SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 FEATURES • • • • • • • • • • • • • • (1) Controlled Baseline – One Assembly/Test Site, One Fabrication Site Extended Temperature Performance of –55°C to 125°C Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product Change Notification Qualification Pedigree (1) Member of the Texas Instruments Widebus™ Family State-of-the-Art EPIC-IIB™ BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 5 V, TA = 25°C High-Impedance State During Power Up and Power Down Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise Flow-Through Architecture Optimizes PCB Layout High-Drive Outputs (–24-mA IOH, 48-mA IOL) Plastic 300-mil Shrink Small-Outline (DL) Package DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1LE 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2LE Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold-compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. DESCRIPTION/ORDERING INFORMATION The SN74ABT16373A-EP is a 16-bit transparent D-type latch with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. The SN74ABT16373A-EP is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. ORDERING INFORMATION PACKAGE (1) TA –55°C to 125°C (1) SSOP – DL Tape and reel ORDERABLE PART NUMBER CABT16373AMDLREP TOP-SIDE MARKING ABT16373AMEP Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus, EPIC-IIB are trademarks of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 DESCRIPTION/ORDERING INFORMATION (CONTINUED) The SN74ABT16373A-EP can be used as two 8-bit latches or one 16-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN74ABT16373A-EP is characterized for operation from –55°C to 125°C. FUNCTION TABLE (each 8-bit section) INPUTS 2 OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z Submit Documentation Feedback SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 LOGIC SYMBOL(1) 1OE 1LE 2OE 2LE 1D1 1D2 1D3 1D4 1D5 1D6 1D7 1D8 2D1 2D2 2D3 2D4 2D5 2D6 2D7 2D8 (1) 1 1EN 48 C3 24 2EN 25 C4 47 3D 2 1 46 3 44 5 43 6 41 8 40 9 38 11 37 12 36 13 4D 2 35 14 33 16 32 17 30 19 29 20 27 22 26 23 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 1Q8 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 2Q8 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1LE 1D1 1 2OE 48 47 2LE C1 1D 2 1Q1 24 25 C1 2D1 36 To Seven Other Channels 1D 13 2Q1 To Seven Other Channels Submit Documentation Feedback 3 SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 7 V VI Input voltage range (2) –0.5 7 V VO Voltage range applied to any output in the high or power-off state –0.5 5.5 V IO Current into any output in the low state 96 mA IIK Input clamp current VI < 0 –18 mA IOK Output clamp current VO < 0 –50 mA θJA Package thermal impedance (3) 94 °C/W Tstg Storage temperature range 150 °C (1) (2) (3) –65 UNIT Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD 51. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage VI Input voltage IOH IOL ∆t/∆v Input transition rise or fall rate MIN MAX 4.5 5.5 2 V V VCC V High-level output current –24 mA Low-level output current 48 mA 10 ns/V 0 Outputs enabled 200 TA –55 4 V 0.8 ∆t/∆VCC Power-up ramp rate (1) UNIT Operating free-air temperature Unused inputs must be held high or low to prevent them from floating. Submit Documentation Feedback µs/V 125 °C SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH VOL TA = 25°C TEST CONDITIONS MIN TYP (1) MIN MAX MAX VCC = 4.5 V, II = –18 mA –1.2 VCC = 4.5 V, IOH = –3 mA 2.5 2.5 VCC = 5 V, IOH = –3 mA 3 3 VCC = 4.5 V, IOH = –24 mA 2 2 VCC = 4.5 V, IOL = 48 mA –1.2 0.55 Vhys UNIT V V 0.55 V 100 II VCC = 0 to 5.5 V, VI = VCC or GND (2) VCC = 0 to 2.1 V, VO = 0.5 V to 2.7 V, IOZPD (2) VCC = 2.1 V to 0, VO = 0.5 V to 2.7 V, IOZH VCC = 2.1 V to 5.5 V, VO = 2.7 V, IOZL VCC = 2.1 V to 5.5 V, VO = 0.5 V, VCC = 0, VI or VO ≤ 4.5 V VCC = 5.5 V, VO = 5.5 V VCC = 5.5 V, VO = 2.5 V VCC = 5.5 V, IO = 0, VI = VCC or GND IOZPU Ioff ICEX Outputs high IO (3) ±1 ±1 µA OE = X ±50 ±50 µA OE = X ±50 ±50 µA OE ≥ 2 V 10 10 µA OE ≥ 2 V –10 –10 µA Outputs low µA ±100 –50 –100 Outputs high ICC mV Outputs disabled 50 50 µA –180 –50 –180 mA 2 2 85 85 2 2 1.5 1.5 mA ∆ICC (4) VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Ci VI = 2.5 V or 0.5 V 3.5 pF Co VO = 2.5 V or 0.5 V 9.5 pF (1) (2) (3) (4) mA All typical values are at VCC = 5 V. This parameter is characterized, but not production tested. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Timing Requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) VCC = 5 V, TA = 25°C MIN MIN MAX UNIT MAX tw Pulse duration, LE high 3.3 3.3 ns tsu Setup time, data before LE↓ 1.5 2.4 ns th Hold time, data after LE↓ 1 2.2 ns Submit Documentation Feedback 5 SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 Switching Characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ 6 FROM (INPUT) TO (OUTPUT) D Q LE Q OE Q OE Q Submit Documentation Feedback VCC = 5 V, TA = 25°C MIN MAX 5.3 1.4 6.5 4 5.4 2 6.5 1.7 4.1 5.7 1.7 7 2.3 4.3 5.6 2.3 6.3 1.1 3.4 5 1.1 6.4 1.5 3.5 4.9 1.5 5.8 2.4 5.1 7.1 2.4 8.3 1.6 4.4 6.3 1.6 8 MIN TYP MAX 1.4 3.7 2 UNIT ns ns ns ns SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V Input 1.5 V 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V tPLH 1.5 V 1.5 V VOL tPHL 1.5 V 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH VOH Output 3V Output Control tPHL VOH Output 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms Submit Documentation Feedback 7 SN74ABT16373A-EP 16-BIT TRANSPARENT D-TYPE LATCH WITH 3-STATE OUTPUTS www.ti.com SCBS810 – MARCH 2006 APPLICATION INFORMATION 100000 Years Estimated Life 10000 1000 Electromigration Fail Mode 100 10 Wirebond Voiding Fail Mode 1 0.1 80 90 100 110 120 130 140 150 160 Continuous Tj – °C Figure 2. CABT16373AMDLREP Operating Life Derating Chart 8 Submit Documentation Feedback 170 180 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CABT16373AMDLREP ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/06628-01XE ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74ABT16373A-EP : SN74ABT16373A • Catalog: • Military: SN54ABT16373A-EP NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog • Military - QML certified for Military and Defense Applications Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee® Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated