SCLS477B − APRIL 2003 − REVISED APRIL 2004 D Controlled Baseline D D D D D D D D Balanced Propagation Delay and Transition − One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of Up To −55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Buffered Inputs Typical Propagation Delay 7 ns at VCC = 5 V, CL = 15 pF, TA = 25°C Fanout (Over Temperature Range) − Standard Outputs . . . 10 LSTTL Loads − Bus Driver Outputs . . . 15 LSTTL Loads Times Significant Power Reduction Compared to LSTTL Logic ICs 2-V to 6-V VCC Operation High Noise Immunity NIL or NIH = 30% of VCC at VCC = 5 V CMOS Input Compatibility, Il ≤ 1 µA at VOL, VOH D D D D M PACKAGE (TOP VIEW) 1A 1B 1Y 2A 2B 2Y GND † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. 1 14 2 13 3 12 4 11 5 10 6 9 7 8 VCC 4B 4A 4Y 3B 3A 3Y description/ordering information The CD74HC08 logic gates utilize silicon-gate CMOS technology to achieve operating speeds similar to LSTTL gates, with the low power consumption of standard CMOS integrated circuits. All devices can drive 10 LSTTL loads. ORDERING INFORMATION ORDERABLE PART NUMBER PACKAGE‡ TA TOP-SIDE MARKING −40°C to 125°C SOIC − M Tape and reel CD74HC08QM96EP −55°C to 125°C SOIC − M Tape and reel CD74HC08MM96EP§ HC08QEP HC08MEP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. § Product Preview FUNCTION TABLE (each gate) INPUTS A B OUTPUT Y H H H L X L X L L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated ! "#$ ! %#&'" ($) (#"! " !%$""! %$ *$ $! $+! !#$! !(( ,-) (#" %"$!!. ($! $"$!!'- "'#($ $!. '' %$$!) POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCLS477B − APRIL 2003 − REVISED APRIL 2004 logic diagram (positive logic) A Y B absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Input clamp current, IIK (VI < −0.5 V or VI > VCC + 0.5 V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Output clamp current, IOK (VO < −0.5 V or VO > VCC + 0.5 V) (see Note 1) . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO > −0.5 or VO < VCC + 0.5 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA Package thermal impedance, θJA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 180°C/W Maximum junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Lead temperature (during soldering): At distance 1/16 ± 1/32 inch (1,59 ± 0,79 mm) from case for 10 s max . . . . . . . . . . . . . . . . . . . . . . . 300°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) VCC Supply voltage VIH High-level input voltage VCC = 2 V VCC = 4.5 V VCC = 6 V VCC = 2 V VIL MIN NOM MAX 2 5 6 0.5 1.35 V 1.8 Input voltage 0 Output voltage 0 ∆t/∆v Input transition rise/fall time VCC = 2 V VCC = 4.5 V Operating free-air temperature V 4.2 VI VO TA V 1.5 3.15 VCC = 4.5 V VCC = 6 V Low-level input voltage UNIT VCC VCC V V 1000 500 VCC = 6 V Q suffix −40 125 M suffix −55 125 ns 400 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCLS477B − APRIL 2003 − REVISED APRIL 2004 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER IO (mA) TEST CONDITIONS CMOS loads VOH VI = VIH or VIL TTL loads CMOS loads VOL VI = VIH or VIL TTL loads II ICC VI = VCC or GND VI = VCC or GND TA = 25°C TYP MAX VCC MIN −0.02 2V 1.9 1.9 −0.02 4.5 V 4.4 4.4 −0.02 6V 5.9 5.9 −4 4.5 V 3.98 3.7 −5.2 6V 5.48 0.02 2V 0.1 0.1 0.02 4.5 V 0.1 0.1 0.02 6V 0.1 0.1 4 4.5 V 0.26 0.4 5.2 6V 0.26 0.4 6V ±0.1 ±1 µA 2 40 µA 10 10 pF 0 MIN MAX UNIT V 5.2 6V Ci V switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) A or B TO (OUTPUT) CONDITIONS CL = 50 pF Y CL = 15 pF tt A or B Y VCC TA = 25°C TYP MAX MIN MAX 2V 90 135 4.5 V 18 27 6V 15 23 2V 75 110 4.5 V 15 22 6V 13 19 5V CL = 50 pF MIN UNIT ns 7 ns operating characteristics, TA = 25°C, VCC = 5V PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance per gate (see Note 4) No load TYP 37 UNIT pF NOTE 4: Cpd is used to determine the dynamic power consumption, per gate. PD = VCC2 fI (Cpd + CL) fI = input frequency CL = output load capacitance VCC = supply voltage POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCLS477B − APRIL 2003 − REVISED APRIL 2004 PARAMETER MEASUREMENT INFORMATION From Output Under Test Test Point Input VCC 50% 50% 0V CL = 50 pF (see Note A) tPLH In-Phase Output LOAD CIRCUIT 50% 10% tPHL 90% 90% tr Input 50% 10% 90% 90% tr VCC 50% 10% 0 V tPHL Out-of-Phase Output 90% tf VOH 50% 10% VOL tf tPLH 50% 10% tf 50% 10% 90% VOH VOL tr VOLTAGE WAVEFORMS PROPAGATION DELAY AND OUTPUT TRANSITION TIMES VOLTAGE WAVEFORM INPUT RISE AND FALL TIMES NOTES: A. CL includes probe and test-fixture capacitance. B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns. C. The outputs are measured one at a time, with one input transition per measurement. D. tPLH and tPHL are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CD74HC08QM96EP ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/04704-01XE ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF CD74HC08-EP : CD74HC08 • Catalog: CD74HC08-Q1 • Automotive: • Military: CD54HC08 NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog - Q100 devices qualified for high-reliability automotive applications targeting zero defects • Automotive • Military - QML certified for Military and Defense Applications Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HC08QM96EP Package Package Pins Type Drawing SOIC D 14 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) 6.5 9.0 2.1 8.0 W Pin1 (mm) Quadrant 16.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Nov-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC08QM96EP SOIC D 14 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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