ZMD-Standard April 2002 Package LQFP44 (10 x 10) MDS 758 Supersedes Edition 12.99 Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions A A2 Z 0,1 44 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 enom 0,80 Amin - Amax 1,60 A1min 0,05 bPmin 0,30 A1max 0,15 bPmax 0,45 A2min 1,35 HEmin 11,85 A2max 1,45 HEmax 12,15 cmin 0,09 HDmin 11,85 cmax 0,20 HDmax 12,15 Dmin* 9,75 LPmin 0,45 Dmax* 10,25 2 Weight £ 0,5 g Emin* 9,75 3 Package Body Material Low Stress Epoxy Emax* 10,25 4 Lead Material FeNi-Alloy or Cu-Alloy qmin 0° 5 Lead Finish solder plating qmax 7° 6 Lead Form Z-bends * without mold-flas Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.04.2002 Check signed Marx Quality signed Gersdorf: Doc-No. QS-000758-HD-02 G c A1 HE Lp e E bp 0,2 M Detail Z ZMD-Standard April 2002 Package LQFP44 (10 x 10) MDS 758 Supersedes Edition 12.99 Dimensions in millimetres Based on JEDEC JEP95: MS-026 1 Dimensions A A2 Z 0,1 44 1 D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 enom 0,80 Amin - Amax 1,60 A1min 0,05 bPmin 0,30 A1max 0,15 bPmax 0,45 A2min 1,35 HEmin 11,85 A2max 1,45 HEmax 12,15 cmin 0,09 HDmin 11,85 cmax 0,20 HDmax 12,15 Dmin* 9,75 LPmin 0,45 Dmax* 10,25 2 Weight £ 0,5 g Emin* 9,75 3 Package Body Material Low Stress Epoxy Emax* 10,25 4 Lead Material FeNi-Alloy or Cu-Alloy qmin 0° 5 Lead Finish solder plating qmax 7° 6 Lead Form Z-bends * without mold-flas Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Date: 30.04.2002 Check signed Marx Quality signed Gersdorf: Doc-No. QS-000758-HD-02 G c A1 HE Lp e E bp 0,2 M Detail Z