TI 74AC11478

SCAS182 − APRIL 1989 − REVISED APRIL 1993
•
•
•
•
•
•
DW OR NT PACKAGE
(TOP VIEW)
Specifically Designed for Data
Synchronization Applications
3-State Outputs Drive Bus Lines Directly
Flow-Through Architecture Optimizes PCB
Layout
Center-Pin VCC and GND Pin
Configurations Minimize High-Speed
Switching Noise
EPIC  (Enhanced-Performance Implanted
CMOS ) 1-µm Process
Package Options Include Plastic
Small-Outline Packages and Standard
Plastic 300-mil DIPs
1Q
2Q
3Q
4Q
GND
GND
GND
GND
5Q
6Q
7Q
8Q
1
24
2
23
3
22
4
21
5
20
6
19
7
18
8
17
9
16
10
15
11
14
12
13
OE
1D
2D
3D
4D
VCC
VCC
5D
6D
7D
8D
CLK
description
The 74AC11478 is an 8-bit dual-rank synchronizer circuit designed specifically for data synchronization
applications in which the normal setup and hold time specifications are frequently violated.
Synchronization of two digital signals operating at different frequencies is a common system problem. This
problem is typically solved by synchronizing one of the signals to the local clock through a flip-flop. This solution,
however, causes the setup and hold time specifications associated with the flip-flop to be violated. When the
setup or hold time of a flip-flop is violated, the output response is uncertain. A flip-flop is metastable if its output
hangs up in the region between VIL and VIH. The metastable condition lasts until the flip-flop recovers into one
of its two stable states. With conventional flip-flops, this recovery time can be longer than the specified maximum
propagation delay.
The problem of metastability is typically solved by adding an additional layer of synchronization. This dual-rank
approach is employed in the 74AC11478. The probability of the second stage entering the metastable state is
exponentially reduced by this dual-rank architecture. The 74AC11478 provides a one-chip solution for system
designers in asynchronous applications.
The 74AC11478 is characterized for operation from − 40°C to 85°C.
FUNCTION TABLE
OE
INPUTS
CLK†
D
Q
H
L
L
L
X
↑
↑
L
X
L
H
X
Z
L
H
Q0
OUTPUT
† Data presented at the D inputs
requires two clock cycles to appear at
the Q outputs.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright  1993, Texas Instruments Incorporated
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• DALLAS, TEXAS 75265
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POST OFFICE BOX 655303
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1
SCAS182 − APRIL 1989 − REVISED APRIL 1993
logic symbol†
OE
CLK
1D
2D
3D
4D
5D
6D
7D
8D
24
13
23
22
logic diagram (positive logic)
EN
OE
24
C1
1D
1D
1
2
21
3
20
4
17
9
16
10
15
11
14
12
CLK
1Q
2Q
1D
3Q
13
23
C1
1D
4Q
C1
1D
1
1Q
5Q
6Q
To 7 Other Channels
7Q
8Q
† This symbol is in accordance with ANSI/IEEE Std 91-1984 and
IEC Publication 617-12.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 50 mA
Continuous current through VCC or GND pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 200 mA
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
SCAS182 − APRIL 1989 − REVISED APRIL 1993
recommended operating conditions (see Note 2)
VCC
VIH
Supply voltage
VCC = 3 V
VCC = 4.5 V
High-level input voltage
VI
VO
∆t/∆v
3
5
5.5
0.9
1.35
VCC
VCC
0
VCC = 3 V
VCC = 4.5 V
Low-level output current
V
1.65
0
High-level output current
V
V
VCC = 4.5 V
VCC = 5.5 V
Low-level input voltage
UNIT
3.85
Output voltage
IOL
MAX
3.15
Input voltage
IOH
NOM
2.1
VCC = 5.5 V
VCC = 3 V
VIL
MIN
V
V
−4
−24
VCC = 5.5 V
VCC = 3 V
−24
VCC = 4.5 V
VCC = 5.5 V
24
mA
12
mA
24
Input transition rise or fall rate
TA
Operating free-air temperature
NOTE 2: Unused or floating inputs must be held high or low.
