Token Ring Transceiver Module EPT7076 ELECTRONICS INC. • Optimized for voltage source driving into 150 ohms • • Enhanced Common Mode performance over UTP • • Robust construction allows for solder reflow processes • • Complies with or exceeds IEEE 802.5 Requirements • Electrical Parameters @ 25° C Impedance (Ω) [Xmit/Rcv] Insertion Loss (dB) Chip Side 150 1-16 MHz Max. 32 MHz Return Loss (dB Min.) 36 MHz 1-6 MHz 44 MHz 6-17 MHz Common Mode Rejection (dB Min.) 17-25 MHz 1-30 MHz 30-100 MHz 100-200 MHz Crosstalk (dB Min.) 200-300 MHz 1-30 MHz Min. Max. Min. Max. Min. Max. Cable Side Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv Xmit Rcv 100 -.8 -.6 -7 -1 -25 -3 -30 -3 -18 -23 -12 -20 -8 -10 -50 -40 -35 -35 -30 TX1+ 9 20 TXOUT 150Ω TXCT 11 100 Ω 4 FOUT LPF 150Ω -20 -20 -38 12 TPHB Schematic FIN 1 -30 19 TXOUTL TX1- 10 13 TPHA 150Ω 15 RPHB FINL 2 5 FOUT 18 RXIN RX0+ 6 FGND 3 150Ω 100 Ω RXCT 8 17 RXINL RX0- 7 Package 14 RPHA A Dimensions B Dim. A B C D E F G H I J K L Pin 1 I.D. C PCA EPT7076 Date Code J L H E K F I G (Inches) Min. Max. Nom. (Millimeters) Min. Max. Nom. 1.090 .260 .380 --.010 ----.016 .008 --.130 --- 27.69 6.60 9.65 --.254 ----.406 .203 --3.30 --- 1.110 .280 .400 --.030 ----.022 .012 --.150 --- 1.100 .270 .390 .950 .020 .050 .135 .020 .010 .075 .140 .100 28.19 7.11 10.16 --.762 ----.559 .305 --3.81 --- 27.94 6.85 9.91 24.13 .508 1.27 3.43 .508 .254 1.91 3.56 2.54 D PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 CST7076a Rev. B1 1/19/99 Product performance is limited to specified parameters. Data is subject to change without prior notice. TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com Token Ring Transceiver Module EPT7076 ELECTRONICS INC. The circuit below is a guideline for interconnecting PCA’s EPT7076 with a typical Token Ring PHY chip for 4 Mb/16Mb applications over UTP cable. Further details of system design should be obtained from the specific chip manufacturer. Note that this module is optimized for a “voltage source” driver such as TI380C60. Note that there is no need for the receiver side filtering. So consider this a cost effective solution for almost all Token Ring applications using this or similar chips. The pull down resistors to chassis via a cap shown around the RJ45 connector have been known to suppress unwanted radiation that unused wires pick up from the immediate environment. This is specially true if driving UTP cable. Their placement and use are to be considered carefully before a design is finalized. No specific recommendation is made here for phantom return circuitry: implementation varies. Please note that additional emission control has been observed if both nodes of the phantom bypass capacitor on the transmit channel are pulled to the chassis ground via suitable capacitors. It is recommended that there be a neat separation of ground planes in the layout. It is generally accepted practice to limit the plane off at least 0.05 inches away from the chip side of EPT7076. There need not be any ground plane beyond this point. For best results, PCB designer should design the outgoing traces preferably to be 50 ohms, balanced and well coupled to achieve minimum radiation from these traces. Typical Application Circuit Connection to TI380C60 (or Equivalent) For NIC. Rcv+ 18 4 7 17 5 15 20 3 14 19 6 150Ω 6 PH-B Rcv+5V PH-A +5V Xmit± 1 50Ω/2W PHOUTA Rcv± 13 2 RJ4 5 7 8 8 50Ω/2W PHOUTB 10µF 12 10µF 4 TI380C60 5 10 100Ω 100Ω 442Ω Xmit+ Xmit- 3 9 EPT7076 1 11 2 Notes : 1. Pins 15 & 14 are left unconnected. Applications vary. Your system may have a phantom drive return detection circuit needing pins 15 & 14 to be connected separately or together, can be taken to ground via an inductor. PCA ELECTRONICS, INC. 16799 SCHOENBORN ST. NORTH HILLS, CA 91343 CST7076b Rev. B1 1/19/99 TEL: (818) 892-0761 FAX: (818) 894-5791 http://www.pca.com