Diode Leadless Chip Carrier - DLCC Features The DLCC family of Ceramic Leadless Chip Carrier packages for Diodes is designed for all high reliability applications – Space, Aerospace, High temperature and Military. Detailed information The DLCC package design takes full advantage of the proven high reliability pedigree of the High Temperature Cofired Ceramic (HTCC) surface mount packaging technology, which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications. The DLCC has been designed and tooled to be able to meet small, medium and high volume demand allowing customers to access the technology and grow the requirements with their product, utilising scalable assembly techniques to offer high rel diodes, at competitive pricing structures. This includes full pre cap access for inspection of semiconductor prior to hermetic encapsulation. Semelab has more than 35 years of history in the manufacture of semiconductor devices for high reliability applications with tier one suppliers of Worldwide Space, Military and Aerospace equipment. Our diverse product range, focused customer response coupled with flexible batch size processing and screening in accordance with the most recognised reliability standards offers an attractive and cost effective solution for new and existing designs. Experience and Innovation in Semiconductor Solutions Specialists In • • • • • • Ceramic surface mount products Hermetic metal packaged devices Hermetic power modules Standard and custom products Screening and qualifications Continued supply of earlier device types and packages Semelab holds approvals for many aerospace semiconductor devices, and can manufacture in accordance with CECC, JANTX, ESAlevel 5000 and other major process flows. Please let us know your requirements - we can almost certainly meet them. Diode Leadless Chip Carrier - DLCC Your Semelab Distributor: The DLCC family of Ceramic Leadless Chip Carrier packages The physical dimensions for the DLCC ceramic packages are designed to fully utilise the recommended solder footprint for the popular MELF packages, and as such present a drop in replacement for existing board design. Thermal vias improve the heat transfer to the solder pads reducing the diode junction temperature and increasing operating lifetime; options are also available to allow the lid to be connected to the Anode or Cathode. Connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the Space Weather link www.semelab.co.uk/mil/DLCC on the Semelab web site. ISO 9001 FM36235 M/0103/CECC/UK Semelab Limited Coventry Road, Lutterworth, Leicestershire. LE17 4JB UK BS 9000 1360/M DSCC Qualified Manufacturers List Defence Supply Center Columbus European Space Agency MOD Registration VQC-03-003050 VQC-03-003049 Cage Code U3158 Qualification 253 2M8S02 Members of the Component Obsolescence Group Tel: +44 (0) 1455 556565 Fax: +44 (0) 1455 552612 Email: [email protected] Web: www.semelab-tt.com A subsidiary of TT electronics plc. Designed & produced by Triad. www.triad.uk.com Issue No. A-10 Histogram of Thermal Impedance and probability Plots. 3000 Hours Life Testing DLCC Advantages T#3 VF(V) T#2 VF(V) 0.795 0.665 0.66 0.79 VF@100mA TES DC AMB 251109: POST3000HRS-BF50-13-01-10 TES ET1 AMB 080709: 0.65 TES ET1 AMB 080709: 0.78 ET1-09-07-09-BF50 TES ET2 AMB 210809: 0.635 2 4 6 8 10 12 14 0 2 4 6 Device No. Gage R&R 1N4109D2B 1N6642D2B High temperature 1N4148D2A 1N750AD1A • Military 1N4148D2B SML05SC06D3A 1N4574AD2A SML05SC06D3B Vertical End Markets: 1N4574AD2B SML05SC12D3A • Commerical, 1N4620D2A SML05SC12D3B • Medical 1N4620D2B • Military 1N5550D3A • • 8 10 12 14 • T#5 IR(A) 1.80E-07 0.88 1.60E-07 0.875 [email protected] POST2000HRS-BF50-25-11- 09 TES DC AMB 130110: TES DC AMB 130110: TES ET1 AMB 080709: Measurements of Delta VF are capable with <10% Total Gage R&R contribution. 