LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 LM61 2.7V, SOT-23 or TO-92 Temperature Sensor Check for Samples: LM61 FEATURES DESCRIPTION • • • • The LM61 is a precision integrated-circuit temperature sensor that can sense a −30°C to +100°C temperature range while operating from a single +2.7V supply. The LM61's output voltage is linearly proportional to Celsius (Centigrade) temperature (+10 mV/°C) and has a DC offset of +600 mV. The offset allows reading negative temperatures without the need for a negative supply. The nominal output voltage of the LM61 ranges from +300 mV to +1600 mV for a −30°C to +100°C temperature range. The LM61 is calibrated to provide accuracies of ±2.0°C at room temperature and ±3°C over the full −25°C to +85°C temperature range. 1 2 Calibrated Linear Scale Factor of +10 mV/°C Rated for Full −30° to +100°C Range Suitable for Remote Applications UL Recognized Component APPLICATIONS • • • • • • • • • Cellular Phones Computers Power Supply Modules Battery Management FAX Machines Printers HVAC Disk Drives Appliances The LM61's linear output, +600 mV offset, and factory calibration simplify external circuitry required in a single supply environment where reading negative temperatures is required. Because the LM61's quiescent current is less than 125 μA, self-heating is limited to a very low 0.2°C in still air. Shutdown capability for the LM61 is intrinsic because its inherent low power consumption allows it to be powered directly from the output of many logic gates. Table 1. Key Specifications VALUE UNIT ±2.0 or ±3.0 °C (max) Accuracy for −30°C to +100°C ±4.0 °C (max) Accuracy for −25°C to +85°C ±3.0 °C (max) Temperature Slope +10 mV/°C Accuracy at 25°C Power Supply Voltage Range +2.7 to +10 V Current Drain @ 25°C 125 µA (max) Nonlinearity ±0.8 °C (max) Output Impedance 800 Ω (max) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM61 SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 www.ti.com TYPICAL APPLICATION A. VO = (+10 mV/°C × T °C) + 600 mV Figure 1. Full-Range Centigrade Temperature Sensor (−30°C to +100°C) Operating from a Single Li-Ion Battery Cell Table 2. Temperature and Typical VO Values of Figure 1 TEMPERATURE (T) TYPICAL VO +100°C +1600 mV +85°C +1450 mV +25°C +850 mV 0°C +600 mV −25°C +350 mV −30°C +300 mV CONNECTION DIAGRAMS Figure 2. SOT-23 (Top View) See Package Number DBZ0003A Figure 3. TO-92 (Bottom View) See Package Number LP0003A These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 Absolute Maximum Ratings (1) Supply Voltage +12V to −0.2V Output Voltage (+VS + 0.6V) to −0.6V Output Current 10 mA Input Current at any pin (2) 5 mA −65°C to +150°C Storage Temperature Maximum Junction Temperature (TJMAX) +125°C ESD Susceptibility (3) Human Body Model 2500V Machine Model (1) (2) (3) 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics . The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > +VS), the current at that pin should be limited to 5 mA. The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. Operating Ratings (1) TMIN ≤ TA ≤ TMAX Specified Temperature Range: LM61C −30°C ≤ TA ≤ +100°C LM61B −25°C ≤ TA ≤ +85°C Supply Voltage Range (+VS) +2.7V to +10V Thermal Resistance, θJA (2) SOT-23 TO-92 450°C/W 180°C/W Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. (3) (1) (2) (3) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics . The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The junction to ambient thermal resistance (θJA) is specified without a heat sink in still air. Reflow temperature profiles are different for lead-free and non-lead-free packages. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 3 LM61 SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 www.ti.com Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = +3.0 VDC. Boldface limits apply for TA = TJ = TMIN to TMAX ; all other limits TA = TJ = 25°C. PARAMETER Accuracy TEST CONDITIONS TYPICAL (1) (3) Output Voltage at 0°C Nonlinearity Sensor Gain (Average Slope) Line Regulation (5) +10 Change of Quiescent Current Long Term Stability (1) (2) (3) (4) (5) (6) 4 ±2.0 ±3.0 °C (max) ±3.0 ±4.0 °C (max) ±0.6 ±0.8 °C (max) mV +9.7 +9.6 mV/°C (min) +10.4 mV/°C (max) +3.0V ≤ +VS ≤ +10V −30°C ≤ TA ≤ +85°C, +VS= +2.7V +85°C ≤ TA ≤ +100°C, +VS= +2.7V 0.8 2.3 5 0.8 2.3 5 kΩ (max) kΩ (max) kΩ (max) +3.0V ≤ +VS ≤ +10V ±0.7 ±0.7 mV/V (max) +2.7V ≤ +VS ≤ +3.3V ±5.7 ±5.7 mV (max) 125 125 µA (max) 155 155 µA (max) 82 +2.7V ≤ +VS ≤ +10V Temperature Coefficient of Quiescent Current (6) UNITS (LIMIT) +10.3 +2.7V ≤ +VS ≤ +10V Quiescent Current LM61C LIMITS (2) +600 (4) Output Impedance LM61B LIMITS (2) TJ=TMAX=+100°C, for 1000 hours ±5 μA 0.2 µA/°C ±0.2 °C Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and +10 mV/°C times the device's case temperature plus 600 mV, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. The majority of the drift will occur in the first 1000 hours at elevated temperatures. The drift after 1000 hours will not continue at the first 1000 hour rate. