RI-TRP-RR2B, RI-TRP-WR2B, RI-TRP-DR2B, RI-TRP-IR2B 32 mm Glass Transponder www.ti.com SCBS842A – SEPTEMBER 2001 – REVISED FEBRUARY 2008 FEATURES APPLICATIONS • Best in Class Performance Through Patented HDX Technology • Patented Transponder Tuning Provides Stable and High Read/Write Performance • 64 Bit Read Only, 80 Bit Read/write and MPT 1360 Bit Types are Available • ISO 11784/11785 Compliant • Insensitive to Almost All Non-Metallic Materials • • • • • 1 2 Access Control Vehicle Identification Container Tracking Asset Management Waste Management DESCRIPTION Texas Instruments’ 32 mm glass transponders are providing superior performance and operate at a resonance frequency of 134.2 kHz. Specific products are compliant to ISO/IEC 11784/11785 global open standards. Texas Instruments LF transponders are manufactured with TI’s patented tuning process to provide consistent read and write performance. Prior to delivery, the transponders undergo complete functional and parametric testing, in order to provide the high quality customers have come to expect from TI. The transponder is well suited for usage in a broad range of applications including, but not limited to, access control, vehicle identification, container tracking, asset management and waste management applications. ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) Operating Temperature (Read) Operating Temperature (Program) RI-TRP-RR2B RI-TRP-WR2B RI-TRP-DR2B RI-TRP-IR2B UNIT –25 to +85 –25 to +85 –25 to +85 –25 to +85 °C — –25 to +70 –25 to +85 –25 to +85 °C Storage Temperature (1) –40 to +100 (+125°C for total 1000 hours) °C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. TI-RFID is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2001–2008, Texas Instruments Incorporated RI-TRP-RR2B, RI-TRP-WR2B, RI-TRP-DR2B, RI-TRP-IR2B 32 mm Glass Transponder www.ti.com SCBS842A – SEPTEMBER 2001 – REVISED FEBRUARY 2008 OPERATING CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PART NUMBER PARAMETER Functionality Memory (Bits) RI-TRP-RR2B Read Only 64 RI-TRP-WR2B Read/Write 80 (1) 1 RI-TRP-DR2B MPT 1360 1 Operating Frequency 134.2 Modulation FSK (Frequency Shift Keying) 134.2 kHz / 123.2 kHz Transmission Principle HDX (Half Duplex) Power Source Powered from the reader signal (batteryless) Typical Read Range ≤ 100 (3) UNIT SAMPT (1) 1360 (1) (1) Memory (Pages) RI-TRP-IR2B 17 (1)R/W (2) 17 R/W kHz cm Typical Programming Range — 30% of specified reading range Typical Read Time 70 70 86 86 ms Typical Programming Time — 309 293 341 ms 100,000 100,000 100,000 Typical Programming Cycles — Case Material Glass Protection Class Hermetically sealed EMC Programmed code is not affected by normal electromagnetic interference or x-rays Signal Penetration Transponder can be read through virtually all non-metallic material Mechanical Shock IEC 68-2-27, Test Ea; 300 g, half sine, 3 ms, 2 axes Vibration IEC 68-2-6, Test Fc; 3 g, 5 – 50 Hz, 2 axes, 24 hours per axis 20 g, 10 – 2000 Hz, 2 axes, 2.5 hours per axis Dimensions Φ3.85 ± 0.05 (1) 31.2 ± 0.6 Φ3.85 ± 0.05 (1) 32.2 ± 0.6 Weight 0.8 0.85 (1) (2) (3) 2 mm g We recommend that you split each 80 bit page into 64 user programmable bits plus a 16 bit wide CRC CCITT Block Check Character as is done by TI-RFID™ LF readers. 24 bits Selective Address width Depending on RF regulation in country of use, the Reader Antenna configuration used, and the environmental conditions. Submit Documentation Feedback Copyright © 2001–2008, Texas Instruments Incorporated Product Folder Link(s): RI-TRP-RR2B RI-TRP-WR2B RI-TRP-DR2B RI-TRP-IR2B PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) (3) Top-Side Markings (4) RI-TRP-DR2B OBSOLETE RFIDT TGB 0 TBD Call TI Call TI RI-TRP-DR2B-30 ACTIVE RFIDT TGB 0 2000 Pb-Free (RoHS) Call TI N / A for Pkg Type -25 to 85 RI-TRP-IR2B-30 ACTIVE RFIDT TGB 0 2000 Pb-Free (RoHS) Call TI N / A for Pkg Type RI-TRP-RR2B-30 ACTIVE RFIDT TGB 0 2000 Pb-Free (RoHS) SNAG3CU0.5 N / A for Pkg Type RI-TRP-WR2B-20 OBSOLETE RFIDT TGB 0 TBD Call TI Call TI -25 to 70 RI-TRP-WR2B-30 ACTIVE RFIDT TGB 0 2000 Pb-Free (RoHS) SNAG3CU0.5 N / A for Pkg Type -25 to 70 0 to 0 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2013, Texas Instruments Incorporated