CHR3764-QEG RoHS COMPLIANT 21-27GHz Down-Converter GaAs Monolithic Microwave IC in SMD leadless package Description The CHR3764-QEG is a multifunction monolithic circuit, which integrates a balanced cold FET mixer, a multiplier by two, and a RF LNA including gain control. It is designed for a wide range of applications, typically ISM and commercial communication systems. The circuit is manufactured with a pHEMT process, 0.25µm gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is supplied in RoHS compliant SMD package. UMS R3764 YYWW Main Features 18 16 ■ Broadband RF performance 21-26.5GHz ■ 13dB conversion gain ■ 3.1dB Noise Figure, for IF>0.1GHz ■ 1dBm Input IP3 ■ 14dB Gain Control ■ 15dBc Image Rejection ■ DC bias: Vd=4Volt @ Id=320mA ■ 24L-QFN4x5 ■ MSL1 14 12 Conversion gain (dB) 10 8 6 4 2 0 -2 -4 GCx=-1.5V GCx= -0.7V GCx= -0.5V GCx=0V GCx= -0.6V -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Main Characteristics Tamb.= +25°C, Vd = 4V Symbol Parameter FRF RF frequency range FOL LO frequency range FIF IF frequency range NF Noise Figure@ min. att., for IF>0.1GHz Ref. : DSCHR3764-QEG1263 - 20 Sep 11 1/18 Min 21 8.5 DC Typ 3.0 Max 26.5 15 3.5 Unit GHz GHz GHz dB Specifications subject to change without notice United Monolithic Semiconductors S.A.S. Route Départementale 128 - BP46 - 91401 Orsay Cedex France Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 CHR3764-QEG 21-27GHz Down-Converter Electrical Characteristics Tamb = +25°C, VD = VDL = 4V Symbol Parameter Min Typ Max Unit FRF RF frequency range 21 26.5 GHz FOL LO frequency range 8.5 15 GHz FIF IF frequency range DC 3.5 GHz GC Conversion Gain @ min. attenuation 9 13 dB Gain control range 14 dB G Noise Figure @ min. att. from 21 to 24GHz, 3.1 3.6 dB for IF>0.1GHz NF Noise Figure @ min. att. from 24 to 26.5GHz, 3.6 4.1 dB for IF>0.1GHz Im_rej Image rejection (1) 15 dBc PLO LO Input power 0 5 dBm Input IP3 @ min. attenuation 0 2 dBm IIP3 -4 -2 dBm Input IP3 @ all gain range (G) 2LO/RF 2LO leakage at RF port @ max. gain 30 dBc RLRF RF Return loss -10 dB RLOL LO Return loss -8 dB VD, VDL DC drain voltage 4 V Id Drain current (ID + IDL) 320 mA VGL LNA DC gate voltage (2) -0.6 V GC2,3 Gain control DC voltage -2 -1.5 0 V VGM Mixer DC gate voltage -0.7 V These values are representative of onboard measurements as defined on the drawing in paragraph "Evaluation mother board". (1) An external combiner 90° is required on IF ports, I / Q. Typical VGL value for IDL = 75mA See in paragraph “ biasing option” other possibility to optimise differently the performances (2) Note: Id is not affected by gain control (GC2, GC3). Ref. : DSCHR3764-QEG1263 - 20 Sep 11 2/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Absolute Maximum Ratings (1) Tamb.= +25°C Symbol Parameter VD Drain bias voltage Id Drain bias current VGL LNA DC gate voltage VGM Mixer DC gate voltage GC2,3 Gain control voltage PRF Maximum peak input power overdrive PLO Maximum LO input power Tj Junction temperature (2) Ta Operating temperature range Tstg Storage temperature range (1) Operation of this device above anyone of these parameters damage. (2) See “Device thermal performances” Values Unit 5 V 450 mA -2 to +0.4 V -2 to +0.4 V -2 to +0.8 V 10 dBm 10 dBm 175 °C -40 to +85 °C -55 to +150 °C may cause permanent Typical Bias Conditions Tamb.