FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L Issue Date: Dec. 8, 2004 16M–Word x 16–Bit or 32M–Word x 8–Bit P2ROM FEATURES · 16,777,216-word × 16-bit/33,554,432-word × 8-bit electrically switchable configuration · Access time 2.7 V to 3.6 V power supply 120 ns MAX 3.0 V to 3.6 V power supply 100 ns MAX · Operating current 35 mA MAX(5MHz) · Standby current 10 µA MAX · Input/Output TTL compatible · Three-state output PACKAGES · MR27T25603L-xxxTM 50-pin plastic TSOP (TSOP(2)50-P-400-0.80-K) P2ROM ADVANCED TECHNOLOGY PIN CONFIGURATION (TOP VIEW) A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A23 GND BYTE# A0 D0 D8 D1 D9 Vcc D2 D10 D3 D11 GND 1 50 2 49 3 48 4 47 5 46 6 45 7 44 8 43 9 42 10 41 11 40 12 13 14 50TSOP (Type2) 39 38 37 15 36 16 35 17 34 18 33 19 32 20 31 21 30 22 29 23 28 24 27 25 26 CE# A12 A13 A14 A15 Vcc A16 A17 A18 A19 A20 A21 GND A22 NC OE# D15/A-1 D7 D14 D6 D13 D5 D12 D4 Vcc P2ROM stands for Production Programmed ROM. This exclusive Oki technology utilizes factory test equipment for programming the customers code into the P2ROM prior to final production testing. Advancements in this technology allows production costs to be equivalent to MASKROM and has many advantages and added benefits over the other non-volatile technologies, which include the following; · Short lead time, since the P2ROM is programmed at the final stage of the production process, a large P2ROM inventory "bank system" of un-programmed packaged products are maintained to provide an aggressive lead-time and minimize liability as a custom product. · No mask charge, since P2ROMs do not utilize a custom mask for storing customer code, no mask charges apply. · No additional programming charge, unlike Flash and OTP that require additional programming and handling costs, the P2ROM already has the code loaded at the factory with minimal effect on the production throughput. The cost is included in the unit price. · Custom Marking is available at no additional charge. 1/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM BLOCK DIAGRAM A–1 OE# CE OE Row Decoder CE# BYTE# Memory Cell Matrix 16M × 16-Bit or 32M × 8-Bit Column Decoder A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 Address Buffer × 8/× 16 Switch Multiplexer Output Buffer D0 D2 D1 D4 D3 D6 D5 D8 D7 D10 D9 D12 D11 D14 D13 D15 In 8-bit output mode, these pins are placed in a high-Z state and pin D15 functions as the A-1 address pin. PIN DESCRIPTIONS Pin name D15 / A–1 A0 to A23 D0 to D14 CE# OE# BYTE# VCC VSS Functions Data output / Address input Address inputs Data outputs Chip enable input Output enable input Word / Byte select input Power supply voltage Ground 2/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM FUNCTION TABLE Mode Read (16-Bit) Read (8-Bit) CE# L L OE# L L Output disable L H Standby H ∗ BYTE# H L H L H L VCC 2.7 V to 3.6 V D0 to D7 DOUT D8 to D14 DOUT Hi–Z D15/A–1 Hi–Z ∗ Hi–Z ∗ L/H ∗: Don’t Care (H or L) ABSOLUTE MAXIMUM RATINGS Parameter Operating temperature under bias Storage temperature Input voltage Output voltage Power supply voltage Power dissipation per package Output short circuit current Symbol Ta Tstg VI VO VCC PD IOS Condition — Relative to VSS Ta = 25°C — Value 0 to 70 –55 to 125 –0.5 to VCC+0.5 –0.5 to VCC+0.5 –0.5 to 5 1.0 10 Unit °C °C V V V W mA RECOMMENDED OPERATING CONDITIONS Parameter VCC power supply voltage Input “H” level Input “L” level Symbol VCC VIH VIL Condition VCC = 2.7 to 3.6 V Min. 2.7 2.2 –0.5∗∗ Typ. — — — (Ta = 0 to 70°C) Max. Unit 3.6 V VCC+0.5∗ V 0.6 V Voltage is relative to VSS. ∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns. ∗∗ : -1.5V(Min.) when pulse width of undershoot is less than 10ns. PIN CAPACITANCE Parameter Input BYTE# Output