TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE Check for Samples: TS3USB221A-Q1 FEATURES 1 • • • • • • • • • • Qualified for Automotive Applications VCC Operation at 2.5 V to 3.3 V VI/O Accepts Signals Up to 5.5 V 1.8-V Compatible Control-Pin Inputs Low-Power Mode When OE Is Disabled (1 μA) rON = 16 Ω Maximum ΔrON = 0.2 Ω Typical Cio(on) = 6 pF Typical Low Power Consumption (30 μA Maximum) High Bandwidth (900 MHz Typical) • • ESD Performance Tested Per JESD 22 – 7000-V Human-Body Model (A114-B, Class II) – 1000-V Charged-Device Model (C101) ESD Performance I/O to GND – 12-kV Human-Body Model APPLICATIONS • Routes Signals for USB 1.0, 1.1, and 2.0 RSE PACKAGE (TOP VIEW) RSE PACKAGE (BOTTOM VIEW) VCC VCC 1D+ 1 1D– 10 1D+ 8 2 1D– D– 7 3 2D+ OE 6 4 2D– S S 9 2 8 D+ D+ 2D+ 3 7 D– 2D– 4 6 OE 5 10 1 9 GND 5 GND DESCRIPTION The TS3USB221A is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps). The TS3USB221A integrates ESD protection cells on all pins, is available in a tiny μQFN package (2.0 mm × 1.5 mm) and is charaterized over the free air temperature range from –40°C to 125°C. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) QFN – RSE Reel of 3000 ORDERABLE PART NUMBER TS3USB221AQRSERQ1 TOP-SIDE MARKING OFW For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable S Select input D Bus A nD Bus B TRUTH TABLE S OE FUNCTION X H Disconnect L L D = 1D H L D = 2D BLOCK DIAGRAM D+ 1D+ D− 1D− 2D+ 2D− S OE Figure 1. SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN (see Note A) A. 2 EN is the internal enable signal applied to the switch. Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT –0.5 4.6 V (3) –0.5 7 V (3) (4) –0.5 7 VCC Supply voltage range VIN Control input voltage range (2) VI/O Switch I/O voltage range (2) IIK Control input clamp current VIN < 0 II/OK I/O port clamp current VI/O < 0 II/O ON-state switch current (5) Continuous current through VCC or GND ±100 mA 150 °C Tstg (1) (2) (3) (4) (5) –65 Storage temperature range V –50 mA –50 mA ±120 mA Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. PACKAGE THERMAL IMPEDANCE over operating free-air temperature range (unless otherwise noted) UNIT θJA Package thermal impedance (1) θJC Junction-to-case thermal resistance (1) 243 °C/W 84 °C/W MIN MAX UNIT 2.3 3.6 RSE package The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature Copyright © 2010–2011, Texas Instruments Incorporated VCC = 2.3 V to 2.7 V 0.46 × VCC VCC = 2.7 V to 3.6 V 0.46 × VCC V V VCC = 2.3 V to 2.7 V 0.25 × VCC VCC = 2.7 V to 3.6 V 0.25 × VCC V 0 5.5 V –40 125 °C 3 TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK Control inputs IIN IOZ (3) TEST CONDITIONS MIN TYP (2) MAX UNIT –1.8 V VCC = 3.6 V, 2.7 V, II = –18 mA VCC = 3.6 V, 2.7 V, 0 V, VIN = 0 V to 3.6 V ±1 μA VCC = 3.6 V, 2.7 V, VO = 0 V to 5.25 V, VI = 0 V, VIN = VCC or GND, Switch OFF ±1 μA VI/O = 0 V to 5.25 V ±2 VI/O = 0 V to 3.6 V ±2 μA I(OFF) VCC = 0 V VI/O = 0 V to 2.7 V ±1 ICC VCC = 3.6 V, 2.7 V, VIN = VCC or GND, II/O = 0 V, Switch ON or OFF 30 μA ICC (low power mode) VCC = 3.6 V, 2.7 V, VIN = VCC or GND, Switch disabled, OE in high state 1 μA Control inputs One input at 1.8 V, Other inputs at VCC or GND VCC = 3.6 V 20 (4) VCC = 2.7 V 0.5 Cin Control inputs VCC = 3.3 V, 2.5 V, VIN = VCC or 0 V 1.5 2.5 pF Cio(OFF) VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch OFF 3.5 5 pF Cio(ON) VCC = 3.3 V, 2.5 V, VI/O = VCC or 0 V, Switch ON 6 7.5 pF VI = 0 V, IO = 30 mA 3 6 3.4 6 6 10 10 16 ΔICC rON (5) VI = 2.4 V, IO = –15 mA VCC = 3 V, 2.3 V VI = 0 V, IO = 30 mA VI = 2.4 V, IO = –15 mA ΔrON VCC = 3 V, 2.3 V rON(flat) VCC = 3 V, 2.3 V (1) (2) (3) (4) (5) TA = 25°C TA = 125°C VI = 0 V, IO = 30 mA 0.2 VI = 1.7, IO = –15 mA 0.2 VI = 0 V, IO = 30 mA 1 VI = 1.7, IO = –15 mA 1 μA Ω Ω Ω VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 3.3 V ±10%, GND = 0 V TYP UNIT XTALK Crosstalk PARAMETER RL = 50 , f = 250 MHz –40 dB OIRR OFF isolation RL = 50 , f = 250 MHz –41 dB BW Bandwidth (–3 dB) RL = 50 0.9 GHz 4 TEST CONDITIONS Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 2.5 V ±10%, GND = 0 V PARAMETER TEST CONDITIONS TYP UNIT dB XTALK Crosstalk RL = 50 , f = 250 MHz -39 OIRR OFF isolation RL = 50 , f = 250 MHz -40 dB BW Bandwidth (3 dB) RL = 50 0.9 GHz SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 3.3 V ±10%, GND = 0 V PARAMETER tpd Propagation delay MIN (2) (3) TYP (1) MAX 0.25 UNIT ns S to D, nD 30 OE to D, nD 17 S to D, nD 12 OE to D, nD 10 tON Line enable time tOFF Line disable time tSK(O) Output skew between center port to any other port (2) 0.1 0.2 ns tSK(P) Skew between opposite transitions of the same output (tPHL– tPLH) (2) 0.1 0.2 ns (1) (2) (3) ns ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 2.5 V ±10%, GND = 0 V PARAMETER tpd Propagation delay MIN (2) (3) 0.25 OE to D, nD 32 S to D, nD 23 OE to D, nD 12 tOFF Line disable time tSK(O) Output skew between center port to any other port (2) Skew between opposite transitions of the same output (tPHL– tPLH) (2) UNIT ns 50 Line enable time (1) (2) (3) MAX S to D, nD tON tSK(P) TYP (1) ns ns 0.1 0.2 ns 0.1 0.2 ns For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type. Specified by design The bus switch contributes no propagational delay other than the RC delay of the on resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25 ns for 10-pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch, when used in a system, is determined by the driving circuit on the driving side of the switch and its interactions with the load on the driven side. Copyright © 2010–2011, Texas Instruments Incorporated 5 TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com APPLICATION INFORMATION 0 0 –1 –20 Attenuation (dB) Gain (dB) –2 –3 –4 –40 –60 –80 –5 –100 –6 –120 –7 100.0E+3 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 1.0E+6 10.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Frequency (Hz) Figure 2. Gain vs Frequency Figure 3. OFF Isolation vs Frequency 0 3.5 –20 3.4 3.3 –40 VCC = 3 V ron (Ω) Attenuation (dB) 100.0E+6 10.0E+9 –60 3.2 VCC = 2.3 V 3.1 –80 3.0 –100 2.9 –120 2.8 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 Frequency (Hz) Figure 4. Crosstalk vs Frequency 6 10.0E+9 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (V) Figure 5. ron vs VIN (IOUT = –15 mA) Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com 3.5 3.4 3.3 ron (Ω) VCC = 3 V 3.2 VCC = 2.3 V 3.1 3.0 2.9 2.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (V) 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) Figure 6. rON vs VIN (IOUT = 30 mA) 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 7. