05051 SM16LC03 thru SM16LC36C Only One Name Means ProTek’Tion™ LOW CAPACITANCE TVS ARRAY APPLICATIONS ✔ Wireless Communication Circuits ✔ RS-422, RS-432 & RS-485 ✔ Low Voltage ASICs ✔ Ethernet - 10/100 Base T IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns ✔ 61000-4-5 (Surge): 12A, 8/20µs Level 1 (Line-Ground) & Level 2 (Line-Line) SO-16 FEATURES ✔ 500 Watts Peak Pulse Power per Line (tp=8/20µs) ✔ Unidirectional & Bidirectional Configuration ✔ ESD Protection > 40 kilovolts ✔ Available in Multiple Voltage Types: 3.3V to 36V ✔ Protects Up to Eight (8) Lines ✔ LOW CAPACITANCE: 15pF ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ ✔ ✔ ✔ Molded JEDEC SO-16 Package Weight 0.15 grams (Approximate) Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed) Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Pure-Tin - Sn, 100: 260-270°C ✔ Flammability rating UL 94V-0 ✔ 16mm Tape and Reel Per EIA Standard 481 ✔ Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package PIN CONFIGURATIONS 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 UNIDIRECTIONAL CONFIGURATION BIDIRECTIONAL CONFIGURATION 05051.R10 4/05 1 www.protekdevices.com SM16LC03 thru SM16LC36C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified SYMBOL VALUE UNITS Peak Pulse Power (tp = 8/20µs) - See Figure 1 PPP 500 Watts Operating Temperature TJ -55°C to 150°C °C Storage Temperature TSTG -55°C to 150°C °C Forward Voltage @ 50mA, 300µs - Square Wave (Note 1) VF 1.5 Volts Soldering Temperature for 10 seconds TL 265 °C PARAMETER Note 1: Only applies to unidirectional devices. ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Notes 1 & 2) SM16LC03 SM16LC03C SM16LC05 SM16LC05C SM16LC08 SM16LC08C SM16LC12 SM16LC12C SM16LC15 SM16LC15C SM16LC24 SM16LC24C SM16LC36 SM16LC36C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE V WM VOLTS 3.3 3.3 5.0 5.0 8.0 8.0 12.0 12.0 15.0 15.0 24.0 24.0 36.0 36.0 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ 1mA V(BR) VOLTS MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1 A VC VOLTS @ 8/20µs VC @ IPP @VWM ID µA @ 0V, 1 MHz C pF θV(BR) mV/°C 4.5 4.5 6.0 6.0 8.5 8.5 13.3 13.3 16.7 16.7 26.7 26.7 40.0 40.0 7.0 7.0 9.8 9.8 13.4 13.4 19.0 19.0 25.5 25.5 40.0 40.0 53.0 53.0 20.0V @ 35A 20.0V @ 35A 24.0V @ 42A 24.0V @ 42A 26.0V @ 30A 26.0V @ 30A 33.0V @ 21A 33.0V @ 21A 39.0V @ 15A 39.0V @ 15A 57.0V @ 10A 57.0V @ 10A 72.0V @ 7.0A 72.0V @ 7.0A 125 125 20 20 10 10 2 2 2 2 2 2 2 2 15 15 15 15 15 15 15 15 15 15 15 15 15 15 -3 -3 3 3 9 9 16 16 17 17 26 26 36 36 MAXIMUM LEAKAGE CURRENT MAXIMUM TEMPERATURE CAPACITANCE COEFFICIENT OF V(BR) Note 1: Part numbers with a “C” suffix are bidirectional devices, i.e., SM16LC05C. Note 2: Unidirectional Devices Only: Do not surge from pins 16 to 1, 15 to 2, 14 to 3, 13 to 4, 12 to 5, 11 to 6, 10 to 7 and 9 to 8. PIV typically greater than 100V for each rectifier diode. 05051.R10 4/05 2 www.protekdevices.com SM16LC03 thru SM16LC36C GRAPHS FIGURE 1 PEAK PULSE POWER VS PULSE TIME 120 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Power - Watts 10,000 500W 8/20µs Waveform 1,000 100 10 0.1 tf 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 0 10,000 FIGURE 3 POWER DERATING CURVE 5 10 15 t - Time - µs 20 25 30 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR SM16LC05 100 40 Peak Pulse Power 8/20µs 5 Volts per Division 80 % Of Rated Power FIGURE 2 PULSE WAVE FORM 60 40 30 20 10 20 0 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - °C 150 ESD Test Pulse: 25 kilovolt, 1/30ns (waveform) FIGURE 5 INSERTION