TI RF-HDT-DVBB

RF-HDT-DVBB
www.ti.com.................................................................................................................................................... SCBS857B – NOVEMBER 2003 – REVISED MAY 2009
13.56-MHz ENCAPSULATED PLUS TRANSPONDER
FEATURES
DESCRIPTION
1
•
•
•
•
•
•
•
ISO/IEC 15693-2,-3; ISO/IEC 18000-3 Compliant
13.56-MHz Operating Frequency
2048-Bit User Memory in 64 × 32-bit Blocks
User and Factory Lock Per Block
Application Family Identifier (AFI)
Data Storage Format Identifier (DSFID)
Combined Inventory Read Block
APPLICATIONS
•
•
•
•
Laundry
Process Automation
Product Authentication
Asset Management
Texas Instruments’ 13.56-MHz encapsulated plus
transponder is compliant with the ISO/IEC 15693 and
ISO/IEC 18000-3 global open standards. This product
offers a user accessible memory of 2048 bits,
organized in 64 blocks and an extensive command
set.
Designed for harsh environments, such as garment
tracking in laundries, each transponder has a 64-bit
factory programmed Read Only Number, which is
also laser engraved on the transponder housing. Prior
to delivery, transponders undergo complete functional
and parametric testing to provide the high quality that
customers have come to expect from TI.
The 13.56-MHz encapsulated plus transponders are
well suited for a variety of applications including but
not limited to: laundry garment tracking, process
automation, product authentication, and asset
management.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
RF-HDT-DVBB
UNIT
Operating Temperature
–25 to 90
°C
Storage Temperature
–40 to 120 (130°C for total 50 hours, 220°C for total 30 seconds)
°C
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2009, Texas Instruments Incorporated
RF-HDT-DVBB
SCBS857B – NOVEMBER 2003 – REVISED MAY 2009.................................................................................................................................................... www.ti.com
OPERATING CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
RF-HDT-DVBB (1)
PARAMETER
UNIT
Supported standard
ISO/IEC 15693-2,-3; ISO/IEC 18000-3
Resonance frequency (at 25°C)
13.56 MHz ± 300 kHz
Typ. required activation field strength to read (at 25°C)
112
dBµA/m
Typ. required activation field strength to write (at 25°C)
115
dBµA/m
Factory programmed read only number
64
bits
Memory (user programmable)
2k bits organized in 64 × 32-bit blocks
Typical programming cycles (at 25°C)
100 000
Data retention time (at 25°C)
>10 years
Simultaneous identification of tags
Up to 50 tags per second (reader/antenna dependent)
Dimensions
ø 22 ± 0.2 mm × 3 ± 0.2 mm
Weight
2.1 ± 0.2
Case material
PPS, black
Protection class
IP 68
Vibration
ISO/IEC 68.2.6 (10 g, 10 to 2000 Hz, 3 axis, 2.5 h)
Mechanical shock
ISO/IEC 68.2.27 (100 g, 6 ms, 6 axis, 20 times per axis)
Mechanical stability
Axial compression strength: 1000 N (10 s, static)
Radial compression strength: 500 N (10 s, static)
Isostatic water pressure: 45 bar (10 h)
Chemical resistance
Typical chemicals used in laundry and dry-cleaning processes
Delivery
1000 units in bulk
(1)
grams
For highest possible read-out coverage, TI recommends operation of readers at a modulation depth of 20% or higher.
SUPPORTED COMMAND SET
REQUEST MODE (1)
REQUEST
REQUEST
CODE
INVENTORY
ADDRESSED
NONADDRESSED
SELECT
AFI
Inventory
0x01
√
–
–
–
√
Stay Quiet
0x02
–
√
–
–
–
Read_Single_Block
0x20
√
√
√
√
√
Write_Single_Block
0x21
–
√
√
√
–
Lock_Block
0x22
–
√
√
√
–
Read_Multi_Blocks
0x23
√
√
√
√
√
Write_Multi-Blocks
0x24
–
–
–
–
–
Select Tag
0x25
–
√
–
–
–
Reset to Ready
0x26
–
√
√
√
–
Write_AFI
0x27
–
√
√
√
–
Lock_AFI
0x28
–
√
√
√
–
Write DSFID
0x29
–
√
√
√
–
Lock DSFID
0x2A
–
√
√
√
–
Get_System_info
0x2B
√
√
√
√
√
Get_M_BLK_Sec_St
0x2C
√
√
√
√
√
Write_2_Blocks
0xA2
–
√
√
√
–
Lock_2_Blocks
0xA3
–
√
√
√
–
ISO 15693 Mandatory and Optional
Commands
TI Custom Commands
(1)
2
√: Implemented, – : Not applicable
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): RF-HDT-DVBB
RF-HDT-DVBB
www.ti.com.................................................................................................................................................... SCBS857B – NOVEMBER 2003 – REVISED MAY 2009
MEMORY ORGANIZATION
32 bits
Lock Bits
F = Factory Lock, U = User Lock
F U
Block #
1
2
3
User Data
(2048 bits)
62
63
64
X
DSFID
Application
Configuration
AFI
IC Version
UID Num ber
(64 bits)
Factory Programmed
Submit Documentation Feedback
Copyright © 2003–2009, Texas Instruments Incorporated
Product Folder Link(s): RF-HDT-DVBB
3
PACKAGE OPTION ADDENDUM
www.ti.com
9-Aug-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
RF-HDT-DVBB-N1
OBSOLETE
RFIDP
TEC
0
RF-HDT-DVBB-N2
ACTIVE
RFIDP
TEC
0
Package Qty
1000
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TBD
Call TI
Call TI
Pb-Free (RoHS)
Call TI
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
www.ti.com/audio
Communications and Telecom www.ti.com/communications
Amplifiers
amplifier.ti.com
Computers and Peripherals
www.ti.com/computers
Data Converters
dataconverter.ti.com
Consumer Electronics
www.ti.com/consumer-apps
DLP® Products
www.dlp.com
Energy and Lighting
www.ti.com/energy
DSP
dsp.ti.com
Industrial
www.ti.com/industrial
Clocks and Timers
www.ti.com/clocks
Medical
www.ti.com/medical
Interface
interface.ti.com
Security
www.ti.com/security
Logic
logic.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Power Mgmt
power.ti.com
Transportation and
Automotive
www.ti.com/automotive
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
Wireless
www.ti.com/wireless-apps
RF/IF and ZigBee® Solutions
www.ti.com/lprf
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2011, Texas Instruments Incorporated