RoHS GBJ25H Series RoHS SEMICONDUCTOR Nell High Power Products Glass Passivated Single-Phase Bridge Rectifier, 25A GBJ2504H Thru GBJ2512H 30±0.3 30±0.3 8.8±0.2 3.6±0.1 0.85±0.05 Ø4.0 20±0.3 19±0.2 Aluminum base plate 20±0.3 Ø3.2±0.2 Ø6.0±0.2 29±0.2 1.0±0.1 + ~ ~ Aluminum base plate 4.6±0.1 4±0.2 17.5±0.2 2.0±0.2 1.0±0.1 10±0.2 0.65±0.05 7.5±0.2 7.5±0.2 All dimensions in millimeters FEATURES UL recognition file number E320098 Typical IR less than 2.0 µA High surge current capability Low thermal resistance Compliant to RoHS Isolation voltage up to 2500V Front Rear TYPICAL APPLICATIONS General purpose use in AC/DC bridge full wave rectification for big power supply, field supply for DC motor, industrial automation applications. ADVANTAGE International standard package Epoxy meets UL 94 V-O flammability rating Small volume, light weight Small thermal resistance High heat-conduction rate Low temperature rise High temperature soldering guaranteed : 260°C/10 second, 2.3kg tension force Weight: 6.7g (0.24 ozs) www.nellsemi.com + ~ ~ PRIMARY CHARACTERRISTICS Page 1 of 3 IF(AV) 25A V RRM 400V to 1200V I FSM 350A IR 5 µA VF 1.10V T J max. 150ºC RoHS GBJ25H Series RoHS SEMICONDUCTOR Nell High Power Products MAJOR RATINGS AND CHARACTERISTICS (TA = 25°C unless otherwise noted) GBJ25..H PARAMETER UNIT SYMBOL 04 06 08 10 12 Maximum repetitive peak reverse voltage V RRM 400 600 800 1000 1200 V Peak reverse non-repetitive voltage V RSM 500 700 900 1100 1300 V V DC 400 600 800 1000 1200 V Maximum DC blocking voltage Maximum average forward rectified output current, T c = 85°C Peak forward surge current single sine-wave superimposed on I F(AV) 25 A I FSM 350 A I 2t 508 A 2s V ISO 2500 V TJ -40 to 150 ºC T STG -40 to 150 ºC rated load Rating (non-repetitive, for t greater than 1 ms and less than 8.3 ms) for fusing RMS isolation voltage from case to leads Operating junction storage temperature range Storage temperature range ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) PARAMETER Maximum instantaneous forward drop per diode Maximum reverse DC current at rated DC blocking SYMBOL I F = 12.5A VF T A = 25°C voltage per diod GBJ25..H TEST CONDITIONS 04 06 08 UNIT 10 12 1.10 V 5 IR T A = 150°C µA 500 THERMAL AND MECHANICAL (TA = 25°C unless otherwise noted) GBJ25..H TEST CONDITIONS PARAMETER UNIT SYMBOL 04 Typical thermal resistance junction to case Single-side heat dissipation, sine half wave Mounting torque ± 10 % A mounting compound is recommended and the torque should be rechecked after a period of 3 hours to allow for the spread of the compound. to heatsink M3 06 R θJC (1) Approximate weight Notes (1) With heatsink, single side heat dissipation, half sine wave. Ordering Information Tabel Device code www.nellsemi.com GBJ 25 10 H 1 2 3 4 1 - Product type : “GBJ” Package,1Ø Bridge 2 - I F(AV) rating : "25" for 25A 3 - Voltage code : code x 100 = VRRM 4 - H: With Aluminum base plate (heatsink) Page 2 of 3 08 10 12 0.85 °C/W 0.8 N.m 6.7 g RoHS GBJ25H Series RoHS SEMICONDUCTOR Nell High Power Products Fig.1 Derating curve for output rectified current Fig.2 Maximum non-repetitive peak forward surge current per bridge element 400 Peak forward surge current (A) Average forward output current (A) T J = 25°C 25 20 15 10 5 0 200 100 0 0 20 60 40 80 100 120 140 160 10 1 100 Ambient temperature (°C) Number of cycles at 50H z Fig.3 Typical reverse characteristics per bridge element Fig.4 Typical forward characteristics per bridge element 100 100 Instantaneous forward current (A) Instantaneous reverse current (μA) 300 10 TJ = 100 °C 1.0 0.1 TJ = 2 10 1.0 T J = 25°C 5°C 0.1 0.01 0 20 40 60 80 100 120 140 0.5 Percent of rated peak reverse voltage (%) www.nellsemi.com 0.7 0.9 1.1 Forward voltage (v) Page 3 of 3 1.3