Product Specification PE4263 DIE SP6T UltraCMOS™ 2.6 V Switch 100 – 3000 MHz Features Figure 1. Functional Diagram • Three pin CMOS logic control with • TX1 RX1 • TX2 RX2 • RX3 • • CMOS Control/Driver and ESD RX4 • integral decoder/driver Low TX insertion loss: 0.55 dB at 900 MHz, 0.65 dB at 1900 MHz TX – RX Isolation of 48 dB at 900 MHz, 40 dB at 1900 MHz Low harmonics: 2fo = -85 dBc and 3fo = -72 dBc 1500 V HBM ESD tolerance all ports 41 dBm P1dB No blocking capacitors required Product Description V2 V1 V3 The PE4263 SP6T RF UltraCMOS™ Switch addresses the specific design needs of the Quad-Band GSM Handset Antenna Switch Module Market. On-chip CMOS decode logic facilitates three-pin low voltage CMOS control. High ESD tolerance of 1500 V at all ports, no blocking capacitor requirements and on-chip SAW filter over-voltage protection devices make this the ultimate in integration and ruggedness. Figure 2. Die Top View TX1 RX1 ANT GND RX2 GND The PE4263 UltraCMOS™ RF Switch is manufactured in Peregrine’s patented Ultra Thin Silicon (UTSi®) CMOS process, offering the performance of GaAs with the economy and integration of conventional CMOS. GND GND RX3 GND RX4 TX2 GND GND GND VDD V3 GND V2 V1 GND Document No. 70-0175-02 │ www.psemi.com NDA required for full version: Contact [email protected] ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 1 of 4 PE4263 Product Specification Table 1. Electrical Specifications @ +25 °C, VDD = 2.6 V (ZS = ZL = 50 Ω) Parameter Conditions Typical Operational Frequency Units MHz Insertion Loss Isolation Return Loss 2nd Harmonic 3rd Harmonic Switching Time ANT - TX - 850 / 900 MHz 0.55 dB ANT - TX - 1800 / 1900 MHz 0.65 dB ANT - RX - 850 / 900 MHz 0.90 dB ANT - RX - 1800 / 1900 MHz 1.00 dB TX - RX - 850 / 900 MHz 48 dB TX - RX - 1800 / 1900 MHz 40 dB TX - TX - 850 / 900 MHz 29 dB TX - TX - 1800 / 1900 MHz 25 dB ANT - TX - 850 / 900 MHz 31 dB ANT - TX - 1800 / 1900 MHz 25 dB 850 / 900 MHz 22 1800 / 1900 MHz 23 35 dBm TX Input - 850 / 900 MHz -85 33 dBm TX Input - 1800 / 1900 MHz -81 35 dBm TX Input - 850 / 900 MHz -72 33 dBm TX Input - 1800 / 1900 MHz -66 (10-90%) (90-10%) RF dB dBc dBc µs 2 Table 2. Pin Descriptions Pin Name 12 ANT RF Common – Antenna 22 TX1 RF I/O - TX1 31 GND Ground (Requires two bond wires) 4 TX2 RF I/O – TX2 51 GND Ground 1 6 GND Ground 7 VDD Supply 8 V3 Switch control input, CMOS logic level 91 GND 10 V2 Switch control input, CMOS logic level 11 V1 Switch control input, CMOS logic level 121 GND Ground 131 GND Ground 142 RX4 RF I/O – RX4 1 15 GND Ground 162 RX3 RF I/O – RX3 171 TX1 GND GND 2 1 20 3 Ground RX1 RF I/O – RX1 15 GND 14 RX4 13 GND 7 8 9 10 11 12 GND Ground 2 GND RX3 V1 RF I/O – RX2 GND 6 17 16 V2 RX2 191 5 RX2 GND 18 PE4263 Die 4 GND 18 V3 Ground TX2 GND RX1 19 VDD GND 2 20 Figure 3. Pin Configuration (Top View) GND 2 Description ANT Pin No. Notes: 1. Bond wires should be physically short and connected to ground plane for best performance. 2. Blocking capacitors needed only when non-zero DC voltage present. ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 2 of 4 Document No. 70-0175-02 │ UltraCMOS™ RFIC Solutions NDA required for full version: contact [email protected] PE4263 Product Specification Table 3. Absolute Maximum Ratings Symbol VDD Parameter/Conditions Power supply voltage Min Table 4. DC Electrical Specifications Max Units Parameter Min Typ Max Units -0.3 4.0 V 2.4 2.6 2.8 V V VDD Supply Voltage IDD Power Supply Current 13 20 µA °C Control Voltage High °C Control Voltage Low 0.3 x VDD V VI Voltage on any input -0.3 VDD+ 0.3 TST Storage temperature range -65 +150 Operating temperature range TOP -40 TX input power (50 Ω) 1 +85 +38 PIN dBm RX input power (50 Ω) 1 ESD Voltage (HBM, MIL_STD 883 Method 3015.7) VESD ESD Voltage (MM, JEDEC, JESD22-A114-B) (VDD = 2.6V) 100 ESD Voltage (CDM, JEDEC, JESD22-C101-A) 2000 ESD Voltage at ANT Port (IEC 61000-4-2) 1700 V V V V Table 5. Truth Table +23 1500 0.7 x VDD Path V3 V2 V1 ANT – RX1 0 0 0 ANT – RX2 0 0 1 ANT – RX3 0 1 0 ANT – RX4 0 1 1 ANT - TX1 1 0 x ANT - TX2 1 1 x V Electrostatic Discharge (ESD) Precautions Note: 1. Max RF specified with VDD applied Absolute Maximum Ratings are those values listed in the above table. Exceeding these values may cause permanent device damage. Functional operation should be restricted to the limits in the DC Electrical Specifications table. Exposure to absolute maximum ratings for extended periods may affect device reliability. When handling this UltraCMOS™ device, observe the same precautions that you would use with other ESD-sensitive devices. Although this device contains circuitry to protect it from damage due to ESD, precautions should be taken to avoid exceeding the specified rating. Latch-Up Avoidance Unlike conventional CMOS devices, UltraCMOS™ devices are immune to latch-up. Table 6. Ordering Information Order Code Die ID Description 4263-92 C9797_3 PE4263-DIE-D Film Frame Wafer (Gross Die / Wafer Quantity) 4263-98 C9797_3 PE4263-DIE-400G Waffle Pack 400 Dice / Waffle Pack 4263-10 C9797_3 PE4263-DIE-1H Evaluation Kit 1/ box Document No. 70-0175-02 │ www.psemi.com NDA required for full version: contact [email protected] Package Shipping Method ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 3 of 4 PE4263 Product Specification Sales Offices The Americas North Asia Pacific Peregrine Semiconductor Corp. Peregrine Semiconductor K.K. 9450 Carroll Park Drive San Diego, CA 92121 Tel 858-731-9400 Fax 858-731-9499 5A-5, 5F Imperial Tower 1-1-1 Uchisaiwaicho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 Europe Peregrine Semiconductor Europe Commercial Products: Bâtiment Maine 13-15 rue des Quatre Vents F- 92380 Garches, France Tel: +33-1-47-41-91-73 Fax : +33-1-47-41-91-73 Space and Defense Products: 180 Rue Jean de Guiramand 13852 Aix-En-Provence cedex 3, France Tel: +33(0) 4 4239 3361 Fax: +33(0) 4 4239 7227 South Asia Pacific Peregrine Semiconductor 28G, Times Square, No. 500 Zhangyang Road, Shanghai, 200122, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652 For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice). ©2005 Peregrine Semiconductor Corp. All rights reserved. Page 4 of 4 The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS is a trademark of Peregrine Semiconductor Corp. Document No. 70-0175-02 │ UltraCMOS™ RFIC Solutions NDA required for full version: contact [email protected]