LIGITEK LUYS22841-P1-TBS-X

LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
TAPE AND BOX TYPE LED LAMPS
LUYS22841/P1/TBS-X
DATA SHEET
DOC. NO :
QW0905-LUYS22841/P1/TBS-X
REV.
:
B
DATE
: 14 - Jan - 2005
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 1/5
PART NO. LUYS22841/P1/TBS-X
Package Dimensions
P2
ΔH
H2
W2
H1
L
W0
W1
D
P1
F
P
T
LUYS22841/P1
4.0
3.8
6.3
9.8±0.5
1.5MAX
25.0MIN
□0.5
TYP
2.54TYP
1.0MIN
Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
W3
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LUYS22841/P1/TBS-X
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
Symbol
Parameter
UNIT
UYS
Forward Current
IF
50
mA
Peak Forward Current
Duty 1/10@10KHz
IFP
90
mA
Power Dissipation
PD
120
mW
Reverse Current @5V
Ir
10
μA
Electrostatic Discharge
ESD
2000
V
Operating Temperature
Topr
-40 ~ +85
℃
Storage Temperature
Tstg
-40 ~ +100
℃
Soldering Temperature
Tsol
Max 260 ℃ for 5 sec Max
(2mm from body)
Typical Electrical & Optical Characteristics (Ta=25 ℃)
PART NO
COLOR
MATERIAL
Emitted
Forward
Dominant Spectral
voltage
wave
halfwidth
@20mA(V)
length
△λ nm
λDnm
Luminous
intensity
@20mA(mcd)
Viewing
angle
2θ 1/2
(deg)
Min. Max. Min. Typ.
Lens
Horizontal
Axis 124°
LUYS22841/P1/TBS-X
AlGaInP
Yellow
Yellow Transparent
587
15
1.7
2.6
300
550
Vertical Axis
86°
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ± 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 3/5
PART NO. LUYS22841/P1/TBS-X
•Dimension Symbol Information
SPECIFICATIONS
OPTION
SYMBOL
CODE
SYMBOL ITEMS
Minimum
Maximum
mm
inch
mm
inch
Tape Feed Hole Diameter
-------
D
3.8
0.15
4.2
0.17
Component Lead Pitch
-------
F
2.3
0.09
3.0
0.12
Front-To-Rear Deflection
-------
△H
-------
-------
2.0
0.08
TBS-1
17.5
0.69
18.5
0.73
TBS-2
21.5
0.85
22.5
0.89
TBS-3
25.5
1.0
26.5
1.04
TBS-5
22.5
0.89
23.5
0.93
TBS-6
19.9
0.78
20.9
0.82
24.0
0.94
25.0
0.98
24.5
0.96
25.5
1.0
TBS-9
19.0
0.75
20.0
0.79
TBS-10
18.4
0.72
19.4
0.76
TBS-11
21.0
0.83
22.0
0.87
TBS-12
20.5
0.81
21.5
0.85
TBS-13
18.0
0.71
19.0
0.75
-------
36
1.42
11
0.43
Feed Hole To Bottom Of Component
TBS-7
H1
TBS-8
Feed Hole To Overall Component Height
-------
H2
Lead Length After Component Height
-------
L
Feed Hole Pitch
-------
P
12.4
0.49
13
0.51
Lead Location
-------
P1
4.4
0.17
5.8
0.23
Center Of Component Location
-------
P2
5.1
0.2
7.7
0.3
Overall Taped Package Thickness
-------
T
-------
-------
1.42
0.06
Feed Hole Location
-------
W0
8.5
0.33
9.75
0.38
Adhesive Tape Width
-------
W1
14.5
0.57
15.5
0.61
Adhesive Tape Position
-------
W2
0
0
4.0
0.16
Tape Width
-------
W3
17.5
0.69
19
0.75
-------
W0
REMARK:TBS=Tape And Box Straight Leads
• Dimensions Symbol Information
• Package Dimensions
Specification
Description
Symbol
minimum
maxmum
mm
inch
mm
inch
Overall Length
L
330
13.0
340
13.4
Overall Width
W
265
10.4
275
10.8
Overall Thickness
H
50
1.97
60
2.4
Quantity/Box
2500PCS
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 4/5
PART NO. LUYS22841/P1/TBS-X
Typical Electro-Optical Characteristics Curve
UYS CHIP
Fig.1 Forward current vs. Forward Voltage
Fig.2 Relative Intensity vs. Forward Current
3.0
Relative Intensity
Normalize @20mA
Forward Current(mA)
1000
100
10
1.0
0.1
2.5
2.0
1.5
1.0
0.5
0.0
1.0
1.5
2.0
2.5
1.0
3.0
10
Fig.3 Forward Voltage vs. Temperature
Fig.4 Relative Intensity vs. Temperature
1.2
3.0
Relative Intensity@20mA
Normalize @25 ℃
Forward Voltage@20mA
Normalize @25 ℃
1000
Forward Current(mA)
Forward Voltage(V)
1.1
1.0
0.9
0.8
-40
-20
0
20
40
60
80
2.5
2.0
1.5
1.0
0.5
0.0
-40
100
-20
0
20
40
60
80
100
Ambient Temperature(℃)
Ambient Temperature( ℃)
Fig.6 Directivity Radiation
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
100
Vertical Axis 124 °
0°
Horizontal Axis 86 °
-30°
30°
0.5
-60°
60 °
0.0
500
550
600
Wavelength (nm)
650
100% 75% 50%
25%
0
25%
50% 75% 100%
Radiation Angle(0.5):H 86 Degree/V 124 Degree
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
Page 5/5
PART NO. LUYS22841/P1/TBS-X
Reliability Test:
Test Item
Test Condition
Description
Reference
Standard
Operating Life Test
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resisance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
High Temperature
Storage Test
1.Ta=105 ℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of
the device which is laid under ondition
of hogh temperature for hours.
MIL-STD-883:1008
JIS C 7021: B-10
Low Temperature
Storage Test
1.Ta=-40 ℃±5 ℃
2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
High Temperature
High Humidity Test
1.Ta=65 ℃±5 ℃
2.RH=90 %~95%
3.t=240hrs ±2hrs
The purpose of this test is the resistance
of the device under tropical for hous.
1.Ta=105 ℃±5℃&-40 ℃±5℃
(10min) (10min)
2.total 10 cycles
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Solder Resistance
Test
1.T.Sol=260 ℃±5 ℃
2.Dwell time= 10 ±1sec.
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solderability Test
1.T.Sol=230 ℃±5 ℃
2.Dwell time=5 ±1sec
This test intended to see soldering well
performed or not.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
Thermal Shock Test
JIS C 7021: B-12
MIL-STD-202:103B
JIS C 7021: B-11