NIEC P2H10M440L

MOSFET 70A 450~
450~500V
PD10M441L/440L
PD10M441L
PD10M440L
P2H10M441L P2H10M440L
P2H10M441L/440L
108.0
108.0
質量 Approximate Weight :220g
質量 Approximate Weight :220g
■最大定格 Maximum Ratings
項
目
Rating
ドレイン・ソース間電圧
VDSS
Drain-Source Voltage
ゲート・ソース間電圧
Gate-Source Voltage
ドレイン電流(連続)
Duty=50%
Continuous Drain Current
D.C.
パルスドレイン電流
Pulsed Drain Current
全損失
Total Power Dissipation
動作接合温度範囲
Operating Junction Temperature Range
保存温度範囲
Storage Temperature Range
絶縁耐圧
RMS Isolation Voltage
締付トルク
1
Mounting Torque
記 号
Symbol
単位
耐 圧・クラス Grade
PD10M441L/P2H10M441L PD10M440L/P2H10M440L Unit
450
500
V
VGS=0V
VGSS
±20
V
ID
70(Tc=25℃)
50(Tc=25℃)
A
IDM
140(Tc=25℃)
A
PD
500(Tc=25℃)
W
Tjw
−40∼+150℃
℃
Tstg
−40∼+125℃
℃
Viso
Ftor
2000
端子 - ベース間,AC1 分間 Terminals to Base, AC 1 min .
3.0(本体取付 Module Base to Heat sink)
2.0(ネジ端子部 Bus bar to Main Terminals)
V
N・m
■電気的特性 Electrical Characteristics(@TC=25℃ unless otherwise noted)
項 目
Characteristic
ドレイン遮断電流
Zero Gate Voltage Drain Current
ゲート・ソース間しきい値電圧
Gate-Source Threshold Voltage
ゲート・ソース間漏れ電流
Gate-Source Leakage Current
ドレイン・ソース間オン抵抗(MOSFET部)
Static Drain-Source On-Resistance
順伝達コンダクタンス
Forward Transconductance
入力容量
Input Capacitance
出力容量
Output Capacitance
帰還容量
Reverse Transfer Capacitance
ターン・オン遅延時間
Turn-On Delay Time
上昇時間
Rise Time
ターン・オン遅延時間
Turn-Off Delay Time
下降時間
Fall Time
記号
Symbol
条 件
Condition
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
単位
Unit
VDS=VDSS, VGS=0V
─
─
1
Tj=125℃, VDS=VDSS, VGS=0V
─
─
4
VDS=VGS, ID=1mA
2
3.1
4
V
VGS=±20V, VDS=0V
─
─
1
μA
rDS
(on)
VGS=10V, ID=40A
─
75
85
mΩ
gfg
VDS=15V, ID=40A
─
65
─
S
─
13
─
nF
─
2.2
─
nF
Crss
─
0.45
─
nF
t(on)
d
─
140
─
ns
─
110
─
ns
─
300
─
ns
─
50
─
ns
IDSS
VGS
(th)
IGSS
Ciss
Coss
tr
t(off)
d
VGS=0V
VDS=25V
f=1MHz
VDD=1/2VDSS
ID=25A
VGS=−5V, +10V
RG=7Ω
tf
mA
■内部ダイオード定格・特性 Source-Drain Diode Ratings and Characteristics(@TC=25℃ unless otherwise noted)
項 目
Characteristic
ソース電流(連続)
Continuous Source Current
パルスソース電流
Pulsed Source Current
ダイオード順電圧
Diode Forward Voltage
逆回復時間
Reverse Recovery Time
逆回復電荷
Reverse Recovery Charge
記号
Symbol
IS
条 件
Condition
D. C.
ISM
VSD
trr
Qr
IS=70A
IS=70A
−diS/dt=100A/μs
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
単位
Unit
─
─
50
A
─
─
140
A
─
─
2.0
V
─
1100
─
ns
─
36
─
μC
■熱抵抗特性 Thermal Characteristics
項 目
Characteristic
記号
Symbol
熱抵抗(接合部−ケース間)
Thermal Resistance, Junction to Case
Rth(j-c)
接触熱抵抗(ケース−冷却フィン間)
Thermal Resistance, Case to Heatsink
Rth(c-f)
条 件
Condition
特性値(最大)
Maximum Value
最小
標準
最大
Min.
