05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ unbumped low capacitance flip chip tvs array Description The ULLC0408FC05C Flip Chip employs advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. This low capacitance device is ideally suited for handheld devices, PCMCIA and SMART cards. The ULLC0408FC05C provides ESD protection greater than 25 kilovolts and features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. The low inductance virtually eliminates overshoot voltage due to package inductance. Features applications • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Low ESD Overshoot Voltage • Bidirectional Configuration & Monolithic Structure • Protects 4 Isolated Lines • Low Capacitance: 6pF • Low Leakage Current • RoHS Compliant • REACH Compliant • Cellular Phones • Portable Electronics • SMART Cards Mechanical characteristics • Standard EIA Chip Size: 0408 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Solder Reflow Temperature: • Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C • Flammability Rating UL 94V-0 • 8mm Tape per EIA Standard 481 PIN CONFIGURATION 05221.R2 3/11 Page 1 www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ typical device characteristics MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature SYMBOL VALUE UNITS TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Note 1) ULLC0408FC05C RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE V WM VOLTS @ 1mA V(BR) VOLTS @VWM ID µA @0V, 1MHz C pF 5.0 6.0 5.0 6 notes 1. Device is bidirectional. 05221.R2 3/11 Page 2 www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ typical device characteristics figure 1 overshoot & clamping voltage 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) figure 2 capacitance vs reverse voltage Cj - Capactiance - pF 8 4 0 0 05221.R2 3/11 2 4 VR - Reverse Voltage - Volts Page 3 6 www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION printed circuit board recommendations parameter value Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity (Only applies to bumped devices) ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C Requirements recommended non-solder mask defined pad illustration Temperature: TP for Lead-Free (Sn/Ag/Cu): 260-270°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area and plating. Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. Maximum Solder Reflow (35-53°C Above Maximum Solder Melt Temp) TP Solder Melt (Maximum Temp) Temperature - °C Ramp-Up Ramp-Down Preheat (Stay Below Flux Activation Temp) 30-60 seconds 05221.R2 3/11 Ramp-Up 15 seconds (Minimize) Page 4 Solder-Time 15-20 seconds Ramp-Down www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ U0408 package information outline dimensions dim millimeters min max inches min max A 0.56 0.022 B 0.86 0.034 C 0.98 E F 1.02 0.038 2.03 0.078 0.15 SQ 1.97 I 0.040 0.006 SQ 0.406 0.080 0.016 Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). TOP A B C SIDE E F Metalized Die Contacts I END 05221.R2 3/11 Page 5 www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ U0408 package information Option 1 - layout dimensions millimeters inches nominal nominal A 0.51 0.020 C 0.30 0.012 D 0.46 0.018 E 0.20 0.008 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 dim DIE CONTACTS E H G I F millimeters inches nominal nominal A 0.51 0.020 F 0.15 SQ 0.006 SQ G 0.71 0.028 H 0.99 0.039 I 0.51 0.020 SOLDER MASK COPPER CONTACT 0.009”[0.23] DIA. Option 2 - layout dimensions dim SOLDER PADS SOLDER PRINT 0.010” - 0.012” DIA. Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. D A C A DIE CONTACTS H G I Notes 1. Controlling dimensions in inches. 2. Decimal tolerance: .xxx ± 0.05mm (0.002”). 3. Preferred: Usign 0.1mm (0.004”) stencil. 05221.R2 3/11 F SOLDER PRINT 0.014” [0.36] DIA. Page 6 SOLDER MASK www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ TAPE AND REEL information D t P2 Top Cover Tape 10 Pitches Cumulative Tolerance on tape ± 0.2 E P0 A0 F K0 W B0 P User Direction of Feed specifications Reel Dia. Tape Width 178(7”) 8 A0 B0 K0 D E F P0 P2 P tmax 0.80 ± 0.10 1.20 ± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ± 0.20 4.00 ± 0.12 2.00 ± 0.05 2.00 ± 0.10 Notes 1. 2. 3. 4. 5. 6. W 0.25 tape & reel orientation Dimensions in millimeters. Top view of tape. Metal contacts are face down in tape package. Orientation: preferred stencil - 0.1mm (0.004”). Surface mount product is taped and reeled in accordance with EIA 481. 8mm plastic tape: 7” Reels - 5,000 Marking on reel: Part Number, Date Code and Lot Number. Quad Die - 0408 Package outline, pad layout and tape specifications per document number 06026.R4 9/09. ORDERING INFORMATION base PART NUMBER LEADFREE SUFFIX TAPE SUFFIX QTY/REEL REEL SIZE TUBE qty ULLC0408FC05C n/a -T75-1 5,000 7” n/a 05221.R2 3/11 Page 7 www.protekdevices.com 05221 ULLC0408FC05C Only One Name Means ProTek’Tion™ company information COMPANY PROFILE ProTek Devices, based in Tempe, Arizona USA, is a manufacturer of Transient Voltage Suppression (TVS) products designed specifically for the protection of electronic systems from the effects of lightning, Electrostatic Discharge (ESD), Nuclear Electromagnetic Pulse (NEMP), inductive switching and EMI/RFI. With over 25 years of engineering and manufacturing experience, ProTek designs TVS devices that provide application specific protection solutions for all electronic equipment/systems. ProTek Devices Analog Products Division, also manufactures analog interface, control, RF and power management products. CONTACT US Corporate Headquarters 2929 South Fair Lane Tempe, Arizona 85282 USA By Telephone General: 602-431-8101 Sales: 602-414-5109 Customer Service: 602-414-5114 By Fax General: 602-431-2288 By E-mail: Sales: [email protected] Customer Service: [email protected] Technical Support: [email protected] Web www.protekdevices.com www.protekanalog.com COPYRIGHT © ProTek Devices 2007 - This literature is subject to all applicable copyright laws and is not for resale in any manner. SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice. DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance. ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ProTek assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability without limitation special, consequential or incidental damages. LIFE SUPPORT POLICY: ProTek Devices products are not authorized for use in life support systems without written consent from the factory. PATENT INFORMATION: This device is patented under U.S. Patent No. Des. “D456,367S”. 05221.R2 3/11 Page 8 www.protekdevices.com