= +25°C Symbol Pad No VDL, VD 10, 12 Id 10, 12 VGL 9 VGM 11 GC2, GC3 7, 8 Parameter DC drain voltages Total drain current DC gate voltage DC gate voltage Gain control DC voltage Ref. : DSCHR3764-QEG1263 - 20 Sep 11 3/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Values 4 320 -0.4 -0.7 -2 to +0 Unit V mA V V V Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Device thermal performances All the figures given in this section are obtained assuming that the QFN device is cooled down only by conduction through the package thermal pad (no convection mode considered). The temperature is monitored at the package back-side interface (Tcase) as shown below. The system maximum temperature must be adjusted in order to guarantee that Tcase remains below than the maximum value specified in the next table. So, the system PCB must be designed to comply with this requirement. A derating must be applied on the dissipated power if the Tcase temperature cannot be maintained below than the maximum temperature specified (see the curve Pdiss. Max) in order to guarantee the nominal device life time (MTTF). DEVICE THERMAL SPECIFICATION : CHR3764-QEG Recommended max. junction temperature (Tj max) : 143 Junction temperature absolute maximum rating : 175 Max. continuous dissipated power (Pdiss. Max.) : 1.3 => Pdiss. Max. derating above Tcase(1)= 85 °C : 22 Junction-Case thermal resistance (Rth J-C)(2) : <45 Minimum Tcase operating temperature(3) : -40 Maximum Tcase operating temperature(3) : 85 Minimum storage temperature : -55 Maximum storage temperature : 150 °C °C W mW/°C °C/W °C °C °C °C (1) Derating at junctio n temperature co nstant = Tj max. (2) Rth J-C is calculated fo r a wo rst case co nsidering the ho t t e s t junc t io n o f the M M IC and all the devices biased. (3) Tcase=P ackage back side temperature measured under the die-attach-pad (see the drawing belo w). 1.4 1 0.8 0.6 0.4 0.2 Pdiss. Max. @Tj <Tj max (W) 0 -50 -25 0 25 50 75 100 125 150 175 Pdiss. Max. @Tj <Tj max (W) 1.2 Tcase Example: QFN 16L 3x3 Location of temeprature reference point (Tcase) on package's bottom side Tcase (°C) 6.0 Ref. : DSCHR3764-QEG1263 - 20 Sep 11 4/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Board is defined on the drawing at paragraph “Evaluation mother board”. The board losses are de-embedded. The results are given in the package access planes. Conversion Gain in Supradyne Mode versus RF Frequency & GCx F_RF = 2xF_LO+F_IF, F_IF = 1.5GHz 18 16 14 12 Conversion gain (dB) 10 8 6 4 2 0 -2 -4 GCx=-1.5V GCx= -0.7V GCx= -0.5V GCx=0V GCx= -0.6V -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Conversion Gain in Infradyne Mode versus RF Frequency & GCx RF = 2xF_LO-F_IF, F_IF = 1.5GHz 18 16 14 12 Conversion gain (dB) 10 8 6 4 2 0 -2 -4 GCx=-1.5V GCx= -0.7V GCx= -0.5V GCx=0V GCx= -0.6V -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 5/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Noise Figure at min. att. versus Frequency F_RF = 2xF_LO-F_IF & F_RF = 2xF_LO+F_IF, F_IF = 1.5GHz, GCx = -1.5V 10 9 8 Noise Figure (dB) 7 6 5 4 3 2 USB 1 LSB 0 20 21 22 23 24 25 26 27 RF Frequency (GHz) Image Rejection on Supradyne & Infradyne Mode versus Frequency F_IF = 1.5GHz, GCx = -1.5V 35 30 Image rejection (dBc) 25 20 15 10 LSB USB 5 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 6/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Input IP3 versus Frequency at GCx = -1.5V F_RF = 2xF_LO-F_IF, F_IF = 1.5GHz 16 14 12 Input IP3 (dBm) 10 8 6 4 2 0 19.5GHz 22.5GHz 23.5GHz 24.5GHz 25.5GHz 26.5GHz -2 -4 -6 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 Input Power DCL (dBm) Input IP3 versus GCx F_RF = 2xF_LO-F_IF, F_RF = 25.5GHz, F_IF = 1.5GHz 16 14 12 Input IP3 (dBm) 10 8 6 4 2 0 -2 -2V -4 -0.7V -0.6V -0.5V -0.3V -6 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 Input Power DCL (dBm) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 7/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm IMD3 versus GCx F_RF = 2xF_LO-F_IF, F_RF = 25.5GHz, F_IF = 1.5GHz 80 75 70 65 IMD3 (dBc) 60 55 50 45 40 35 30 25 20 -2V 15 -0.7V -0.6V -0.5V -0.3V 10 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 Input Power DCL (dBm) RF & LO return loss 0 -2 -4 Return losses (dB) -6 -8 -10 -12 RF at max. gain -14 RF at min. gain -16 LO -18 -20 0 5 10 15 20 25 30 Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 8/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Typical Board Measurements Tamb = +25°C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Spurious on IF outputs RF = 2LO + IF P_RF = -20dBm / P_LO = 0dBm @12GHz mRF 0 1 2 0 xx 26 >50 nLO 2 20 >55 >55 1 37 49 >50 3 41 39 >60 4 37 52 23 All values in dBc below IF power level (IF = 1.5GHz). Data measured without external hybrid coupler. Ref. : DSCHR3764-QEG1263 - 20 Sep 11 9/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] °C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Board is defined on the drawing at paragraph “Evaluation mother board”. The board losses are de-embedded. The results are given in the package access planes. Conversion Gain in Supradyne Mode versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 1.5GHz, GCx = -1.5V & 0V Board losses de-embedded (result given on package access planes) 20 18 16 14 Conversion gain (dB) 12 10 8 6 4 2 0 -2 -4 -40°C +25°C +85°C -40°C +25°C +85°C -6 -8 -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Conversion Gain in Infradyne Mode versus Frequency RF = 2xF_LO-F_IF, F_IF = 2.0GHz, GCx = -1.5V & 0V Board losses de-embedded (result given on package access planes) 20 18 16 14 Conversion gain (dB) 12 10 8 6 4 2 0 -2 -4 -6 -8 -40°C +25°C +85°C -40°C +25°C +85°C -10 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 10/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] °C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Noise Figure in Supradyne Mode at min. att. versus Frequency F_RF = 2xF_LO+F_IF, F_IF = 1.5GHz, GCx = -1.5V Board losses de-embedded (result given on package access planes) 7 6 Noise Figure (dB) 5 4 3 2 1 85°C 25°C -40°C 0 20 21 22 23 24 25 26 27 RF Frequency (GHz) Image Rejection on Supradyne Mode versus Frequency F_IF = 1.5GHz, GCx = -1.5V Image rejection (dBc) 35 30 25 20 15 -40°C 10 +25°C 5 +85°C 0 16 17 18 19 20 21 22 23 24 25 26 27 28 RF Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 11/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Temperature Board Measurements T = [-40, +25, 85] °C, VD = VDL = 4V, VGL = -0.6V, VGM = -0.7V, P_LO = 0dBm Input IP3 versus Temperature at GCx = -1.5V F_RF = 2xF_LO-F_IF, F_RF = 25.5GHz, F_IF = 1.5GHz 10 8 6 IIP3 (dBm) 4 2 0 -2 -4 85°C 25°C -40°C -6 -8 -28 -26 -24 -22 -20 -18 -16 -14 -12 -10 Input Power DCL (dBm) LO leakage (dBm) LO & 2LO leakage at GCx = -1.5V At RF port and T= 25°C 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 -50 -55 -60 -65 -70 -75 -80 2LO LO 16 18 20 22 24 26 28 RF Frequency (GHz) Ref. : DSCHR3764-QEG1263 - 20 Sep 11 12/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Package outline (1) Matt tin, Lead Free Units : From the standard : (Green) mm JEDEC MO-220 (VGGD) 25- GND 12345678- Nc Nc Nc GND(2) RF in GND(2) GC3 GC2 910111213141516- VGL VDL VGM VD Nc GND(2) LO in GND(2) 1718192021222324- Nc Nc Nc IF_I out GND(2) IF_Q out Nc Nc (1) The package outline drawing included to this data-sheet is given for indication. Refer to the application note AN0017 (http://www.ums-gaas.com) for