SEME-LAB 1N4109D2B

Diode Leadless Chip Carrier - DLCC
Features
The DLCC family of Ceramic Leadless Chip
Carrier packages for Diodes is designed for
all high reliability applications – Space,
Aerospace, High temperature and Military.
Detailed information
The DLCC package design takes full advantage of the proven
high reliability pedigree of the High Temperature Cofired
Ceramic (HTCC) surface mount packaging technology, which
is easily integrated for automated assembly. Semelab has
taken the existing standards for ceramic surface mount
package manufacture and added additional design features
to enhance thermal performance, to present a competitive
alternative for high reliability applications.
The DLCC has been designed and tooled to be able to
meet small, medium and high volume demand allowing
customers to access the technology and grow the
requirements with their product, utilising scalable assembly
techniques to offer high rel diodes, at competitive pricing
structures. This includes full pre cap access for inspection of
semiconductor prior to hermetic encapsulation.
Semelab has more than 35 years of history in the
manufacture of semiconductor devices for high reliability
applications with tier one suppliers of Worldwide Space,
Military and Aerospace equipment. Our diverse product
range, focused customer response coupled with flexible
batch size processing and screening in accordance with the
most recognised reliability standards offers an attractive and
cost effective solution for new and existing designs.
Experience and Innovation in Semiconductor Solutions
Specialists In
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Ceramic surface mount products
Hermetic metal packaged devices
Hermetic power modules
Standard and custom products
Screening and qualifications
Continued supply of earlier device types and packages
Semelab holds approvals for many aerospace semiconductor
devices, and can manufacture in accordance with CECC,
JANTX, ESAlevel 5000 and other major process flows.
Please let us know your requirements - we can almost
certainly meet them.
Diode Leadless Chip Carrier - DLCC
Your Semelab Distributor:
The DLCC family of Ceramic Leadless Chip Carrier packages
The physical dimensions for the DLCC ceramic packages are
designed to fully utilise the recommended solder footprint
for the popular MELF packages, and as such present a drop
in replacement for existing board design. Thermal vias
improve the heat transfer to the solder pads reducing the
diode junction temperature and increasing operating
lifetime; options are also available to allow the lid to be
connected to the Anode or Cathode. Connecting the metal
lid to a known electrical potential stops deep dielectric
discharge in space applications; see the Space Weather link
www.semelab.co.uk/mil/DLCC on the Semelab web site.
ISO 9001
FM36235
M/0103/CECC/UK
Semelab Limited
Coventry Road,
Lutterworth,
Leicestershire. LE17 4JB
UK
BS 9000
1360/M
DSCC
Qualified
Manufacturers
List
Defence
Supply
Center
Columbus
European
Space Agency
MOD
Registration
VQC-03-003050
VQC-03-003049
Cage
Code U3158
Qualification 253
2M8S02
Members of the
Component
Obsolescence
Group
Tel: +44 (0) 1455 556565
Fax: +44 (0) 1455 552612
Email: [email protected]
Web: www.semelab-tt.com
A subsidiary of TT electronics plc.
Designed & produced by Triad. www.triad.uk.com
Issue No. A-10
Histogram of Thermal Impedance and probability Plots.
3000 Hours Life Testing
DLCC Advantages
T#3 VF(V)
T#2 VF(V)
0.795
0.665
0.66
0.79
VF@100mA
TES DC AMB 251109:
POST3000HRS-BF50-13-01-10
TES ET1 AMB 080709:
0.65
TES ET1 AMB 080709:
0.78
ET1-09-07-09-BF50
TES ET2 AMB 210809:
0.635
2
4
6
8
10
12
14
0
2
4
6
Device No.
Gage R&R
1N4109D2B
1N6642D2B
High temperature
1N4148D2A
1N750AD1A
•
Military
1N4148D2B
SML05SC06D3A
1N4574AD2A
SML05SC06D3B
Vertical End Markets:
1N4574AD2B
SML05SC12D3A
•
Commerical,
1N4620D2A
SML05SC12D3B
•
Medical
1N4620D2B
•
Military
1N5550D3A
•
•
8
10
12
14
•
T#5 IR(A)
1.80E-07
0.88
1.60E-07
0.875
[email protected]
POST2000HRS-BF50-25-11- 09
TES DC AMB 130110:
TES DC AMB 130110:
TES ET1 AMB 080709:
Measurements of Delta VF are capable with <10% Total Gage
R&R contribution.
