Z-Power LED X10490 Technical Data Sheet Specification MBT801 SSC Drawn Approval Customer Approval Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet MBT801 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Outline Dimension 6. Packing 7. Soldering 8. Precaution for use Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet MBT801 MBT801 Features Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range 40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS. 사진 • Industry Standard PLCC SMT package • High brightness using AlInGaP and InGaN dice technologies • Available in multiple colors • High volume, high reliability Applications • Interior automotive • Electronic Signs and Signals • Office Automation, Electrical Appliances, Industrial Equipment Rev. 09 December 2006 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Features • BLUE colored SMT package • Material InGaN/SiC • Suitable for all SMT assembly methods Suitable for all soldering methods • RoHS Compliant Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Symbol Value Unit Power Dissipation Pd 120 mW Forward Current IF 30 mA Peak Forward Current IFM *2 90 mA Reverse Voltage VR 5 V Topr -40 ~ +100 oC Tstg -40 ~ +100 oC Operating Temperature Storage Temperature *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics Parameter Symbol Condition Min Typ Max Unit Forward Voltage VF IF =20mA 2.7 3.2 4.0 V Reverse Current IR VR=5V - - 10 µA IV IF =20mA 70 335 600 mcd Peak Wavelength λP IF =20mA - 465 - nm Dominant Wavelength λd IF =20mA 464 470 476 nm Spectral Bandwidth 50% ∆λ IF =20mA - 23 - nm IF =20mA - 120 - deg. Luminance Intensity Viewing Angle *2 *1 2θ ½ *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity vs Forward Current Forward Current vs. Forward Voltage (Ta=25 OC ) 10 1 2.6 2.8 3.0 3.2 3.4 3.6 3.8 (Ta=25 OC ) 1.6 Relative Luminous Intensity Iv/Iv [Rel] 100 Forward Current IF [mA] Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 4.0 0 5 10 15 20 25 30 Forward Current IF [mA] Forward Voltage VF (V) Radiation Diagram Forward Current Derating Curve (Ta=25 C ) O 40 Forward Current IF [mA] 0 -30 30 20 -60 30 60 10 -90 0 -40 -20 0 20 40 60 80 100 90 120 Ambient Temperature TA [OC] Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Recommended Solder Pattern 1.9 2.8 0.15 1.8 0.8 2.2 1.6 0.8 Anode 1.8 3.2 2.4 1.6 Cathode Cathode Mark 2.2 ( Tolerance: ±0.2, Unit: mm ) 6. packing 1.75±0.1 1 .5 5 ± 0 .0 5 4 .0 ±0 .1 2 .0 ±0 .0 5 0 .2 2 ±0 .0 5 3.83±0.1 5° 3.5±0.1 8±0.1 1 .0 ±0 .1 8° 3 .1 ±0 .1 2 .2 2 ±0 .1 11.4 ± 0.1 180 +0 -3 9.0 ± 0.3 LABLE 2.0 ± 0.2 13 30° 10 ±0.2 60 Z-Power LED X10490 Technical Data Sheet 5.outline dimension 22 (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet ● Reel Packing Structure Reel XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag XXX RANK: QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c XXX RANK: 1 QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : TOP LED RoHS XXXXXX SEOUL SEMICONDUCTOR CO., LTD. b a Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 7. soldering (1) Lead Solder Lead Solder Lead Solder 2.5~5 o C / sec. Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. Pre-heating 120~150 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder 1~5 o C / sec. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 1~5 o C / sec. Pre-heating 150~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)