CHX3068-QDG RoHS COMPLIANT 15-30GHz Frequency Multiplier GaAs Monolithic Microwave IC in SMD leadless package Description The CHX3068-QDG is a Ka-band frequency multiplier monolithic integrated circuit. Typical applications are for telecommunication such as DVB-RCS. UMS 11971 YYWW The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in lead-free SMD package . Main Features Pout (dBm) ■ 14 to 15 GHz input frequency ■ Input and output integrated buffers ■ 20dBm output power ■ Low input power: 0 to 5dBm ■ DC bias 270mA @ 4V ■ 24L-QFN4X4 SMD package Pout_H2 Pout_H1 Pout_H3 Fin (GHz) Main Characteristics Tamb. = 25°C, Vd = 4.V typical consumption ≈270mA Symbol Fin Parameter Min Typ Max Unit Input frequency range 14 15 GHz Fout Output frequency range 28 30 GHz Pin Input power 0 5 dBm Pout Output power 20 dBm ESD Protections: Electrostatic discharge sensitive device observe handling precautions! Ref: DSCHX3068-QDG8144 - 23 May 08 1/8 Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 15-30GHz Frequency Multiplier CHX3068-QDG Electrical Characteristics Tamb = +25°C, Vd0=Vd1,2=Vd3=Vd4= 4.V Consumption(I d0+Id1,2+Id3+Id4) ≈ 270mA (1) Symbol Fin Parameter Min Typ Max Unit Input frequency range 14 15 GHz Fout Output frequency range 28 30 GHz Pin Input power 0 5 dBm Pout_H2 Output power for +2 dBm input power 20 dBm Rej_H1 Fundamental rejection for +2dBm input power 30 dBc Rej_H3 Third harmonic rejection for +2dBm input power 50 dBc VSWRin Input VSWR 2.0:1 VSWRout Output VSWR Vd Drain voltage supply Vg Id 2.0:1 4 V Gate voltage supply (1) -1.8 V Bias current (with RF) 270 mA (1) Adjust Vg to achieve Id4=115 mA These values are representative of onboard measurements as defined on the drawing at page 8 (paragprah “Evaluation mother board:”). Ref: DSCHX3068-QDG8144 - 23 May 08 2/8 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Absolute Maximum Ratings (1) Tamb = +25°C Symbol Parameter Values Unit Vd Drain bias voltage 4.5 V Id Drain bias current 330 mA Maximum input power +8 dBm Maximum Junction Temperature 175 °C Operating temperature range -40 to +85 °C Storage temperature range -55 to +125 °C Pin Tjmax Ta Tstg (1) Operation of this device above anyone of these paramaters may cause permanent damage. Device thermal performances: All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the case temperature (Tcase) can not be maintained below the maximum temperature specified in order to guarantee the nominal device life time (MTTF) (see the curve Pdiss. Max). DEVICE THERMAL SPECIFICATION : CHX3068-QDG Max. junction temperature (Tj max) : 155 °C Max. continuous dissipated power @ Tcase= 85 °C : 1.08 W (1) => Pdiss derating above Tcase = 85 °C : 15 mW/°C (2) Junction-Case thermal resistance (Rth J-C) : <65 °C/W (3) Min. package back side operating temperature : -40 °C (3) Max. package back side operating temperature : 85 °C Min. storage temperature : -55 °C Max. storage temperature : 125 °C (1) Derating at junction temperature constant = Tj max. (2) Rth J-C is calculated for a worst case where the hotter junction of the MMIC is considered. (3) Tcase=Package back side temperature measured under the die-attach-pad (see the drawing below). Tcase 1.2 1 0.6 0.4 0.2 Pdiss. Max. (W) Pdiss. Max. (W) 0.8 Example of QFN 16L 3x3 back-side view, temperature reference point (Tcase) location. 0 -50 -25 0 25 50 75 100 125 Tcase (°C) Ref:. DSCHX3068-QDG8144 - 23 May 08 3/8 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Typical PCB Measured Performances Tamb=+25°C, Vd0=Vd1,2=Vd3=Vd4=4V Vg for Id4=115mA ( ≈-1.8V) Second harmonic output power versus input frequency (Fin) @ Pin=0 & 5dBm Pout H2 (dBm) 2525.00 Pin=5dBm 2020.00 1515.00 Pin=0dBm 1010.00 5 5.00 0 0.00 14 14.25 14.5 14.75 15 15.25 15.5 15.75 16 Fin (GHz) Fundamental rejection versus Fin @ Pin=0 & 5dBm Rejection_H1 (dBc) Pin=0dBm 50 40 30 20 Pin=5dBm 1 0 0 14 14.25 14.5 14.75 15 15.25 15.5 15.75 16 Fin (GHz) 3rd harmonic rejection versus Fin @Pin=0 & 5dBm Pin=0dBm Rejection_H3 (dBc) 60 50 40 Pin=5dBm 30 20 10 0 14 14.25 14.5 14.75 15 15.25 15.5 15.75 16 Fin (GHz) Ref: DSCHX3068-QDG8144 - 23 May 08 4/8 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Package outline (1): 11971 Matt tin, Free Units From standard Lead the (Green) 1- NC 13- NC mm 2- NC 14- JEDEC MO-220 3- GND 15- (VGGD) 4- RF IN 16- GND RF OUT GND 5- GND 17- NC 6- NC 18- NC 7- NC 19- Vd4 8- NC 20- NC 9- NC 21- Vd3 10- Vg 22- Vd1, 2 11- NC 23- Vd0 12- NC 24- NC 25- GND (1) The package outline drawing included to this data-sheet is given for indication. Refere to the application note AN0017 available at http://www.ums-gaas.com for exact package dimensions. Ref:. DSCHX3068-QDG8144 - 23 May 08 5/8 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Recommanded package footprint Refere to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommandations. SMD mounting procedure The SMD leadless package has been designed for high volume surface mount PCB assembly process. The dimensions and footprint required for the PCB (motherboard) are given in the drawings above. For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Ref: DSCHX3068-QDG8144 - 23 May 08 6/8 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier Proposed Assembly characterization. - - board for CHX3068-QDG the 24L-QFN4x4 products Compatible with the proposed foot print. Based on typically RO4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Capacitor 10nF ± 10% Biasing : -Vd0=Vd1,2=Vd3=Vd4=4V -Adjust Vg to achieve Id4=115mA typically Vg=-1.8V) Id0+Id1,2+Id3+Id4 ≈270mA Ref. DSCHX3068-QDG8144 - 23 May 08 7/8 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice 15-30GHz Frequency Multiplier CHX3068-QDG Evaluation mother board: Compatible with the proposed footprint. Based on typically Ro4003 / 8mils or equivalent. Using a microstrip to coplanar transition to access the package. Recommended for the implementation of this product on a module board. Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. (See application note AN0017 for details). Ordering Information QFN 4x4 RoHS compliant package: PART-CHX3068/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref: DSCHX3068-QDG8144 - 23 May 08 8/8 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice