ZMD MDS758

ZMD-Standard
April 2002
Package LQFP44
(10 x 10)
MDS
758
Supersedes
Edition 12.99
Dimensions in millimetres
Based on JEDEC JEP95: MS-026
1 Dimensions
A
A2
Z
0,1
44
1
D
HD
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
enom
0,80
Amin
-
Amax
1,60
A1min
0,05
bPmin
0,30
A1max
0,15
bPmax
0,45
A2min
1,35
HEmin
11,85
A2max
1,45
HEmax
12,15
cmin
0,09
HDmin
11,85
cmax
0,20
HDmax
12,15
Dmin*
9,75
LPmin
0,45
Dmax*
10,25
2 Weight
£ 0,5 g
Emin*
9,75
3 Package Body Material
Low Stress Epoxy
Emax*
10,25
4 Lead Material
FeNi-Alloy or Cu-Alloy
qmin
0°
5 Lead Finish
solder plating
qmax
7°
6 Lead Form
Z-bends
* without mold-flas
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Date: 30.04.2002
Check signed Marx
Quality signed Gersdorf:
Doc-No.
QS-000758-HD-02
G
c
A1
HE
Lp
e
E
bp
0,2 M
Detail Z
ZMD-Standard
April 2002
Package LQFP44
(10 x 10)
MDS
758
Supersedes
Edition 12.99
Dimensions in millimetres
Based on JEDEC JEP95: MS-026
1 Dimensions
A
A2
Z
0,1
44
1
D
HD
Dimensions of Sub-Group B1
Dimensions of Sub-Group C1
enom
0,80
Amin
-
Amax
1,60
A1min
0,05
bPmin
0,30
A1max
0,15
bPmax
0,45
A2min
1,35
HEmin
11,85
A2max
1,45
HEmax
12,15
cmin
0,09
HDmin
11,85
cmax
0,20
HDmax
12,15
Dmin*
9,75
LPmin
0,45
Dmax*
10,25
2 Weight
£ 0,5 g
Emin*
9,75
3 Package Body Material
Low Stress Epoxy
Emax*
10,25
4 Lead Material
FeNi-Alloy or Cu-Alloy
qmin
0°
5 Lead Finish
solder plating
qmax
7°
6 Lead Form
Z-bends
* without mold-flas
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Date: 30.04.2002
Check signed Marx
Quality signed Gersdorf:
Doc-No.
QS-000758-HD-02
G
c
A1
HE
Lp
e
E
bp
0,2 M
Detail Z