SCLS509A − JUNE 2003 − REVISED FEBRUARY 2008 D Qualified for Automotive Applications D ESD Protection Exceeds 1000 V Per D D D D D D D D PW PACKAGE (TOP VIEW) MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Operating Voltage Range of 4.5 V to 5.5 V High-Current Outputs Drive Up To 15 LSTTL Loads Low Power Consumption, 80-µA Max ICC Typical tpd = 13 ns ±6-mA Output Drive at 5 V Low Input Current of 1 µA Max Inputs Are TTL-Voltage Compatible 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 description/ordering information This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. The ’HCT244 device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low, the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. ORDERING INFORMATION† TA ORDERABLE PART NUMBER PACKAGE‡ TOP-SIDE MARKING −40°C to 125°C TSSOP − PW Tape and reel SN74HCT244QPWRQ1 HT244Q † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE (each buffer/driver) INPUTS OE A OUTPUT Y L H H L L L H X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2008, Texas Instruments Incorporated !" # $%&" !# '%()$!" *!"&+ *%$"# $ " #'&$$!"# '& ",& "&# &-!# #"%&"# #"!*!* .!!"/+ *%$" '$&##0 *&# " &$&##!)/ $)%*& "&#"0 !)) '!!&"&#+ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 logic diagram (positive logic) 1OE 1A1 1A2 1A3 1A4 1 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 19 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) MIN NOM MAX 4.5 5 5.5 VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 0 VO ∆t/∆v Output voltage 0 High-level input voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V Input transition rise/fall time 2 UNIT V V 0.8 V VCC VCC V 500 ns V TA Operating free-air temperature −40 125 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC VOH VI = VIH or VIL IOH = −20 µA IOH = −6 mA 4.5 V VOL VI = VIH or VIL IOL = 20 µA IOL = 6 mA 4.5 V II IOZ VI = VCC or 0 VO = VCC or 0, ICC VI = VCC or 0, ∆ICC† MIN TA = 25°C TYP MAX MIN 4.4 4.499 4.4 3.98 4.3 3.7 MAX UNIT V 0.001 0.1 0.1 0.17 0.26 0.4 5.5 V ±0.1 ±100 ±1000 nA VI = VIH or VIL IO = 0 5.5 V ±0.01 ±0.5 ±10 µA 8 160 µA One input at 0.5 V or 2.4 V, Other inputs at 0 or VCC 5.5 V 1.4 2.4 3 mA 3 10 10 pF 5.5 V 4.5 V to 5.5 V Ci V † This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC. switching characteristics over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tdis OE Y tt Y VCC TA = 25°C MIN TYP MAX MIN MAX 4.5 V 15 28 42 5.5 V 13 25 38 4.5 V 21 35 53 5.5 V 19 32 48 4.5 V 19 35 53 5.5 V 18 32 48 4.5 V 8 12 18 5.5 V 7 11 16 UNIT ns ns ns ns switching characteristics over recommended operating free-air temperature range, CL = 150 pF (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tpd A Y ten OE Y tt Y VCC TA = 25°C MIN TYP MAX MIN MAX 4.5 V 21 45 68 5.5 V 18 40 61 4.5 V 25 52 79 5.5 V 22 47 71 4.5 V 17 42 63 5.5 V 14 38 57 UNIT ns ns ns operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per buffer/driver POST OFFICE BOX 655303 No load • DALLAS, TEXAS 75265 TYP 40 UNIT pF 3 PARAMETER MEASUREMENT INFORMATION VCC From Output Under Test CL (see Note A) PARAMETER S1 Test Point tPZH ten RL S2 1 kΩ tPZL tPHZ tdis tPLZ −− LOAD CIRCUIT 2.7 V 2.7 V S1 S2 50 pF or 150 pF Open Closed Closed Open Open Closed Closed Open Open Open 1 kΩ tpd or tt Input 1.3 V 0.3 V CL RL 50 pF 50 pF or 150 pF 3V 1.3 V 0.3 V 0 V tr tf VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES 3V Input 1.3 V Output Control (Low-Level Enabling) 1.3 V 0V tPLH In-Phase Output 1.3 V 10% tPHL 90% 90% tr tPHL Out-ofPhase Output 90% VOH 1.3 V 10% V OL tf tPLH 1.3 V 10% 1.3 V 10% tf 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT RISE AND FALL TIMES 3V 1.3 V 1.3 V 0V tPZL Output Waveform 1 (See Note B) tPLZ ≈VCC 1.3 V 10% tPZH Output Waveform 2 (See Note B) VOL tPHZ 1.3 V 90% VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES FOR 3-STATE OUTPUTS NOTES: A. CL includes probe and test-fixture capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. D. The outputs are measured one at a time with one input transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Dec-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN74HCT244QPWRG4Q1 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT244QPWRQ1 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74HCT244-Q1 : SN74HCT244 • Catalog: Product: SN74HCT244-EP • Enhanced • Military: SN54HCT244 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog Product - Supports Defense, Aerospace and Medical Applications • Enhanced • Military - QML certified for Military and Defense Applications Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated