBS-X Package Dimensions P2 ΔH H2 W2 H1 L W0 W1 D P1 F P T LUYS22841/P1 4.0 3.8 6.3 9.8±0.5 1.5MAX 25.0MIN □0.5 TYP 2.54TYP 1.0MIN Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. W3 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LUYS22841/P1/TBS-X Page 2/5 Absolute Maximum Ratings at Ta=25 ℃ Ratings Symbol Parameter UNIT UYS Forward Current IF 50 mA Peak Forward Current Duty 1/10@10KHz IFP 90 mA Power Dissipation PD 120 mW Reverse Current @5V Ir 10 μA Electrostatic Discharge ESD 2000 V Operating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40 ~ +100 ℃ Soldering Temperature Tsol Max 260 ℃ for 5 sec Max (2mm from body) Typical Electrical & Optical Characteristics (Ta=25 ℃) PART NO COLOR MATERIAL Emitted Forward Dominant Spectral voltage wave halfwidth @20mA(V) length △λ nm λDnm Luminous intensity @20mA(mcd) Viewing angle 2θ 1/2 (deg) Min. Max. Min. Typ. Lens Horizontal Axis 124° LUYS22841/P1/TBS-X AlGaInP Yellow Yellow Transparent 587 15 1.7 2.6 300 550 Vertical Axis 86° Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2. The luminous intensity data did not including ± 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 3/5 PART NO. LUYS22841/P1/TBS-X •Dimension Symbol Information SPECIFICATIONS OPTION SYMBOL CODE SYMBOL ITEMS Minimum Maximum mm inch mm inch Tape Feed Hole Diameter ------- D 3.8 0.15 4.2 0.17 Component Lead Pitch ------- F 2.3 0.09 3.0 0.12 Front-To-Rear Deflection ------- △H ------- ------- 2.0 0.08 TBS-1 17.5 0.69 18.5 0.73 TBS-2 21.5 0.85 22.5 0.89 TBS-3 25.5 1.0 26.5 1.04 TBS-5 22.5 0.89 23.5 0.93 TBS-6 19.9 0.78 20.9 0.82 24.0 0.94 25.0 0.98 24.5 0.96 25.5 1.0 TBS-9 19.0 0.75 20.0 0.79 TBS-10 18.4 0.72 19.4 0.76 TBS-11 21.0 0.83 22.0 0.87 TBS-12 20.5 0.81 21.5 0.85 TBS-13 18.0 0.71 19.0 0.75 ------- 36 1.42 11 0.43 Feed Hole To Bottom Of Component TBS-7 H1 TBS-8 Feed Hole To Overall Component Height ------- H2 Lead Length After Component Height ------- L Feed Hole Pitch ------- P 12.4 0.49 13 0.51 Lead Location ------- P1 4.4 0.17 5.8 0.23 Center Of Component Location ------- P2 5.1 0.2 7.7 0.3 Overall Taped Package Thickness ------- T ------- ------- 1.42 0.06 Feed Hole Location ------- W0 8.5 0.33 9.75 0.38 Adhesive Tape Width ------- W1 14.5 0.57 15.5 0.61 Adhesive Tape Position ------- W2 0 0 4.0 0.16 Tape Width ------- W3 17.5 0.69 19 0.75 ------- W0 REMARK:TBS=Tape And Box Straight Leads • Dimensions Symbol Information • Package Dimensions Specification Description Symbol minimum maxmum mm inch mm inch Overall Length L 330 13.0 340 13.4 Overall Width W 265 10.4 275 10.8 Overall Thickness H 50 1.97 60 2.4 Quantity/Box 2500PCS LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 4/5 PART NO. LUYS22841/P1/TBS-X Typical Electro-Optical Characteristics Curve UYS CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 3.0 Relative Intensity Normalize @20mA Forward Current(mA) 1000 100 10 1.0 0.1 2.5 2.0 1.5 1.0 0.5 0.0 1.0 1.5 2.0 2.5 1.0 3.0 10 Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3.0 Relative Intensity@20mA Normalize @25 ℃ Forward Voltage@20mA Normalize @25 ℃ 1000 Forward Current(mA) Forward Voltage(V) 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 2.5 2.0 1.5 1.0 0.5 0.0 -40 100 -20 0 20 40 60 80 100 Ambient Temperature(℃) Ambient Temperature( ℃) Fig.6 Directivity Radiation Fig.5 Relative Intensity vs. Wavelength 1.0 Relative Intensity@20mA 100 Vertical Axis 124 ° 0° Horizontal Axis 86 ° -30° 30° 0.5 -60° 60 ° 0.0 500 550 600 Wavelength (nm) 650 100% 75% 50% 25% 0 25% 50% 75% 100% Radiation Angle(0.5):H 86 Degree/V 124 Degree LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LUYS22841/P1/TBS-X Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 High Temperature Storage Test 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 ℃±5 ℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. High Temperature High Humidity Test 1.Ta=65 ℃±5 ℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hous. 1.Ta=105 ℃±5℃&-40 ℃±5℃ (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 ℃±5 ℃ 2.Dwell time= 10 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 ℃±5 ℃ 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 Thermal Shock Test JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11