VISHAY S2G

S2A THRU S2M
SURFACE MOUNT GLASS PASSIVATED SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 1.5 Amperes
FEATURES
DO-214AA
MODIFIED J-BEND
0.086 (2.20)
♦ Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦ For surface mounted applications
♦ Low profile package
♦ Built-in strain relief,
ideal for automated placement
♦ Glass passivated chip junction
♦ High temperature soldering:
250°C/10 seconds at terminals
0.155 (3.94)
0.130 (3.30)
0.077 (1.95)
0.180 (4.57)
0.160 (4.06)
0.012 (0.305)
0.006 (0.152)
MECHANICAL DATA
0.096 (2.44)
0.084 (2.13)
Case: JEDEC DO-214AA molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.003 ounce, 0.093 gram
0.008 (0.203)
MAX.
0.060 (1.52)
0.030 (0.76)
0.220 (5.59)
0.205 (5.21)
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
Device marking code
S2A
S2B
S2D
S2G
S2J
S2K
S2M
SA
SB
SD
SG
SJ
SK
SM
100
200
400
600
800
1000
Volts
Maximum repetitive peak reverse voltage
VRRM
50
Maximum RMS voltage
UNITS
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at TL=100°C
I(AV)
1.5
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) TL=100°C
IFSM
50.0
Amps
VF
1.15
Volts
IR
1.0
125.0
µA
Typical reverse recovery time (NOTE 1)
trr
2.0
µs
Typical junction capacitance (NOTE 2)
CJ
30.0
pF
RΘJA
RΘJL
53.0
16.0
°C/W
TJ, TSTG
-55 to +150
°C
Maximum instantaneous forward voltage at 1.5 A
Maximum DC reverse current
at Rated DC blocking voltage
TA=25°C
TA=125°C
Typical thermal resistance (NOTE 3)
Operating and storage temperature range
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and junction to lead
P.C.B. mounted on 0.27 x 0.27” (7.0 x 7.0mm) copper pad areas
4/98
RATINGS AND CHARACTERISTIC CURVES S2A THRU S2M
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
FIG. 1 - FORWARD CURRENT DERATING CURVE
1.5
PEAK FORWARD SURGE CURRENT,
MICROAMPERES
AVERAGE FORWARD CURRENT,
AMPERES
50
60 HZ RESISTIVE OR
INDUCTIVE LOAD
1.0
0.5
60 HZ RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED
0.27 x 0.27” (7.0 x 7.0mm)
COPPER PAD AREAS
0
50
60
70
80
90 100 110 120 130 140 150
TL=100°C
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
40
30
20
10
0
LEAD TEMPERATURE, °C
1
10
100
NUMBER OF CYCLES AT 60 HZ
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
10
INSTANTANEOUS FORWARD CURRENT,
AMPERES
TJ=25°C
PULSE WIDTH=300µs
1% DUTY CYCLE
1
0.1
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
10
TJ=125°C
TJ=100°C
1
0.1
TJ=25°C
0.01
0.01
0.4
0.6
0.8
1
1.0
1.2
1.4
1.6
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE, pF
100
TJ=25°C
f=1.0 MHZ
Vsig=50mVp-p
10
1
0.1
1
10
REVERSE VOLTAGE, VOLTS
100
0
20
40
60
80
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
100