SEOUL WH2001

Z-Power LED
X10490
Technical
Data
Sheet
Specification
WH2001
Preliminary
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
CONTENTS
1.
Absolute Maximum Ratings
2.
Electro Characteristics
3.
Outline Dimension
4.
Electro-Optical characteristic Diagram
5.
Color & Binning
6.
Rank of WH603R
7.
Reliability tests
8.
Packing
9.
Soldering
10. Precaution for use
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
WH2001
Description
Features
사진
-
Vary Thin PKG of Reflector type
-
Surface-mounted chip LED device.
-
Pb-free and RoHS complaint component.
-
High brightness
-
Low Thermal Resistance
-
Tape and Reel packing.
WH2001
•
3.5 X 2.8 X 0.6 mm
•
Emitted Color : White
•
CIE chromaticity
x : 0.3
•
y : 0.3
Material : InGaN
Applications
•
Electric appliance
•
Other decoration lighting
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Absolute maximum ratings
(Ta=25℃)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
100
mW
Forward Current
IF
30
mA
Peak Forward Current
IFM *1
90
mA
Reverse Voltage
VR
5
V
Operation Temperature
Topr.
-30 ~ 85
℃
Storage Temperature
Tstg.
-40 ~ 100
℃
*1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10.
2. Electro-Optical Characteristics
(Ta=25℃)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF=20 ㎃
2.7
3.2
4.0
V
Reverse Current
IR
VR=5V
-
-
10
㎂
Luminous Intensity*2
IV
IF=20 ㎃
-
1800
2600
mcd
Luminous Flux
Φ
IF=20 ㎃
-
5
-
lm
x
IF=20 ㎃
0.28
0.3
0.34
y
IF=20 ㎃
0.25
0.3
0.34
2θ1/2
IF=20 ㎃
-
120
-
Chromaticity
Coordinates*3
Viewing Angle*4
˚
*2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the
LED package.
*3 The CIE standard colorimetric system
*4 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity.
[Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at
Rev.
20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC.
(Tolerance : Iv ±10%, color coordinate ±0.01, VF ±0.1V)
00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
3.Outline Dimension
[TOP VIEW]
[SIDE VIEW]
[BOTTOM VIEW]
[INNER CIRCUIT]
( Tolerance: ±0.1, Unit: mm )
- Recommended Soldering Design
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Forward Current vs. Forward Voltage
(Ta=25 OC )
Forward Current, IF [mA]
100
10
1
2.6
2.8
3.0
3.2
3.4
3.6
3.8
Forward Voltage, VF [V]
Relative Luminous Intensity vs Forward Current
(Ta=25 OC )
2.5
2.0
Relative Intensity
Z-Power LED
X10490
Technical
Data
Sheet
4. Electro-Optical characteristic Diagram
1.5
1.0
0.5
0.0
0
10
20
30
Forward Current[mA]
40
50
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Ambient Temperature vs. Allowable Forward Current
25
20
Forward current IF(mA)
Z-Power LED
X10490
Technical
Data
Sheet
4. Electro-Optical characteristic Diagram
15
10
5
0
-25
0
25
50
75
100
Ambient temperature Ta(? )
Radiation Diagram
(Ta=25 OC )
90
1.0
120
150
0.5
0.0
60
30
180
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Spectrum
(TA=25℃, IF=20mA)
1.0
Relative Luminous Intensity (a.u.)
Z-Power LED
X10490
Technical
Data
Sheet
4. Electro-Optical characteristic Diagram
0.8
0.6
0.4
0.2
0.0
350
400
450
500
550
600
650
700
750
800
Wavelength (nm)
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.9
520
0.8
540
0.7
560
0.6
CIE (y)
500
580
0.5
0.4
600
620
0.3
640
0.2
0.1
0.0
0.0
480
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CIE (x)
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
5. Color & Binning
0.34
F
E
y coordinate
0.32
C
0.30
D
B
0.28
A
0.26
0.26
0.28
0.30
0.32
0.34
x coordinate
※ Color Rank
Bin
A
D
CIE x
CIE y
0.2966
0.2583
0.2851
0.2639
0.2983
0.2881
0.3095
Bin
CIE x
CIE y
0.2851
0.2639
0.2726
0.2700
0.2875
0.2951
0.2811
0.2983
0.3095
0.2811
0.2983
0.2881
0.3123
0.3135
0.3254
0.3079
B
E
Bin
CIE x
CIE y
0.2983
0.2881
0.2875
0.2951
0.3011
0.3184
0.2881
0.3123
0.3135
0.3254
0.3079
0.3257
0.3357
0.3381
0.3300
0.3123
0.3135
0.3257
0.3357
0.3011
0.3184
0.3123
0.3135
0.3142
0.3400
C
F
Rev. 00
September 2008
* Measurement Uncertainty of the Color Coordinates : ± 0.01
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
6. Rank of WH2001
(1) Luminous Intensity: Iv [mcd]
Rank
Iv [mcd]
A
1000 ~ 1550
B
1550 ~ 2600
Condition
IF =20mA
(2) Color Coordinate: x, y
Rank
A
B
C
D
E
F
1
2
3
4
x
0.2966
0.2851
0.2983
0.3095
y
0.2583
0.2639
0.2881
0.2811
x
0.2851
0.2726
0.2875
0.2983
y
0.2639
0.2700
0.2951
0.2881
x
0.2983
0.2875
0.3011
0.3123
y
0.2881
0.2951
0.3184
0.3135
x
0.3095
0.2983
0.3123
0.3254
y
0.2811
0.2881
0.3135
0.3079
x
0.3254
0.3381
0.3257
0.3123
y
0.3079
0.3300
0.3357
0.3135