Typ.
Max.
MOSFET
─
─
0.25
Diode
─
─
0.25
サーマルコンパウンド塗布
Mounting surface flat, smooth, and greased
─
─
0.1
─ 323 ─
単位
Unit
℃/W
Fig. 2 Typical Drain-Source On-Voltage
Fig. 2 Vs. Gate-Source Voltage
TC=25ı 250 s Pulse Test
10V
6V
80
60
40
VGS=5V
20
0
4V
2
4
6
8
10
DRAIN TO SOURCE VOLTAGE VDS (V)
0
VGS=0V f=1kHz
Ciss
Coss
6
0
Crss
1
2
5
10
20
50
DRAIN TO SOURCE VOLTAGE VDS (V)
2
20A
0
4
8
12
GATE TO SOURCE VOLTAGE VGS (V)
40A
20A
0.1
0
40
80
120
JUNCTION TEMPERATURE Tj ( )
160
Fig. 6 Typical Switching Time
Fig. 6 Vs. Series Gate impedance
ID=50A
ID=40A VDD=250V TC=25ı 80 s Pulse Test
10
VDD= 100V
250V
400V
5
8
4
2
1
toff
0.5
ton
0.2
0
100
200
300
400
500
TOTAL GATE CHRAGE Qg (nC)
0.1
600
Fig. 8 Typical Source-Drain Diode Forward
Fig. 8 Characteristics
RG=7 VDD=250V TC=25ı 80 s Pulse Test
ID=85A
0.2
0
-40
16
12
0
100
Fig. 7 Typical Switching Time
Fig. 7 Vs. Drain Current
1000
40A
16
GATE TO SOURCE VOLTAGE VGS (V)
CAPACITANCE C (nF)
24
12
4
Fig. 5 Typical Gate Charge
Fig. 5 Vs. Gate-Source Voltage
30
18
ID=85A
6
0
12
Fig. 4 Typical Capacitance
Fig. 4 Vs. Drain-Source Voltage
10
8
VGS=10V 250 s Pulse Test
SWITCHING TIME t ( s)
DRAIN CURRENT ID (A)
100
TC=25ı 250 s Pulse Test
12
DRAIN TO SOURCE ON VOLTAGE VDS (on)(V)
120
Fig. 3 Typical Drain-Source On Voltage
Fig. 3 Vs. Junction Temperature
DRAIN TO SOURCE ON VOLTAGE VDS (on)(V)
Fig. 1 Typical Output Characteristics
2
5
10
20
50
100
SERIES GATE IMPEDANCE RG ( )
Fig. 9 Typical Reverse Recovery Characteristics
250 s Pulse Test
120
200
IS=70A
IS=40A
Tj=150ı
REVERSE RECOVERY TIME trr (ns)
REVERSE CURRENT IR (A)
2000
500
100
SOURCE CURRENT IS (A)
200
td(on)
100
tr
tf
50
Tj=125ı
5
2
10
20
50
100
200
40
500
200
IR
100
200
100
0
0
0.2
0.4
0.6
0.8
1.0
SOURCE TO DRAIN VOLTAGE VSD (V)
10 s
50
100 s
20
10
5
10 -1
Per Unit Base
Rth(j-c)=0.25ı/W
1 Shot Pulse
5
2
10 -2 -5
10
10 -4
DC
2
200
2
10ms
1
100
2
5
1
0
10 0
1ms
2
1.2
Fig. 11 Normalized Transient Thermal impedance(MOSFET)
TC=25ı Tj=150ıMAX Single Pulse
Operation in this area
is limited by RDS (on)
500
0.5
Tj=25ı
trr
50
Fig. 10 Maximum Safe Operating Area
DRAIN CURRENT ID (A)
60
20
20
10
1000
80
NORMALIZED TRANSIENT
THERMAL IMPEDANCE
[rth(j-c) / Rth(j-c)]
SWITCHING TIME t (ns)
td(off)
-441L -440L
50 100 200 500 1000
5
10 20
DRAIN TO SOURCE VOLTAGE VDS (V)
- 308 -
10 -3
10 -2
10 -1
PULSE DURATION t (s)
10 0
10 1
300
400
-dis/dt (A/ s)
500
600
M
O
S
F
E
T