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) Copyright © 2010–2011, Texas Instruments Incorporated 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 8. Eye Pattern: 480-Mbps USB Signal With Switch NC Path 7 TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 9. Eye Pattern: 480-Mbps USB Signal With Switch NO Path 8 Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 or VOUT2 VIN RL CL VCOM tON 500 Ω 50 pF V+ tOFF 500 Ω 50 pF V+ D CL(2) 1D or 2D VCTRL TEST RL S CL(2) Logic Input(1) RL GND 1.8 V Logic Input (VI) 50% 50% 0 tON tOFF Switch Output (VOUT1 or VOUT2) (1) (2) 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. CL includes probe and jig capacitance. Figure 10. Turn-On (tON) and Turn-Off Time (tOFF) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VCTRL = VCC or GND D Source Signal 50 W VIN 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VCTRL S 50 W + GND DC Bias = 350 mV Figure 11. OFF Isolation (OISO) Copyright © 2010–2011, Texas Instruments Incorporated 9 TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VCTRL = VCC or GND VOUT2 2D 50 W Network Analyzer Setup 50 W VCTRL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 12. Crosstalk (XTALK) VCC Network Analyzer 50 W VOUT1 1D Channel ON: 1D to D D Source Signal VIN VCTRL = VCC or GND 2D Network Analyzer Setup 50 W VCTRL + Source Power = 0 dBm (632-mV P-P at 50-W load) S GND DC Bias = 350 mV Figure 13. Bandwidth (BW) 400 mV Figure 14. Propagation Delay 10 Copyright © 2010–2011, Texas Instruments Incorporated TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 800 mV 50% 50% Input 400 mV tPLH tPHL VOH 50% Output VOL tSK(P) = | tPHL – tPLH | PULSE SKEW tSK(P) 800 mV 50% 50% Input 400 mV tPLH1 tPHL1 VOH 50% 50% Output 1 VOL tSK(O) tSK(O) VOH 50% 50% Output 2 tPLH2 VOL tPHL2 tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | OUTPUT SKEW tSK(P) Figure 15. Skew Test VCC VOUT1 1D + D VIN Channel ON VOUT2 2D r on + VCTRL IIN S VIN * VOUT2 or VOUT1 W IIN VCTRL = VIH or VIL + GND Figure 16. ON-State Resistance (ron) Copyright © 2010–2011, Texas Instruments Incorporated 11 TS3USB221A-Q1 SCDS300B – JULY 2010 – REVISED JULY 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D VIN D + VOUT2 2D VCTRL + S OFF-State Leakage Current Channel OFF VCTRL = VIH or VIL + GND Figure 17. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS VBIAS = VCC or GND VOUT2 2D VCTRL = VCC or GND VIN D Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VCTRL S GND Figure 18. Capacitance 12 Copyright © 2010–2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 23-Feb-2012 PACKAGING INFORMATION Orderable Device TS3USB221AQRSERQ1 Status (1) Package Type Package Drawing ACTIVE UQFN RSE Pins Package Qty 10 3000 Eco Plan (2) Green (RoHS & no Sb/Br) Lead/ Ball Finish MSL Peak Temp (3) Samples (Requires Login) CU NIPDAU Level-3-260C-168 HR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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OTHER QUALIFIED VERSIONS OF TS3USB221A-Q1 : • Catalog: TS3USB221A NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB221AQRSERQ1 Package Package Pins Type Drawing UQFN RSE 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 1.68 B0 (mm) K0 (mm) P1 (mm) 2.13 0.76 4.0 W Pin1 (mm) Quadrant 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 22-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB221AQRSERQ1 UQFN RSE 10 3000 202.0 201.0 28.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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