1.20E-07 POST2000HRS-BF50-25-11- 09 POST3000HRS-BF50-13-01-10 ET1-09-07-09-BF50 TES ET2 AMB 210809: • TES DC AMB 251109: 1.00E-07 IR(A) VF(V) 0.865 IR@150V 1.40E-07 TES DC AMB 251109: 0.87 0.86 • POST3000HRS-BF50-13-01-10 8.00E-08 TES ET1 AMB 080709: ET1-09-07-09-BF50 6.00E-08 TES ET2 AMB 210809: • Fully hermetic, ceramic diode leadless chip carrier Replacement for MELF-style standard product with enhanced features Fits on existing PCB layouts Castellated design to ensure solder meniscus between board and component is visible Thermal performance within MIL standards, for the challenging surface mount PCB environment Thermal vias incorporated in design to enhance thermal performance Rectangular design to aid in PCB assembly Designed to be a more cost effective solution Manufactured in accordance with MIL-19500 and ESA specifications 1N5550D3B 1N5806D2A Keywords: 1N5806D2B • DLCC • Diode Leadless Chip Carrier • LCC • Leadless Chip Carrier 1N5811D3A 1N5811D3B 1N5819D2A 1N5819D2B 1N6328D2A 1N6328D2B 4.00E-08 0.855 2.00E-08 0.00E+00 0.85 Gage R & R study for Delta VF 8 6 4 2 0 10 12 0 14 T#6 VR@100 2 4 6 8 10 12 14 A (V) 400 350 VR@100μA 300 TES DC AMB 251109: 250 Delta VF Test Conditions POST2000HRS-BF50-25-11- 09 VR(V) TES DC AMB 130110: 200 POST3000HRS-BF50-13-01-10 TES ET1 AMB 080709: 150 ET1-09-07-09-BF50 TES ET2 AMB 210809: 100 50 0 0 2 4 8 6 Datasheets and Shortform Information Device No. Device No. 10 12 14 Device No. 3000 hours Mean Time Between Failures Figure: MTBF= 55049869 hours The DLCC2 part was designed as a direct replacement for the D-5A which is an industry standard MELF (Metal Ended Leadless Face). The image below shows the outline to be comparable: FIG 12. Thermal Impedance and Resistance Results for Sample devices. Aerospace • Device No. T#4 VF(V) No Significant variation in either K factor or VH Zth/Delta VF test conditions:IM 2mA IH 9A tH 10mS tMD + tSW 10_S • • • 0.77 0 VarComp 0.8975 0.8916 0.0058 0.0058 69.8376 70.7350 1N6642D2A 0.775 0.64 Source Total Gage R&R Repeatability Reproducibility Operators Part-To-Part Total Variation 1N4109D2A POST3000HRS-BF50-13-01-10 ET2-21-08-09-BF50 %Contribution (of VarComp) 1.27 1.26 0.01 0.01 98.73 100.00 Space TES DC AMB 130110: ET1-09-07-09-BF50 TES ET2 AMB 210809: 0.645 Part numbers: • POST2000HRS-BF50-25-11- 09 0.785 VF(V) VF(V) POST2000HRS-BF50-25-11-09 TES DC AMB 130110: Applications: • [email protected] TES DC AMB 251109: 0.655 Features and benefits: Part No. Type Wattage Voltage Current Package 1N4109D2A 1N4109D2B 1N4148D2A 1N4148D2B 1N4574AD2A 1N4574AD2B 1N4620D2A 1N4620D2B 1N5550D3A 1N5550D3B 1N5806D2A 1N5806D2B 1N5811D3A 1N5811D3B 1N5819D2A 1N5819D2B 1N6328D2A 1N6328D2B 1N6642D2A 1N6642D2B 1N750AD1A SML05SC06D3A SML05SC06D3B SML05SC12D3A SML05SC12D3B Reference Reference Signal Signal Temperature Compensated Zener Diode Temperature Compensated Zerer Diode Reference Reference Power Rectifier Diode Power Rectifier Diode Ultra Fast Rectifier Ultra Fast Rectifier Ultra Fast Rectifier Ultra Fast Rectifier Schottky Rectifier Schottky Rectifier Reference Reference Switching Diode Switching Diode Reference Ultra Fast Recovery Power Rectifier Ultra Fast Recovery Power Rectifier Silicon Carbide Schottky Rectifier Silicon Carbide Schottky Rectifier 0.5W 0.5W 0.5W 0.5W 0.385W 0.385W 0.5W - 15V 15V 75V 75V 6.4V 6.4V 3.3V 3.3V 200V 200V 150V 150V 150V 150V 40V 40V 15V 15V 100V 100V 4.7V 600V 600V 1200V 1200V 250nA 250nA 200mA 200mA 1mA 1mA 250μA 250μA 5A 5A 1A 1A 3A 3A 1A 1A 8.5mA 8.5mA 300mA 300mA 20mA 5A 5A 5A 5A DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC3 DLCC3 DLCC2 DLCC2 DLCC3 DLCC3 DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC2 DLCC1 DLCC3 DLCC3 DLCC3 DLCC3