LM380 www.ti.com SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 LM380 2.5W Audio Power Amplifier Check for Samples: LM380 FEATURES DESCRIPTION • • • • • • • • The LM380 is a power audio amplifier for consumer applications. In order to hold system cost to a minimum, gain is internally fixed at 34 dB. A unique input stage allows ground referenced input signals. The output automatically self-centers to one-half the supply voltage. 1 • Wide Supply Voltage Range: 10V-22V Low Quiescent Power Drain: 0.13W (VS= 18V) Voltage Gain Fixed at 50 High Peak Current Capability: 1.3A Input Referenced to GND High Input Impedance: 150kΩ Low Distortion Quiescent Output Voltage is at One-Half of the Supply Voltage Standard Dual-In-Line Package The output is short circuit proof with internal thermal limiting. The package outline is standard dual-in-line. The LM380N uses a copper lead frame. The center three pins on either side comprise a heat sink. This makes the device easy to use in standard PC layouts. Uses include simple phonograph amplifiers, intercoms, line drivers, teaching machine outputs, alarms, ultrasonic drivers, TV sound systems, AM-FM radio, small servo drivers, power converters, etc. A selected part for more power on higher supply voltages is available as the LM384. For more information see SNAA086. Connection Diagrams (Dual-In-Line Packages, Top View) Figure 1. 14-Pin PDIP See NFF0014A Package Figure 2. 8-Pin PDIP See P Package 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1994–2013, Texas Instruments Incorporated LM380 SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 www.ti.com Block and Schematic Diagrams Figure 3. 14-Pin PDIP Figure 4. 8-Pin PDIP Figure 5. 2 Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 LM380 www.ti.com SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 22V Peak Current 1.3A 14-Pin PDIP (3) Package Dissipation 8-Pin PDIP 8.3W (3) 1.67W Input Voltage ±0.5V −65°C to +150°C Storage Temperature Operating Temperature 0°C to +70°C Junction Temperature +150°C Lead Temperature (Soldering, 10 sec.) +260°C ESD rating to be determined Thermal Resistance (1) (2) (3) θJC (14-Pin PDIP) 30°C/W θJC (8-Pin PDIP) 37°C/W θJA (14-Pin PDIP) 79°C/W θJA (8-Pin PDIP) 107°C/W "Absolute Maximum Ratings" indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The package is to be derated at 15°C/W junction to heat sink pins for 14-pin pkg; 75°C/W for 8-pin. Electrical Characteristics (1) Symbol Parameter Conditions RL = 8Ω, THD = 3% (2) (3) POUT(RMS) Output Power AV Gain VOUT Output Voltage Swing ZIN Input Resistance THD Total Harmonic Distortion See (3) (4) PSRR Power Supply Rejection Ratio See (5) VS Supply Voltage BW Bandwidth IQ Quiescent Supply Current VOUTQ Quiescent Output Voltage IBIAS Bias Current ISC Short Circuit Current (1) (2) (3) (4) (5) Min Typ 40 RL = 8Ω Units W 50 60 14 Ω 0.2 % 38 POUT = 2W, RL = 8Ω dB 22 100k 8 V/V Vp-p 150k 10 Inputs Floating Max 2.5 V Hz 7 25 9.0 10 mA V 100 nA 1.3 A VS = 18V and TA = 25°C unless otherwise specified. With device Pins 3, 4, 5, 10, 11, 12 soldered into a 1/16″ epoxy glass board with 2 ounce copper foil with a minimum surface of 6 square inches. CBYPASS = 0.47 μfd on Pin 1. The maximum junction temperature of the LM380 is 150°C. Rejection ratio referred to the output with CBYPASS = 5 μF. Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 3 LM380 SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 www.ti.com Heat Sink Dimensions Staver Heat Sink #V-7 Staver Company 41 Saxon Ave. P.O. Drawer H Bayshore, NY 11706 Tel: (516) 666-8000 Copper Wings 2 Required Soldered to Pins 3, 4, 5, 10, 11, 12 Thickness 0.04 Inches 4 Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 LM380 www.ti.com SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 Typical Performance Characteristics Maximum Device Dissipation vs Ambient Temperature Device Dissipation vs Output Power—4Ω Load Figure 6. Figure 7. Device Dissipation vs Output Power—8Ω Load Device Dissipation vsOutput Power—16Ω Load Figure 8. Figure 9. Power Supply Current vs Supply Voltage Total Harmonic Distortion vs Frequency Figure 10. Figure 11. Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 5 LM380 SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics (continued) 6 Output Voltage Gain and Phase vs Frequency Total Harmonic Distortion vs Output Power Figure 12. Figure 13. Device Dissipation vs Output Power Supply Decoupling vs Frequency Figure 14. Figure 15. Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 LM380 www.ti.com SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 Typical Applications Figure 16. Phono Amplifier Figure 17. Bridge Amplifier Figure 18. Intercom Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 7 LM380 SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 www.ti.com Figure 19. Phase Shift Oscillator 8 Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 LM380 www.ti.com SNAS546C – DECEMBER 1994 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 8 Submit Documentation Feedback Copyright © 1994–2013, Texas Instruments Incorporated Product Folder Links: LM380 9 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM380N ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM380N LM380N-8/NOPB ACTIVE PDIP P 8 40 Green (RoHS & no Sb/Br) SN Level-1-NA-UNLIM 0 to 70 LM 380N-8 LM380N/NOPB ACTIVE PDIP NFF 14 25 Pb-Free (RoHS Exempt) SN Level-1-NA-UNLIM 0 to 70 LM380N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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