SEME-LAB SML10SIC03NC

SML10SIC03NC
SMD1 (TO-276AB) PACKAGE
SiC SCHOTTKY DIODE
VR 300V
IF 2x10A
Semelab’s Silicon Carbide (SiC) Schottky
diodes exhibit low forward voltage, zero
reverse recovery, and superb hightemperature performance.
The devices employ Semelab’s proven
hermetic packaging technology and are
suitable
for
high-frequency
hardswitching applications, where system
efficiency and reliability are paramount.
1
2
3
ABSOLUTE MAXIMUM RATINGS at TJ = 25°C unless otherwise stated (per leg)
Symbol
VR
VRRM
VRSM
IF
IFRM
IFSM
PD
TJ, Tstg
Parameter
DC Reverse Voltage
Repetitive Peak Reverse Voltage
Surge Peak Reverse Voltage
DC Forward Current TC = 100°C
Repetitive Peak Forward Current TJ = 150°C, TC = 100°C, D = 0.1
Surge Peak Forward Current TC = 25°C, tp = 10 s
Power Dissipation TC = 25°C
Operating Junction and Storage Temperature
Rating
300
300
300
10
45
100
70W
-55 to +175
Units
V
V
V
A
A
A
W
°C
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by
Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or
omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected] Website: http://www.semelab.co.uk
Document Number 6010
Issue 1
SML10SIC03NC
ELECTRICAL CHARACTERISTICS at TJ = 25°C unless otherwise stated (per leg)
Symbol
Parameter
Test Conditions
Static Characteristics
VF
Forward Voltage
IR
Reverse Current
Dynamic Characteristics
Qc
trr
C
Total Capacitive Charge
Reverse Recovery Time
Total Capacitance
Min
Typ
Max
Units
IF = 10A
IF = 10A, TJ = 150°C
VR = 300V
VR = 300V, TJ = 150°C
1.5
1.5
15
20
1.7
1.9
200
1000
V
V
µA
µA
VR = 200V, IF = 10A,
di/dt = 200A/µs, TJ = 150°C
VR = 0V, f = 1MHz
VR = 150V, f = 1MHz
VR = 300V, f = 1MHz
23
n.a.
600
55
40
nC
ns
pF
pF
pF
THERMAL CHARACTERISTICS (per leg)
Symbol
Rth
Parameter
Thermal Resistance,
Junction to Case
Test Conditions
TO276AB Package
Min
Typ
2.1
Max
Units
°C/W
PACKAGE DIMENSIONS mm (in)
1
3 .6 0 (0 .1 4 2 )
M a x .
3
1 6 .0 2 (0 .6 3 1 )
1 5 .7 3 (0 .6 1 9 )
1 0 .6 9 (0 .4 2 1 )
1 0 .3 9 (0 .4 0 9 )
0 .7 6
(0 .0 3 0 )
m in .
4 .1 4 (0 .1 6 3 )
3 .8 4 (0 .1 5 1 )
0 .8 9
(0 .0 3 5 )
m in .
3 .7 0 (0 .1 4 6 )
3 .7 0 (0 .1 4 6 )
3 .4 1 (0 .1 3 4 )
3 .4 1 (0 .1 3 4 )
2
9 .6
9 .3
1 1 .5
1 1 .2
7 (
8 (
8 (
8 (
0 .3
0 .3
0 .4
0 .4
8 1
6 9
5 6
4 4
)
)
)
)
0 .5 0 (0 .0 2 0 )
0 .2 6 (0 .0 1 0 )
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by
Semelab is believed to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or
omissions discovered in its use. Semelab encourages customers to verify that datasheets are current before placing orders.
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: [email protected] Website: http://www.semelab.co.uk
Document Number 6010
Issue 1