0
10
ns/V
−40
85
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
TA = 25°C
PARAMETER
TEST CONDITIONS
IOH = − 50 µA
VOH
IOH = − 4 mA
ICC
Ci
Co
TYP
MAX
MIN
3V
2.9
2.9
4.5 V
4.4
4.4
5.5 V
5.4
5.4
3V
2.58
2.48
3.94
3.8
IOL = − 24 mA
5.5 V
4.94
4.8
IOH = − 75 mA†
5.5 V
IOL = 12 mA
IOL = 24 mA
II
IOZ
MIN
4.5 V
IOL = 50 µA
VOL
VCC
MAX
UNIT
V
3.85
3V
0.1
0.1
4.5 V
0.1
0.1
5.5 V
0.1
0.1
3V
0.36
0.44
4.5 V
0.36
0.44
5.5 V
0.36
0.44
V
IOL = 75 mA†
VI = VCC or GND
5.5 V
5.5 V
± 0.1
±1
µA
VO = VCC or GND
VI = VCC or GND,
5.5 V
± 0.5
±5
µA
5.5 V
8
80
µA
IO = 0
VI = VCC or GND
VO = VCC or GND
1.65
5V
4.5
pF
5V
10
pF
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
3
SCAS182 − APRIL 1989 − REVISED APRIL 1993
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
fclock
tsu
Clock frequency
th
tw
Hold time, data after CLK↑
MIN
MAX
UNIT
55
MHz
55
Setup time, data before CLK↑
Pulse duration, CLK high or low
3
3
ns
1.5
1.5
ns
9
9
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
MIN
MAX
UNIT
83
MHz
fclock
tsu
Clock frequency
Setup time, data before CLK↑
2.5
83
2.5
ns
th
tw
Hold time, data after CLK↑
1.5
1.5
ns
6
6
ns
Pulse duration, CLK high or low
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
MIN
TA = 25°C
TYP
MAX
55
CLK
Q
OE
Q
OE
Q
MIN
MAX
55
UNIT
MHz
3.8
10.5
13.3
3.8
15
5.5
13.2
16.8
5.5
18.4
3.7
10.8
13.9
3.7
16
5.4
14.7
19.2
5.4
22.5
3.9
7.1
9.3
3.9
10.1
4
6.9
8.9
4
9.6
ns
ns
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
fmax
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
FROM
(INPUT)
TO
(OUTPUT)
TA = 25°C
MIN
TYP
MAX
83
CLK
Q
OE
Q
OE
Q
MIN
MAX
83
UNIT
MHz
2.9
6.1
8.9
2.9
10
4.3
7.9
11.2
4.3
12.3
2.9
6.4
9.6
2.9
10.8
4.1
8.1
12.3
4.1
14.0
3.2
5.7
8
3.2
8.6
3.5
5.4
7.4
3.5
8
ns
ns
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
4
Power dissipation capacitance per flip-flop
TEST CONDITIONS
Outputs enabled
Outputs disabled
•
CL = 50 pF,
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
f = 1 MHz
TYP
46
33
UNIT
pF
SCAS182 − APRIL 1989 − REVISED APRIL 1993
PARAMETER MEASUREMENT INFORMATION
2 × VCC
S1
500 Ω
From Output
Under Test
GND
CL = 50 pF
(see Note A)
S1
Open
2 × VCC
GND
TEST
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
500 Ω
tw
LOAD CIRCUIT FOR OUTPUTS
VCC
Input
50%
50%
0V
VCC
Timing Input
50%
VOLTAGE WAVEFORMS
PULSE DURATION
0V
tsu
th
VCC
Data Input
50%
50%
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
Input
(see Note B)
0V
Output
(see Note D)
tPHL
Output
Waveform 2
S1 at GND
(see Note C)
VOH
50% VCC
VOL
50% VCC
50%
0V
tPLZ
≈ VCC
Output
Waveform 1
S1 at 2 × VCC
(see Note C)
50%
tPLH
50%
tPZL
VCC
50%
VCC
Output
Control
(low-level
enabling)
0V
50% VCC
tPZH
20% VCC
VOL
tPHZ
VOH
50% VCC
80% VCC
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
For testing pulse duration: tr = tf = 1 to 3 ns. Pulse polarity can be either high-to-low-to-high or low-to-high-to-low.
C. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
D. The outputs are measured one at a time with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
•
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
•
5
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jun-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74AC11478DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
74AC11478NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
74AC11478NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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