LOSS - SM16LC12 FIGURE 6 RETURN LOSS - SM16LC12 20 db 10 db per Division 10 db per Division 20 db Ref 0 db -20 db -20 db -50 db -50 db 100 MHz per Division 100 MHz per Division 05051.R10 4/05 Ref 0 db 3 www.protekdevices.com SM16LC03 thru SM16LC36C APPLICATION NOTE The SM16LC & SM16LCxxC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD, EFT and other types of surges. This product series provides both unidiretional and bidirectional protection, with a surge capability of 500 Watts PPP per line for an 8/20µs waveform and ESD protection > 40kV. BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1) Ideal for RS-485 applications, the SM16LCxxC Series provides up to eight (8) lines of protection in a common-mode configuration as depicted in Figure 1. This low capacitance series allows the transceiver or telecommunications circuit to operate safely without significant signal distortion. Circuit connectivity is as follows: ✔ Lines 1 is connected to Pin 9. ✔ Line 2 is connected to Pin 10. ✔ Line 3 is connected to Pin 11. ✔ Line 4 is connected to Pin 12. ✔ Line 5 is connected to Pin 13. ✔ Line 6 is connected to Pin 14. ✔ Line 7 is connected to Pin 15. ✔ Line 8 is connected to Pin 16. ✔ Pins 1-8 are connected to ground. Figure 1. Birectional Common-Mode Protection TRANSCEIVER D LINE 1 LINE 2 LINE 3 D LINE 4 CIRCUIT BOARD LAYOUT RECOMMENDATIONS LINE 5 Circuit board layout is critical for Electromagnetic Compatibility (EMC) protection. The following guidelines are recommended: R LINE 6 LINE 7 ✔ The protection device should be placed near the input terminals or connectors, the device will divert the transient current immediately before it can be coupled into the nearby traces. ✔ The path length between the TVS device and the protected line should be minimized. ✔ All conductive loops including power and ground loops should be minimized. ✔ The transient current return path to ground should be kept as short as possible to reduce parasitic inductance. ✔ Ground planes should be used whenever possible. For multilayer PCBs, use ground vias. 05051.R10 4/05 R 4 LINE 8 16 15 14 13 12 11 10 9 1 2 3 4 5 6 7 8 www.protekdevices.com SM16LC03 thru SM16LC36C PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE SO-16 -A- 9 16 -B- P 1 0.010” (0.25 MM) M B M 8 PL 8 PACKAGE DIMENSIONS DIM G R X 45º C 0º - 7º -TK 16 PL 0.010” (0.25 MM) M F D M T B S A S 9.80 3.80 1.35 0.35 0.40 1.27 BSC 0.19 0.10 5.80 0.25 INCHES MIN MAX 0.393 10.00 0.386 4.00 0.150 0.157 0.068 1.75 0.054 0.49 0.014 0.019 1.25 0.016 0.049 1.27 BSC 0.05 BSC 0.05 BSC 0.25 0.008 0.009 0.009 0.25 0.004 6.20 0.229 0.244 0.50 0.010 0.019 NOTES MOUNTING PAD 0.050” TYP 0.030” ± 0.005” 0.160” ± 0.005” J A B C D F G J K P R MILLIMETERS MIN MAX 1. - T - = Seating Plane and Datum Surface. 2. Dimensions “A” and “B” are Datum. 3. Dimensions “A” and “B” do not include mold protrusions. 4. Maximum mold protrusion is 0.015” (0.380 mm) per side. 5. Dimensioning and tolerances per ANSI Y14.5M, 1982. 6. Dimensions are exclusive of mold flash and metal burrs. TAPE & REEL/BULK ORDERING NOMENCLATURE 0.245” MIN 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape, i.e., SM16LC05-T7. 3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape, i.e., SM16LC05-T13. 4. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., SM16LC05C-LF-T7. 5. No Suffix = Product Shipped in Tubes of 48 pcs per Tube. 0.045” ± 0.005” Outline & Dimensions: Rev 1 - 11/01, 06007 COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05051.R10 4/05 5 www.protekdevices.com