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 Typical Performance Characteristics The LM61 in the SOT-23 package mounted to a printed circuit board as shown in Figure 14 was used to generate the following thermal curves. Thermal Resistance Junction to Air Thermal Time Constant Figure 4. Figure 5. Thermal Response in Still Air with Heat Sink Thermal Response in Stirred Oil Bath with Heat Sink Figure 6. Figure 7. Thermal Response in Still Air without a Heat Sink Quiescent Current vs. Temperature Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 5 LM61 SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 www.ti.com Typical Performance Characteristics (continued) The LM61 in the SOT-23 package mounted to a printed circuit board as shown in Figure 14 was used to generate the following thermal curves. Accuracy vs Temperature Noise Voltage Figure 10. Figure 11. Supply Voltage vs Supply Current Start-Up Response Figure 12. Figure 13. A. ½″ Square Printed Circuit Board with 2 oz. Copper Foil or Similar. Figure 14. Printed Circuit Board Used for Heat Sink to Generate All Curves 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 APPLICATION INFORMATION Mounting The LM61 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM61 is sensing will be within about +0.2°C of the surface temperature that LM61's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM61 die is directly attached to the GND pin. The lands and traces to the LM61 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. Alternatively, the LM61 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM61 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM61 or its connections. The thermal resistance junction to ambient (θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM61, Equation 1 is used to calculate the rise in the die temperature. TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL] where • • IQ is the quiescent current ILis the load current on the output (1) Since the LM61's junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM61 is required to drive. Table 3 summarizes the rise in die temperature of the LM61 without any loading with a 3.3V supply, and the thermal resistance for different conditions. Table 3. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance (θJA) Still air SOT-23 (1) SOT-23 (2) NO HEAT SINK SMALL HEAT FIN TO-92 (3) NO HEAT SINK SMALL HEAT FIN θJA (°C/W) TJ − TA (°C) θJA (°C/W) TJ − TA (°C) θJA (°C/W) TJ − TA (°C) θJA (°C/W) TJ − TA (°C) 450 0.26 260 0.13 180 0.09 140 0.07 180 0.09 90 0.05 70 0.03 Moving air (1) (2) (3) TO-92 (1) Part soldered to 30 gauge wire. Heat sink used is ½″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 14. Part glued and leads soldered to 1" square of 1/16" printed circuit board with 2oz. foil or similar. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 7 LM61 SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 www.ti.com Capacitive Loads The LM61 handles capacitive loading well. Without any special precautions, the LM61 can drive any capacitive load as shown in Figure 15. Over the specified temperature range the LM61 has a maximum output impedance of 5 kΩ. In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup. It is recommended that 0.1 μF be added from +VS to GND to bypass the power supply voltage, as shown in Figure 16. In a noisy environment it may be necessary to add a capacitor from the output to ground. A 1 μF output capacitor with the 5 kΩ maximum output impedance will form a 32 Hz lowpass filter. Since the thermal time constant of the LM61 is much slower than the 5 ms time constant formed by the RC, the overall response time of the LM61 will not be significantly affected. For much larger capacitors this additional time lag will increase the overall response time of the LM61. Figure 15. LM61 No Decoupling Required for Capacitive Load Figure 16. LM61 with Filter for Noisy Environment Figure 17. Simplified Schematic 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 Applications Circuits V+ VTEMP R3 VT1 R4 VT2 4.1V LM4040 V+ VT R1 U3 0.1 PF LM61 R2 (Low = overtemp alarm) + U1 - VOUT VOUT LM7211 VTemp U2 VT1 = (4.1)R2 R2 + R1||R3 VT2 = (4.1)R2||R3 R1 + R2||R3 Figure 18. Centigrade Thermostat Figure 19. Conserving Power Dissipation with Shutdown Recommended Solder Pads for SOT-23 Package Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 9 LM61 SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Revision H (February 2013) to Revision I • 10 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 9 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM61 PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM61BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -25 to 85 T1B LM61BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 T1B LM61BIZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM61BIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type -25 to 85 LM61 BIZ LM61 BIZ LM61CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -30 to 100 T1C LM61CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -30 to 100 T1C LM61CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -30 to 100 T1C LM61CIZ/LFT2 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM61CIZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) SN | CU SN N / A for Pkg Type LM61 CIZ -30 to 100 LM61 CIZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Nov-2013 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM61BIM3 SOT-23 DBZ 3 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 LM61BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM61BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM61CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM61CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM61CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM61CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 23-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM61BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM61BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM61BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM61CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM61CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM61CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM61CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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