LM384 www.ti.com SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 LM384 5W Audio Power Amplifier Check for Samples: LM384 FEATURES DESCRIPTION • • • • • • • • The LM384 is a power audio amplifier for consumer applications. In order to hold system cost to a minimum, gain is internally fixed at 34 dB. A unique input stage allows ground referenced input signals. The output automatically self-centers to one-half the supply voltage. 1 2 • Wide Supply Voltage Range: 12V to 26V Low Quiescent Power Drain Voltage Gain Fixed at 50 High Peak Current Capability: 1.3A Input Referenced to GND High Input Impedance: 150kΩ Low Distortion: 0.25% (PO=4W, RL=8Ω) Quiescent Output Voltage is at One Half of the Supply Voltage 14-Pin PDIP Package The output is short-circuit proof with internal thermal limiting. The package outline is standard dual-in-line. A copper lead frame is used with the center three pins on either side comprising a heat sink. This makes the device easy to use in standard p-c layout. Uses include simple phonograph amplifiers, intercoms, line drivers, teaching machine outputs, alarms, ultrasonic drivers, TV sound systems, AM-FM radio and sound projector systems. See SNAA086 for circuit details. Schematic Diagram 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2013, Texas Instruments Incorporated LM384 SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) Supply Voltage 28V Peak Current 1.3A Power Dissipation (3) (4) 1.67W Input Voltage ±0.5V −65°C to +150°C Storage Temperature Operating Temperature 0°C to +70°C Lead Temperature (Soldering, 10 sec.) 260°C Thermal Resistance (1) θJC 30°C/W θJA 79°C/W Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not ensure specific performance limits. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. The maximum junction temperature of the LM384 is 150°C. The package is to be derated at 15°C/W junction to heat sink pins. (2) (3) (4) Electrical Characteristics (1) Symbol Parameter Conditions Min Typ ZIN Input Resistance IBIAS Bias Current AV Gain POUT Output Power IQ Quiescent Supply Current 8.5 Quiescent Output Voltage 11 VOUT Q BW Bandwidth V+ Supply Voltage ISC Short Circuit Current (2) PSRRRTO Power Supply Rejection Ratio THD Total Harmonic Distortion (1) (2) (3) 2 Inputs Floating THD = 10%, RL = 8Ω kΩ nA 50 5 5.5 60 V/V 25 mA W V 450 12 kHz 26 1.3 (3) 0.25 V A 31 POUT = 4W, RL = 8Ω Units 100 40 POUT = 2W, RL = 8Ω Max 150 dB 1.0 % V+ = 22V and TA = 25°C operating with a Staver V7 heat sink for 30 seconds. Output is fully protected against a shorted speaker condition at all voltages up to 22V. Rejection ratio referred to the output with CBYPASS = 5 μF, freq = 120 Hz. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 LM384 www.ti.com SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 Heat Sink Dimensions Staver Company 41 Saxon Ave. P.O. Drawer H Bay Shore, N.Y. Tel: (516) 666-8000 Figure 1. Staver “V7” Heat Sink Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 3 LM384 SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Typical Performance Characteristics 4 Device Dissipation vs Ambient Temperature Thermal Resistance vs Square Inches Figure 2. Figure 3. Supply Decoupling vs Frequency Total Harmonic Distortion vs Output Power Figure 4. Figure 5. Output Voltage Gain vs Frequency Total Harmonic Distortion vs Frequency Figure 6. Figure 7. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 LM384 www.ti.com SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 Typical Performance Characteristics (continued) Power Supply Current vs Supply Voltage Device Dissipation vs Output Power—16Ω Load Figure 8. Figure 9. Device Dissipation vs Output Power—8Ω Load Device Dissipation vs Output Power—4Ω Load Figure 10. Figure 11. Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 5 LM384 SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com Block and Connection Diagrams Note: Heatsink Pins Figure 12. 14-Pin PDIP (Top View) See NFF0014A Package Typical Applications Figure 13. Typical 5W Amplifier 6 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 LM384 www.ti.com SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 Figure 14. Bridge Amplifier *For stability with high current loads Figure 15. Intercom Figure 16. Phase Shift Oscillator Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 7 LM384 SNAS547C – FEBRUARY 1995 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision B (April 2013) to Revision C • 8 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 7 Submit Documentation Feedback Copyright © 1995–2013, Texas Instruments Incorporated Product Folder Links: LM384 PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) (4) LM384N ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM384N LM384N/NOPB ACTIVE PDIP NFF 14 25 Pb-Free (RoHS Exempt) SN Level-1-NA-UNLIM 0 to 70 LM384N (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. 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