RoHS RoHS MXG50/MXY50 Series SEMICONDUCTOR Nell High Power Products Arc Type Rectifier Module, 50A MXG50-08 Thru MXG50-12 3- M 5 MXY50-08 Thru MXY50-12 M 6 Ø7 R73 4 R 2 R59 3 45 71 1 3 16 18 95.5 All dimensions in millimeters FEATURES Typical lR less than 2.0 µA High surge current capability 4 Low thermal resistance 1 2 3 4 1 3 2 Compliant to RoHS lsolation voltage up to 2500V TYPICAL APPLICATIONS ADVANTAGE PRIMARY CHARACTERRISTICS International standard package Epoxy meets UL 94 V-O flammability rating Small volume, light weight Small thermal resistance High heat-conduction rate Low temperature rise Weight:120g (4.2 ozs) www.nellsemi.com MXY50 MXG50 General purpose use in AC/DC bridge full wave rectification for big power generator, field supply for DC motor, industrial automation applications. Page 1 of 2 IF(AV) 50A V RRM 800V to 1200V I FSM 450A IR 5 µA VF 1.30V T J max. 150ºC MXG50/MXY50 Series SEMICONDUCTOR RoHS RoHS Nell High Power Products MAJOR RATINGS AND CHARACTERISTICS (TA = 25°C unless otherwise noted) MXG50/MXY50 PARAMETER UNIT SYMBOL 08 10 12 Maximum repetitive peak reverse voltage V RRM 800 1000 1200 V Peak reverse non-repetitive voltage V RSM 900 1100 1300 V Maximum DC blocking voltage V DC 800 1000 1200 V Maximum average forward rectified output current I F(AV) 50 A Peak forward surge current single sine-wave superimposed on rated load I FSM 450 A I 2t 1012 A 2s V ISO 2500 V TJ -40 to 150 ºC T stg -40 to 125 ºC Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms) for fusing RMS isolation voltage from case to leads Operating junction storage temperature range Storage temperature range ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) TEST CONDITIONS SYMBOL Maximum instantaneous forward drop per diode I F = 157A VF Maximum reverse DC current at rated DC blocking T A = 25°C PARAMETER voltage per diod MXG50/MXY50 08 IR T A = 150°C 10 UNIT 12 1.30 V 5 µA 3 mA THERMAL AND MECHANICAC (TA = 25°C unless otherwise noted) MXG50/MXY50 PARAMETER TEST CONDITIONS UNIT SYMBOL 08 Typical thermal resistance junction to case Single-side heat dissipation, sine half wave Mounting torque(2) A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound. R θJC (1) Approximate weight Notes (1) With heatsink, single side heat dissipation, half sine wave. (2) M5 & M6 screws. Device code www.nellsemi.com MXG 50 1 2 - 12 3 1 - MXG = for common anode MXY = for common cathode 2 - I F(AV) rating: "50" for 50A 3 - Voltage code: code x 100 = V RRM Page 2 of 2 10 12 1.0 °C/W 2.0 to 2.5 Nm 120 g