exact package dimensions. (2) It is strongly recommended to ground all pins marked “Gnd” through the PCB board. Ensure that the PCB board is designed to provide the best possible ground to the package. Ref. : DSCHR3764-QEG1263 - 20 Sep 11 13/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Evaluation mother board ■ Compatible with the proposed footprint. ■ Based on typically Ro4003 / 8mils or equivalent. ■ Using a micro-strip to coplanar transition to access the package. ■ Recommended for the implementation of this product on a module board. ■ Decoupling capacitors of 10nF ±10% are recommended for all DC accesses. ■ See application note AN0017 for details. Hybrid coupler 90° 1-2GHz Ref. : DSCHR3764-QEG1263 - 20 Sep 11 14/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Notes 16 15 NC GND 17 LO IN NC 19 18 GND NC NC Due to ESD protection circuits on RF and LO inputs, an external capacitance might be requested to isolate the product from external voltage that could be present on these accesses in the application. 14 13 IF_I 20 12 VD GND 21 11 VGM IF_Q 22 10 VDL NC 23 9 VGL NC 24 8 GC2 NC 5 6 7 GC3 NC 4 GND 3 RF IN 2 GND 1 NC X2 ESD protections are implemented on gate accesses. The DC connections do not include any decoupling capacitor in package, therefore it is mandatory to provide a good external DC decoupling on the PC board with SMT capacitor, as close as possible to the package. Recommended value is 10nF Ref. : DSCHR3764-QEG1263 - 20 Sep 11 15/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter DC Schematic LNA (4V, 75mA) VDL=4V 2k 45 17 22 16mA 310 26mA 33mA 64 3.4k 3.4k 3.3k 2.8k GC2 [-1.5;0.5V] GC3 [-1.5;0.5V] VGL~ -0.53V LO Buffer (4V, 245mA) VD= 4V Differential Amplifier Differential Multiplier 85mA Buffer 1 60mA Buffer 2 25mA 75mA 1k 25 960 5.5 8 1k 40 40 510 185 100 1.6k 15 16 960 510 725 25 5.5 220 100 40 15 190 100 Ref. : DSCHR3764-QEG1263 - 20 Sep 11 16/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Biasing Options In order to improve the conversion gain and the noise figure, the biasing could be tuned. VGL voltage allows controlling IDL current. Table below gives the typical value for main characteristics. Parameter VD=VDL= 4.0V IDL= 75mA VD=VDL= 4.5V IDL= 110mA Conversion Gain@min. att. (dB) Noise Figure@min. att. from 17 to 24GHz (dB) Input IP3@min. att. (dBm) VGL (V) ID (mA) ID + IDL (mA) Total DC power consumption (mW) 13 3.1 1 -0.6 245 320 1280 14 3.0 2 -0.4 250 360 1620 Ref. : DSCHR3764-QEG1263 - 20 Sep 11 17/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice CHR3764-QEG 21-27GHz Down-Converter Recommended package footprint Refer to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommendations. SMD mounting procedure For the mounting process standard techniques involving solder paste and a suitable reflow process can be used. For further details, see application note AN0017. Recommended environmental management Refer to the application note AN0019 available at http://www.ums-gaas.com for environmental data on UMS package products. Recommended ESD management Refer to the application note AN0020 available at http://www.ums-gaas.com for ESD sensitivity and handling recommendations for the UMS package products. Ordering Information QFN 4x5 RoHS compliant package: CHR3764-QEG/XY Stick: XY = 20 Tape & reel: XY = 21 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHR3764-QEG1263 - 20 Sep 11 18/18 Route Départementale 128, BP46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0) 1 69 33 03 08 - Fax: +33 (0) 1 69 33 03 09 Specifications subject to change without notice