DS26LS31C, DS26LS31M www.ti.com SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 DS26LS31C/DS26LS31M Quad High Speed Differential Line Driver Check for Samples: DS26LS31C, DS26LS31M FEATURES DESCRIPTION • • • • • The DS26LS31 is a quad differential line driver designed for digital data transmission over balanced lines. The DS26LS31 meets all the requirements of EIA Standard RS-422 and Federal Standard 1020. It is designed to provide unipolar differential drive to twisted-pair or parallel-wire transmission lines. 1 2 • • • • • Output Skew—2.0 ns Typical Input to output delay—10 ns Typical Operation from Single 5V Supply Outputs Won't Load Line when VCC = 0V Four Line Drivers in One Package for Maximum Package Density Output Short-Circuit Protection Complementary Outputs Meets the Requirements of EIA Standard RS422 Pin Compatible with AM26LS31 Available in Military and Commercial Temperature Range The circuit provides an enable and disable common to all four drivers. The DS26LS31 TRI-STATE outputs and logically complementary outputs. The inputs are compatible and are all one unit load. function features ANDed all LS Logic and Connection Diagrams Top View For Complete Military Product Specifications, refer to the appropriate SMD or MDS. Figure 1. PDIP Package See Package D0016A or NFG0016E See Package Numbers NAJ0020A, NFE0016A or NAD0016A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS26LS31C, DS26LS31M SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 7V Input Voltage 7V Output Voltage 5.5V −0.25 to 6V Output Voltage (Power OFF) Maximum Power Dissipation (3) at 25°C Cavity Package 1509 mW NFG0016E Package 1476 mW D0016A Package 1051 mW (1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply that the devices should be operated at these limits. The Electrical Characteristics provide conditions for actual device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. Derate cavity package 10.1 mW/°C above 25°C; derate molded DIP package 11.9 mW/°C above 25°C; derate SO package 8.41 mW/°C above 25°C. (2) (3) Operating Conditions Min Max Units Supply Voltage, VCC DS26LS31M 4.5 5.5 V DS26LS31 4.75 5.25 V −55 +125 °C 0 +70 °C Typ Max Units Temperature, TA DS26LS31M DS26LS31 Electrical Characteristics (1) (2) (3) Parameter Test Conditions Min VOH Output High Voltage IOH = −20 mA VOL Output Low Voltage IOL = 20 mA VIH Input High Voltage VIL Input Low Voltage IIL Input Low Current VIN = 0.4V IIH Input High Current VIN = 2.7V 20 μA II Input Reverse Current VIN = 7V 0.1 mA IO TRI-STATE Output Current VO = 2.5V 20 μA VO = 0.5V −20 μA VCL Input Clamp Voltage IIN = −18 mA −1.5 V ISC Output Short-Circuit Current −150 mA ICC Power Supply Current 60 mA (1) (2) (3) 2 2.5 V 0.5 2.0 V −40 −30 All Outputs Disabled or Active V 35 0.8 V −200 μA Unless otherwise specified min/max limits apply across the −55°C to +125°C temperature range for the DS726LS31M and across the 0°C to +70°C range for the DS26LS31. All typicals are given for V CC = 5V and TA = 25°C. All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless otherwise specified. Only one output at a time should be shorted. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26LS31C DS26LS31M DS26LS31C, DS26LS31M www.ti.com SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 Switching Characteristics VCC = 5V, TA = 25°C Parameter Test Conditions Min Typ Max Units tPLH Input to Output CL = 30 pF 10 15 ns tPHL Input to Output CL = 30 pF 10 15 ns Skew Output to Output CL = 30 pF 2.0 6.0 ns tLZ Enable to Output CL = 10 pF, S2 Open 15 35 ns tHZ Enable to Output CL = 10 pF, S1 Open 15 25 ns tZL Enable to Output CL = 30 pF, S2 Open 20 30 ns tZH Enable to Output CL = 30 pF, S1 Open 20 30 ns AC TEST CIRCUIT AND SWITCHING TIME WAVEFORMS S1 and S2 of load circuit are closed except where shown. Figure 2. AC Test Circuit f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns Figure 3. Propagation Delays Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26LS31C DS26LS31M Submit Documentation Feedback 3 DS26LS31C, DS26LS31M SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 www.ti.com f = 1 MHz, tr ≤ 15 ns, tf ≤ 6 ns Figure 4. Enable and Disable Times TYPICAL APPLICATIONS RT is optional although highly recommended to reduce reflection. Figure 5. Two-Wire Balanced System, RS-422 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26LS31C DS26LS31M DS26LS31C, DS26LS31M www.ti.com SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 Typical Performance Characteristics DS26LS31CN Unloaded IC vs Frequency vs TA DS26LS31 ICC vs VCC vs TA Figure 6. Figure 7. DS26LS31CN VOH vs IOH vs TA DS26LS31CN VOL vs IOL vs TA Figure 8. Figure 9. DS26LS31CN VOD vs IO vs TA Figure 10. Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26LS31C DS26LS31M Submit Documentation Feedback 5 DS26LS31C, DS26LS31M SNOSBK1C – JUNE 1998 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS26LS31C DS26LS31M PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) AM26LS31PC Package Type Package Pins Package Drawing Qty NRND PDIP NFG 16 25 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking TBD Call TI Call TI 0 to 70 DS26LS31CN AM26LS31PC (4/5) DS26LS31CM NRND SOIC D 16 48 TBD Call TI Call TI 0 to 70 DS26LS31CM DS26LS31CM/NOPB ACTIVE SOIC D 16 48 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS31CM DS26LS31CMX NRND SOIC D 16 2500 TBD Call TI Call TI 0 to 70 DS26LS31CM DS26LS31CMX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS26LS31CM DS26LS31CN NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS26LS31CN AM26LS31PC DS26LS31CN/NOPB ACTIVE PDIP NFG 16 25 Pb-Free (RoHS) CU SN Level-1-NA-UNLIM 0 to 70 DS26LS31CN AM26LS31PC DS26LS31N NRND PDIP NFG 16 25 TBD Call TI Call TI 0 to 70 DS26LS31CN AM26LS31PC (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS26LS31CMX SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 DS26LS31CMX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS26LS31CMX SOIC D 16 2500 367.0 367.0 35.0 DS26LS31CMX/NOPB SOIC D 16 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFG0016E N0016E N16E (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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