DS14C88 www.ti.com SNLS080C – MAY 1998 – REVISED APRIL 2013 DS14C88 Quad CMOS Line Driver Check for Samples: DS14C88 FEATURES DESCRIPTION • • • • The DS14C88, pin-for-pin compatible to the DS1488/MC1488, is a quad line drivers designed to interface data terminal equipment (DTE) with data circuit-terminating equipment (DCE). This device translates standard TTL/CMOS logic levels to levels conforming to EIA-232-D and CCITT V.28 standards. 1 2 Meets EIA-232D and CCITT V.28 Standards LOW Power Consumption Wide Power Supply Range: ±5V to ±12V Available in SOIC Package The device is fabricated in low threshold CMOS metal gate technology. The device provides very low power consumption compared to its bipolar equivalents: 500 μA (DS14C88) versus 25 mA (DS1488). The DS14C88 simplifies designs by eliminating the need for external slew rate control capacitors. Slew rate control in accordance with EIA-232D is provided on-chip, eliminating the output capacitors. Connection Diagram Figure 1. SOIC or PDIP Package- Top View See Package Number NFF0014A or D0014A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1998–2013, Texas Instruments Incorporated DS14C88 SNLS080C – MAY 1998 – REVISED APRIL 2013 www.ti.com Absolute Maximum Ratings (1) (2) (3) (4) Supply Voltage V+ Pin +13V V− Pin −13V (V+) +0.3V to GND −0.3V Driver Input Voltage |(V+) − VO| ≤ 30V Driver Output Voltage |(V−) − VO| ≤ 30V Continuous Power Dissipation @+25°C (5) NFF0014A Package 1513 mW D0014A Package 1063 mW Junction Temperature +150°C Lead Temperature (Soldering 4 seconds) +260°C −65°C to +150°C Storage Temperature Range (1) (2) (3) (4) (5) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be Ensured. They are not meant to imply that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation. If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. This Product does not meet 2000V ESD rating. ESD Rating (HBM, 1.5 kΩ, 100 pF) ≥ 1.0 kV. Derate NFF0014A Package 12.1 mW/°C, and D0014A Package 8.5 mW/°C above +25°C. Recommended Operating Conditions Min Max Units V Supply (GND = 0V) +4.5 +12.6 V V− Supply (GND = 0V) −4.5 −12.6 V + Operating Free Air Temp. (TA) DS14C88 0 +75 °C Electrical Characteristics Over Recommended Operating Conditions, unless otherwise specified Parameter IIL Maximum Low Input Current Test Conditions Min Typ VIN = GND + Max Units +10 μA IIH Maximum High Input Current VIN = V −10 VIL Low Level Input Voltage V+ ≥ +7V, V− ≤ −7V GND 0.8 V V+ < +7V, V−> −7V GND 0.6 V + VIH High Level Input Voltage VOL Low Level Output Level 2.0 VIN = VIH RL = 3 kΩ or 7 kΩ V V V+ = 4.5V, V− = −4.5V −4.0 −3.0 V V+ = 9V, V− = 9V −8.0 −6.5 V −10.5 −9.0 V + − V = 12V, V = −12V VOH High Level Output Level VIN = VIL RL = 3 kΩ or 7 kΩ V+ = 4.5V, V− = −4.5V 3.0 4.0 V V+ = 9V, V− = −9V 6.5 8.0 V V+ = 12V, V− = −12V 9.0 10.5 V High Level Output Short Circuit Current (1) VIN = 0.8V, VO = GND IOS− Low Level Output Short Circuit Current (1) VIN = 2.0V, VO = GND ROUT Output Resistance V+ = V− = GND = 0V −2V ≤ VO ≤ +2V (2) (Figure 2 ) (2) 2 + − V = +12V, V = −12V IOS+ (1) μA −45 mA +45 mA 300 Ω IOS+ and IOS− values are for one output at a time. If more than one output is shorted simultaneously, the device dissipation may be exceeded. Power supply (V+, V−) and GND pins are connected to ground for the Output Resistance Test (RO). Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS14C88 DS14C88 www.ti.com SNLS080C – MAY 1998 – REVISED APRIL 2013 Electrical Characteristics (continued) Over Recommended Operating Conditions, unless otherwise specified Parameter ICC+ Positive Supply Current Test Conditions Max Units V = 4.5V, V = −4.5V 10 μA V+ = 9V, V− = −9V 30 μA V+ = 12V, V− = −12V 60 μA V+ = 4.5V, V− = −4.5V 50 μA − V = 9V, V = −9V 300 μA V+ = 12V, V− = −12V 500 μA V+ = 4.5V, V− = −4.5V −10 μA − V = 9V, V = −9V −10 μA V+ = 12V, V− = −12V −10 μA V+ = 4.5V, V− = −4.5V −30 μA − V = 9V, V = −9V −30 μA V+ = 12V, V− = −12V −60 μA Typ Max Units V = +4.5V, V = −4.5V 1.5 6.0 μs V+ = +9.0V, V− = −9.0V 1.2 5.0 μs V+ = +12V, V− = −12V 1.2 4.0 μs V = +4.5V, V = −4.5V 1.5 6.0 μs V+ = +9.0V, V− = −9.0V 1.35 5.0 μs V+ = +12V, V− = −12V 1.3 4.0 μs VIN = VILmax RL = OPEN VIN = VIHmin RL = OPEN ICC- Negative Supply Current Min + VIN = VILmax RL = OPEN + VIN = VIHmin RL = OPEN + Typ − + Switching Characteristics (1) (2) Over Recommended Operating Conditions, unless otheriwse specified (Figure 3, Figure 4) Parameter tPLH tPHL Propagation Delay Low to High Propagation Delay High to Low Test Conditions + + − (3) tr Rise Time tf Fall Time (3) tsk Typical Propagation Delay Skew 0.2 1.0 μs 0.2 1.0 μs V+ = +4.5V, V− = −4.5V 250 ns V+ = +9.0V, V− = −9.0V 200 ns 150 ns + − V = +12V, V = −12V SR (1) (2) (3) Output Slew Rate (3) Min − RL = 3 kΩ to 7 kΩ CL = 15 pF to 2500 pF 30 V/μs AC input test waveforms for test purposes: tr = tf ≤ 20 ns, VIH = 2V, VIL = 0.8V (0.6V at V+ = 4.5V, V− = −4.5V) Input rise and rall times must not exceed 5 μs. The output slew rate, rise time, and fall time are measured from the +3.0V to the −3.0V level on the output waveform. Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS14C88 3 DS14C88 SNLS080C – MAY 1998 – REVISED APRIL 2013 www.ti.com Parameter Measure Information Figure 2. Output Resistance Test Circuit (Power-Off) Figure 3. Driver Load Circuit (4) Figure 4. Driver Switching Waveform (4) CL include jig and probe capacitances. TYPICAL APPLICATION INFORMATION Figure 5. EIA-232D Data Transmission 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS14C88 DS14C88 www.ti.com SNLS080C – MAY 1998 – REVISED APRIL 2013 REVISION HISTORY Changes from Revision B (April 2013) to Revision C • Page Changed layout of National Data Sheet to TI format ............................................................................................................ 4 Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated Product Folder Links: DS14C88 5 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) DS14C88M NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 DS14C88M DS14C88M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS14C88M DS14C88MX NRND SOIC D 14 2500 TBD Call TI Call TI 0 to 70 DS14C88M DS14C88MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 DS14C88M DS14C88N NRND PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 DS14C88N DS14C88N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) SN | CU SN Level-1-NA-UNLIM 0 to 70 DS14C88N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DS14C88MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 DS14C88MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) DS14C88MX SOIC D 14 2500 367.0 367.0 35.0 DS14C88MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NFF0014A N0014A N14A (Rev G) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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