CURRENT 1.0 Ampere VOLTAGE 50 to 800 Volts RS1A THRU RS1K Features · For surface mounted applications in order optimize board space · Low profile package · Built-in strain relief, ideal for automated placement · Fast switching speed · Plastic package has Unerwrites Laboratory Flammability Classification 94V-0 · Low forward voltage drop · Glass passivated chip junction · High temperature soldering : 250℃/10 seconds, at terminals DO-214AC (SMA) 0.110(2.79) 0.100(2.54) 0.058(1.47) 0.052(1.32) 0.177(4.50) 0.157(3.99) 0.012(0.31) 0.006(0.15) 0.090(2.29) 0.078(1.98) Mechanical Data · Case : JEDEC SMA(DO-214AC) molded plastic body · Terminals : Solder plated solderable per MIL-STD-750, method 2026 · Polarity : Color band denotes cathode end · Mounting Position : Any · Weight : 0.002 ounce, 0.064 gram 0.005(0.127) MAX. 0.060(1.52) 0.030(0.76) 0.208(5.28) 0.194(4.93) Dimensions in inches and (millimeters) Maximum Ratings And Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) Symbols RS1A RS1B RS1D RS1G RS1J RS1K Units Maximum recurrent peak reverse voltage VRRM 50 100 200 400 600 800 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 Volts Maximum average forward rectified current at TL=90℃ I(AV) 1.0 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC method) at TL=90℃ IFSM 30.0 Amps Maximum instantaneous forward voltage at 1.0A VF 1.30 Volts Maximum DC reverse current TA=25℃ at rated DC blocking voltage TA=125℃ IR Maximum reverse recovery time (Note 1) Typical thermal resistance (Note 3) Typical junction capacitance (Note 2) Operating junction and storage temperature range trr 5.0 150 250 RθJL RθJA CJ TJ TSTG μA 50 500 35.0 105.0 10.0 -55 to +150 Notes: (1) Test conditions: IF=0.5A, IR=1.0A, Irr=0.25A. (2) Measured at 1MHz and applied reverse voltage of 4.0 Volts. (3) Thermal resistance from junction to ambient and from junction to lead mounted on PCB mounted on 0.2×0.2"(5.0×5.0mm) copper pad areas ns ℃/W 7.0 pF ℃ RATINGS AND CHARACTERISTIC CURVES RS1A THRU RS1K FIG.2-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT AVERAGE FORWARD CURRENT (A) 1.2 RESISTIVE OR INDUCTIVE LOAD 1.0 0.5 P.C.B.MOUNTED ON 0.2X0.2" (5.0X5.0mm) COPPER PAD AREAS 0 0 20 40 60 80 100 120 140 160 180 50 PEAK FORWARD SURGE CURRENT(AMPERES) FIG.1-FORWARD CURRENT DERATING CURVE TL=90℃ 8.3m SINGLE HALF SINE WAVE (JEDEC Method) 40 30 20 10 LEAD TEMPERATURE ( ℃) 0 1 4 6 8 10 20 40 60 100 NUMBER OF CYCLES AT 60Hz FIG.3-TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.4-TYPICAL JUNCTION CAPACITANCE 20 10 30 JUNCTION CAPACITANCE (pF) INSTANTANEOUS FORWARD CURRENT(AMPERES) 2 TJ=125℃ 1 TJ=25℃ TJ=25℃ f=1.0MHz Vsig=50mVp-p 10 0.1 1 1 100 10 PULSE WIDTH=300ms REVERSE VOLTAGE. (V) 1% DUTY CYCLE 0.01 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 INSTANTANEOUS FORWARD VOLTAGE (VOLTS) FIG.5-TYPICAL REVERSE CHARACTERISTICS FIG.6-TYPICAL TRANSIENT THERMAL IMPEDANCE 20 10 100 TRANSIENT THERMAL IMPEDANCE (℃/W) INSTANTANEOUS REVERSE CURRENT MICROAMPERES TJ=125℃ 1 TJ=100℃ 0.1 TJ=25℃ 0.01 0 20 40 60 80 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) MOUNTED ON 0.2X0.2" (5X5mm) COPPER PAD AREA 10 1 0.01 100 0.1 t,PULSE DURATION,sec 1 10