Symbol CIN1 CIN2 COUT Condition VI = 0 V VO = 0 V Min. — — — (VCC = 3.0 V, Ta = 25°C, f = 1 MHz) Typ. Max. Unit — 10 pF — 200 — 10 3/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM ELECTRICAL CHARACTERISTICS DC Characteristics Parameter Input leakage current Output leakage current VCC power supply current (Standby) VCC power supply current (Read) Input “H” level Input “L” level Output “H” level Output “L” level Symbol ILI ILO ICCSC ICCST ICCA VIH VIL VOH VOL Condition VI = 0 to VCC VO = 0 to VCC CE# = VCC CE# = VIH CE# = VIL, OE# = VIH f=5MHz — — IOH = –1 mA IOL = 2 mA Min. — — — — 2.2 –0.5∗∗ 2.4 — (VCC = 2.7 to 3.6 V, Ta = 0 to 70°C) Typ. Max. Unit — 5 µA — 5 µA — 10 µA — 1 mA — — — — 35 mA VCC+0.5∗ 0.6 — 0.4 V V V V Voltage is relative to VSS. ∗ : Vcc+1.5 V(Max.) when pulse width of overshoot is less than 10 ns. ∗∗ : –1.5 V(Min.) when pulse width of undershoot is less than 10 ns. 4/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM AC Characteristics Parameter Address cycle time Address access time (VCC = 2.7 to 3.6 V, Ta = 0 to 70°C) Max. Unit — ns 120 ns Symbol tC tACC Condition — CE# = OE# = VIL Min. 120 — CE# access time tCE OE# = VIL — 120 ns OE# access time tOE tCHZ tOHZ tOH CE# = VIL OE# = VIL CE# = VIL CE# = OE# = VIL — 0 0 0 30 20 20 — ns ns ns ns Symbol tC tACC Condition — CE# = OE# = VIL Min. 100 — CE# access time tCE OE# = VIL — 100 ns OE# access time tOE tCHZ tOHZ tOH CE# = VIL OE# = VIL CE# = VIL CE# = OE# = VIL — 0 0 0 30 20 20 — ns ns ns ns Output disable time Output hold time Parameter Address cycle time Address access time Output disable time Output hold time (VCC = 3.0 to 3.6 V, Ta = 0 to 70°C) Max. Unit — ns 100 ns Measurement conditions Input signal level -------------------------------- 0 V/3 V Input timing reference level------------------- 1/2Vcc Output load --------------------------------------- 50 pF Output timing reference level ---------------- 1/2Vcc Output load Output 50 pF (Including scope and jig) 5/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM TIMING CHART (READ CYCLE) 16-Bit Read Mode (BYTE# = VIH) tC tC A0 to A23 tOH tACC tCE CE# tOE tCHZ tOH OE# tOHZ tACC D0 to D15 Valid Data Hi-Z Valid Data Hi-Z 8-Bit Read Mode (BYTE# = VIL) tC tC A-1 to A23 tACC tCE tOH CE# tOE tCHZ tOH OE# tOHZ tACC D0 to D7 Hi-Z Valid Data Valid Data Hi-Z 6/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM PACKAGE DIMENSIONS (Unit: mm) TSOP(2)50-P-400-0.80-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight (g) Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 0.61 TYP. 3/Dec. 10, 1996 Notes for Mounting the Surface Mount Type Package The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times). 7/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM REVISION HISTORY Document No. Page Date Previous Edition Current Edition Description FEDR27T25603L-02-01 Apr. 1, 2004 – – Final edition 1 FEDR27T25603L-02-02 Jun. 8, 2004 3 3 Change CIN1 to 10pF FEDR27T25603L-02-03 Jul. 9, 2004 3 1, 4 3 1, 5 FEDR27T25603L-02-04 Dec. 8, 2004 1, 8 1 Add PD condition and IOS = 10mA Add access time 100ns spec. Delete MR27T25603L-xxxMB 8/9 FEDR27T25603L-02-04 OKI Semiconductor MR27T25603L / P2ROM NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. 2. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. 3. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. 4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. 5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof. 6. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. 7. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. 8. No part of the contents contained herein may be reprinted or reproduced without our prior permission. Copyright 2004 Oki Electric Industry Co., Ltd. 9/9