x
0.3257
0.3123
0.3011
0.3142
y
0.3357
0.3135
0.3184
0.3400
Condition
IF =20mA
(3) Forward voltage: VF
VF [V]
Condition
2.8 ~ 3.8
IF =20mA
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. Reliability Tests
Item
Condition
Note
Failures
Life Test
Ta = RT, IF = 20mA
1000hrs
0/22
High Temperature
Operating
Ta = 85ºC, IF = 20mA
1000hrs
0/22
Low Temperature Operating
Ta = -30ºC, IF = 20mA
1000hrs
0/22
Thermal Shock
Ta = -30ºC (30min) ~ 85ºC (30min)
(Transfer time : 10sec, 1Cycle = 1hr)
100
cycles
0/40
Resistance to soldering
Heat
Ts = 255 ± 5ºC, t = 10sec
1 time
0/22
ESD
(Human Body Model)
1kV, 1.5kΩ ; 100pF
1 time
0/22
High Temperature Storage
Ta = 100ºC
1000hrs
0/22
Low Temperature Storage
Ta = -40ºC
1000hrs
0/22
Temperature Humidity
Storage
Ta = 85ºC, RH = 85%
1000hrs
0/22
Temperature Humidity
Operating
Ta = 85ºC, RH = 85%, IF = 20mA
100hrs
0/22
< Judging Criteria For Reliability Tests >
VF
USL[1] X 1.2
IR
USL X 2.0
ФV
LSL [2] X 0.7
Notes :
[1] USL : Upper Standard Level
[2] LSL : Lower Standard Level.
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
4.0±0.1
2.9±0.1
+0.1
-0
0.25±0.05
(2.75)
8.0±0.1
3.5±0.05
3.7±0.1
1.5
1.75±0.1
Marking
Direction
0.85±0.1
180
11.4
+0
-3
9
±0.3
+0.2
-0
2 ±0.2
60
Z-Power LED
X10490
Technical
Data
Sheet
8. Packing
22
13
±0.2
Label
Tolerance: ±0.2, Unit: ㎜
(1) Quantity: 2,000pcs./Reel
(2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is
turned off from the carrier tape at10˚angle to be the carrier tape.
(4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof
Package.
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
Product No.: SSC-WH2001
Quantity : 2000
Batch/Lot number :############
Aluminum Vinyl Bag
Product No.: SSC-WH2001
Quantity : 2000
Batch/Lot number : ############
Outer Box
*Material: Paper(SW3B(B))
TYPE
SIZE(mm)
a
7inch 245
c
142
b
220
c
TUV
CHIP LED
MADE IN KOREA
Acriche
Semiconductor EcoLight
RoHS
b
a
PART : SSCWh2001
CODE :
Q'YT : 20,000EA
LOT NO :
DATE :
SEOUL SEMICONDUCTOR CO.,LTD
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
9. Soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 3 seconds at maximum 280ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the
encapsulated part.
So when using the chip mounter, the picking up nozzle that does not
affect the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
September 2008
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Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
10. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in the dry box (or
desiccator) with a desiccant. Otherwise, to store them in the following environment is
recommended.
Temperature : 5℃~30℃ Humidity : 60%HR max.
(2) Attention after opened
However LED is corresponded SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention in followed.
a. After opened and mounted, the soldering shall be quickly.
b. Keeping of a fraction
Temperature : 5 ~ 40℃
Humidity : less than 30%
(3) In case of more than 1 week passed after opening or change color of indicator on desiccant
components shall be dried 10-12hr. at 60±5℃.
(4) In case of supposed the components is humid, shall be dried dip-solder just before.
100Hr at 80±5℃ or 12Hr at 100±5℃.
(5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling
process to normal temp. after soldering.
(6) Quick cooling shall not be avoid.
(7) Components shall not be mounted on warped direction of PCB.
(8) Anti radioactive ray design is not considered for the products listed here in.
(9) Gallium arsenide is used in some of the products listed in this publication. These products are
dangerous if they are burned or smashed in the process of disposal. It is also dangerous to
drink the liquid or inhale the gas generated by such products when chemically disposed.
(10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA should be used.
(11) When the LEDs are illuminating, operating current should be decided after considering the
ambient maximum temperature.
(12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or
more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be
used for storage.
(13) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(14) Repack unused products with anti-moisture packing, fold to close any opening and then
store in a dry place.
(15) The appearance and specifications of the product may be modified for improvement without
notice.
Rev. 00
September 2008
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)