1.20E-07
POST2000HRS-BF50-25-11- 09
POST3000HRS-BF50-13-01-10
ET1-09-07-09-BF50
TES ET2 AMB 210809:
•
TES DC AMB 251109:
1.00E-07
IR(A)
VF(V)
0.865
IR@150V
1.40E-07
TES DC AMB 251109:
0.87
0.86
•
POST3000HRS-BF50-13-01-10
8.00E-08
TES ET1 AMB 080709:
ET1-09-07-09-BF50
6.00E-08
TES ET2 AMB 210809:
•
Fully hermetic, ceramic diode
leadless chip carrier
Replacement for MELF-style
standard product with
enhanced features
Fits on existing PCB layouts
Castellated design to ensure
solder meniscus between
board and component is visible
Thermal performance within MIL
standards, for the challenging
surface mount PCB environment
Thermal vias incorporated in
design to enhance thermal
performance
Rectangular design to aid in
PCB assembly
Designed to be a more cost
effective solution
Manufactured in accordance with
MIL-19500 and ESA specifications
1N5550D3B
1N5806D2A
Keywords:
1N5806D2B
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DLCC
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Diode Leadless Chip Carrier
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LCC
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Leadless Chip Carrier
1N5811D3A
1N5811D3B
1N5819D2A
1N5819D2B
1N6328D2A
1N6328D2B
4.00E-08
0.855
2.00E-08
0.00E+00
0.85
Gage R & R study for Delta VF
8
6
4
2
0
10
12
0
14
T#6 VR@100
2
4
6
8
10
12
14
A (V)
400
350
VR@100μA
300
TES DC AMB 251109:
250
Delta VF Test Conditions
POST2000HRS-BF50-25-11- 09
VR(V)
TES DC AMB 130110:
200
POST3000HRS-BF50-13-01-10
TES ET1 AMB 080709:
150
ET1-09-07-09-BF50
TES ET2 AMB 210809:
100
50
0
0
2
4
8
6
Datasheets and Shortform Information
Device No.
Device No.
10
12
14
Device No.
3000 hours
Mean Time Between Failures Figure:
MTBF= 55049869 hours
The DLCC2 part was designed as a direct replacement for
the D-5A which is an industry standard MELF (Metal
Ended Leadless Face). The image below shows the outline
to be comparable:
FIG 12. Thermal Impedance and Resistance Results for
Sample devices.
Aerospace
•
Device No.
T#4 VF(V)
No Significant variation in either K factor or VH
Zth/Delta VF test conditions:IM
2mA
IH
9A
tH
10mS
tMD + tSW 10_S
•
•
•
0.77
0
VarComp
0.8975
0.8916
0.0058
0.0058
69.8376
70.7350
1N6642D2A
0.775
0.64
Source
Total Gage R&R
Repeatability
Reproducibility
Operators
Part-To-Part
Total Variation
1N4109D2A
POST3000HRS-BF50-13-01-10
ET2-21-08-09-BF50
%Contribution
(of VarComp)
1.27
1.26
0.01
0.01
98.73
100.00
Space
TES DC AMB 130110:
ET1-09-07-09-BF50
TES ET2 AMB 210809:
0.645
Part numbers:
•
POST2000HRS-BF50-25-11- 09
0.785
VF(V)
VF(V)
POST2000HRS-BF50-25-11-09
TES DC AMB 130110:
Applications:
•
[email protected]
TES DC AMB 251109:
0.655
Features and benefits:
Part No.
Type
Wattage
Voltage
Current
Package
1N4109D2A
1N4109D2B
1N4148D2A
1N4148D2B
1N4574AD2A
1N4574AD2B
1N4620D2A
1N4620D2B
1N5550D3A
1N5550D3B
1N5806D2A
1N5806D2B
1N5811D3A
1N5811D3B
1N5819D2A
1N5819D2B
1N6328D2A
1N6328D2B
1N6642D2A
1N6642D2B
1N750AD1A
SML05SC06D3A
SML05SC06D3B
SML05SC12D3A
SML05SC12D3B
Reference
Reference
Signal
Signal
Temperature Compensated Zener Diode
Temperature Compensated Zerer Diode
Reference
Reference
Power Rectifier Diode
Power Rectifier Diode
Ultra Fast Rectifier
Ultra Fast Rectifier
Ultra Fast Rectifier
Ultra Fast Rectifier
Schottky Rectifier
Schottky Rectifier
Reference
Reference
Switching Diode
Switching Diode
Reference
Ultra Fast Recovery Power Rectifier
Ultra Fast Recovery Power Rectifier
Silicon Carbide Schottky Rectifier
Silicon Carbide Schottky Rectifier
0.5W
0.5W
0.5W
0.5W
0.385W
0.385W
0.5W
-
15V
15V
75V
75V
6.4V
6.4V
3.3V
3.3V
200V
200V
150V
150V
150V
150V
40V
40V
15V
15V
100V
100V
4.7V
600V
600V
1200V
1200V
250nA
250nA
200mA
200mA
1mA
1mA
250μA
250μA
5A
5A
1A
1A
3A
3A
1A
1A
8.5mA
8.5mA
300mA
300mA
20mA
5A
5A
5A
5A
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC3
DLCC3
DLCC2
DLCC2
DLCC3
DLCC3
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC2
DLCC1
DLCC3
DLCC3
DLCC3
DLCC3